CA2035694C - Composite dielectric and printed-circuit use substrate utilizing the same - Google Patents

Composite dielectric and printed-circuit use substrate utilizing the same

Info

Publication number
CA2035694C
CA2035694C CA 2035694 CA2035694A CA2035694C CA 2035694 C CA2035694 C CA 2035694C CA 2035694 CA2035694 CA 2035694 CA 2035694 A CA2035694 A CA 2035694A CA 2035694 C CA2035694 C CA 2035694C
Authority
CA
Canada
Prior art keywords
dielectric
porous
composite dielectric
particles
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA 2035694
Other languages
English (en)
French (fr)
Other versions
CA2035694A1 (en
Inventor
Kazunobu Abe
Masashi Aoki
Seishiro Yamakawa
Michimasa Tsuzaki
Kiyotaka Komori
Satoshi Fujiki
Akiyoshi Nozue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Sakai Chemical Industry Co Ltd
Original Assignee
Sakai Chemical Industry Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sakai Chemical Industry Co Ltd, Matsushita Electric Works Ltd filed Critical Sakai Chemical Industry Co Ltd
Publication of CA2035694A1 publication Critical patent/CA2035694A1/en
Application granted granted Critical
Publication of CA2035694C publication Critical patent/CA2035694C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249975—Void shape specified [e.g., crushed, flat, round, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
CA 2035694 1990-02-06 1991-02-05 Composite dielectric and printed-circuit use substrate utilizing the same Expired - Lifetime CA2035694C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP26906/90 1990-02-06
JP2690690 1990-02-06
JP2690790 1990-02-06
JP26907/90 1990-02-06

Publications (2)

Publication Number Publication Date
CA2035694A1 CA2035694A1 (en) 1991-08-07
CA2035694C true CA2035694C (en) 1998-04-28

Family

ID=26364760

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2035694 Expired - Lifetime CA2035694C (en) 1990-02-06 1991-02-05 Composite dielectric and printed-circuit use substrate utilizing the same

Country Status (4)

Country Link
US (1) US5275878A (2)
EP (1) EP0441441B1 (2)
CA (1) CA2035694C (2)
DE (1) DE69123470T2 (2)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110649A (en) * 1997-11-19 2000-08-29 International Business Machines Corporation Process for manufacture of integrated circuit device
US20030059366A1 (en) * 2001-09-21 2003-03-27 Cabot Corporation Dispersible barium titanate-based particles and methods of forming the same
US20030215606A1 (en) * 2002-05-17 2003-11-20 Clancy Donald J. Dispersible dielectric particles and methods of forming the same
CN100582167C (zh) * 2003-09-30 2010-01-20 株式会社日本触媒 复合电介质用树脂组合物及复合电介质、使用该电介质的电路基板
EP1863038B1 (en) * 2005-03-23 2010-09-08 Murata Manufacturing Co., Ltd. Composite dielectric sheet, method for manufacturing same and multilayer electronic component
US20070087061A1 (en) * 2005-10-14 2007-04-19 Medafor, Incorporated Method and composition for creating and/or activating a platelet-rich gel by contact with a porous particulate material, for use in wound care, tissue adhesion, or as a matrix for delivery of therapeutic components
US20070086958A1 (en) * 2005-10-14 2007-04-19 Medafor, Incorporated Formation of medically useful gels comprising microporous particles and methods of use
US20130149514A1 (en) * 2010-07-30 2013-06-13 Kyocera Corporation Insulating sheet, method of manufacturing the same, and method of manufacturing structure using the insulating sheet
JP5337316B2 (ja) 2012-01-30 2013-11-06 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 高誘電絶縁性樹脂組成物
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9693451B2 (en) 2012-02-23 2017-06-27 Kyocera Corporation Wiring board, mounting structure using same, and method of manufacturing wiring board
TWI464213B (zh) * 2013-03-07 2014-12-11 Taiwan Union Technology Corp 樹脂組合物及其應用
WO2018037912A1 (ja) * 2016-08-22 2018-03-01 株式会社大阪ソーダ 光硬化性樹脂組成物、インキ及び塗料
KR102025337B1 (ko) * 2019-03-15 2019-09-25 국방과학연구소 세라믹 폴리머 혼합 코팅층을 포함하는 커패시터용 유전체 박막 및 이의 제조 방법
DE102021117278B4 (de) 2021-07-05 2023-05-04 Lisa Dräxlmaier GmbH Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU374665A1 (ru) * 1971-08-12 1973-03-20 Высокочастотный диэлектрический материал
US4518737A (en) * 1978-12-26 1985-05-21 Rogers Corporation Dielectric material and method of making the dielectric material
US4227111A (en) * 1979-03-28 1980-10-07 The United States Of America As Represented By The Secretary Of The Navy Flexible piezoelectric composite transducers
US4330593A (en) * 1980-11-13 1982-05-18 The United States Of America As Represented By The Secretary Of The Navy PZT/Polymer composites and their fabrication
DE3430161A1 (de) * 1984-08-16 1986-02-27 Siemens AG, 1000 Berlin und 8000 München Poroese anpassungsschicht in einem ultraschallapplikator
CA1285675C (en) * 1985-03-25 1991-07-02 Takaaki Sakamoto Method of preparing polyphenylene oxide composition and laminate using the composition
GB2200128B (en) * 1986-12-23 1990-08-29 Matsushita Electric Works Ltd Crosslinkable polyphenylene oxide resin composition
JPH0747645B2 (ja) * 1988-04-19 1995-05-24 帝人株式会社 熱可塑性重合体フィルム
US4874030A (en) * 1989-03-22 1989-10-17 Air Products And Chemicals, Inc. Blends of poly(propylene carbonate) and poly(methyl methacrylate) and their use in decomposition molding

Also Published As

Publication number Publication date
US5275878A (en) 1994-01-04
CA2035694A1 (en) 1991-08-07
DE69123470D1 (de) 1997-01-23
DE69123470T2 (de) 1997-04-17
EP0441441A2 (en) 1991-08-14
EP0441441B1 (en) 1996-12-11
EP0441441A3 (2) 1994-04-06

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202