CA2014296A1 - Circuit integre - Google Patents
Circuit integreInfo
- Publication number
- CA2014296A1 CA2014296A1 CA2014296A CA2014296A CA2014296A1 CA 2014296 A1 CA2014296 A1 CA 2014296A1 CA 2014296 A CA2014296 A CA 2014296A CA 2014296 A CA2014296 A CA 2014296A CA 2014296 A1 CA2014296 A1 CA 2014296A1
- Authority
- CA
- Canada
- Prior art keywords
- integrated circuit
- fet
- conductivity type
- depletion
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
- H10D64/668—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers the layer being a silicide, e.g. TiSi2
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10215689 | 1989-04-21 | ||
| JP102156/1989 | 1989-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2014296A1 true CA2014296A1 (fr) | 1990-10-21 |
| CA2014296C CA2014296C (fr) | 2000-08-01 |
Family
ID=14319867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002014296A Expired - Fee Related CA2014296C (fr) | 1989-04-21 | 1990-04-10 | Circuit integre |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH0348460A (fr) |
| CA (1) | CA2014296C (fr) |
| DE (1) | DE4012681A1 (fr) |
| FR (1) | FR2646289A1 (fr) |
| GB (1) | GB2231720B (fr) |
| NL (1) | NL9000949A (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2243948B (en) * | 1990-04-20 | 1994-06-08 | Nobuo Mikoshiba | Integrated circuit |
| JPH1168105A (ja) * | 1997-08-26 | 1999-03-09 | Mitsubishi Electric Corp | 半導体装置 |
| US7064050B2 (en) * | 2003-11-28 | 2006-06-20 | International Business Machines Corporation | Metal carbide gate structure and method of fabrication |
| US7667277B2 (en) * | 2005-01-13 | 2010-02-23 | International Business Machines Corporation | TiC as a thermally stable p-metal carbide on high k SiO2 gate stacks |
| EP2064744A2 (fr) | 2006-09-19 | 2009-06-03 | QuNano AB | Ensemble de transistors à effet de champ réduits à l'échelle nanométrique |
| JP2022175792A (ja) * | 2021-05-14 | 2022-11-25 | 国立大学法人東京工業大学 | 半導体装置および浮遊ゲートデバイスの製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2012712B2 (de) * | 1970-03-17 | 1972-11-02 | Siemens AG, 1000 Berlin und 8000 München | Integrierte bistabile kippschaltung mit feldeffekttransistoren |
| JPS5214383A (en) * | 1975-07-24 | 1977-02-03 | Fujitsu Ltd | Mis-type semiconductor device |
| JPS56165358A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
| JPS56165359A (en) * | 1980-05-23 | 1981-12-18 | Nec Corp | Semiconductor device |
| JPS57128967A (en) * | 1981-02-02 | 1982-08-10 | Nec Corp | Integrated semiconductor device |
| JPS5925273A (ja) * | 1982-08-03 | 1984-02-09 | Toshiba Corp | 半導体装置及びその製造方法 |
| JPS59168666A (ja) * | 1983-03-15 | 1984-09-22 | Toshiba Corp | 半導体装置 |
| DE3330851A1 (de) * | 1983-08-26 | 1985-03-14 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von hochintegrierten komplementaeren mos-feldeffekttransistorschaltungen |
| JPS60100474A (ja) * | 1983-11-04 | 1985-06-04 | Shindengen Electric Mfg Co Ltd | 半導体圧力センサ |
| JPS60100473A (ja) * | 1983-11-05 | 1985-06-04 | Mitsubishi Electric Corp | 電界効果トランジスタ |
| JPS61137317A (ja) * | 1984-12-10 | 1986-06-25 | Agency Of Ind Science & Technol | 半導体装置用電極材料 |
| JPS62219966A (ja) * | 1986-03-22 | 1987-09-28 | Toshiba Corp | 半導体装置 |
| JPS63113895A (ja) * | 1986-10-30 | 1988-05-18 | Nec Corp | Mos型半導体集積回路装置 |
-
1990
- 1990-04-10 CA CA002014296A patent/CA2014296C/fr not_active Expired - Fee Related
- 1990-04-17 GB GB9008525A patent/GB2231720B/en not_active Expired - Fee Related
- 1990-04-20 DE DE4012681A patent/DE4012681A1/de not_active Withdrawn
- 1990-04-20 NL NL9000949A patent/NL9000949A/nl not_active Application Discontinuation
- 1990-04-20 JP JP2105038A patent/JPH0348460A/ja active Pending
- 1990-04-20 FR FR9005083A patent/FR2646289A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0348460A (ja) | 1991-03-01 |
| GB2231720B (en) | 1993-08-11 |
| GB2231720A (en) | 1990-11-21 |
| NL9000949A (nl) | 1990-11-16 |
| CA2014296C (fr) | 2000-08-01 |
| DE4012681A1 (de) | 1990-10-25 |
| FR2646289B1 (fr) | 1994-08-19 |
| FR2646289A1 (fr) | 1990-10-26 |
| GB9008525D0 (en) | 1990-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |