CA2407800C - Composition de polissage - Google Patents
Composition de polissage Download PDFInfo
- Publication number
- CA2407800C CA2407800C CA 2407800 CA2407800A CA2407800C CA 2407800 C CA2407800 C CA 2407800C CA 2407800 CA2407800 CA 2407800 CA 2407800 A CA2407800 A CA 2407800A CA 2407800 C CA2407800 C CA 2407800C
- Authority
- CA
- Canada
- Prior art keywords
- colloidal silica
- particle
- particle size
- group
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 137
- 239000000203 mixture Substances 0.000 title claims abstract description 105
- 239000002245 particle Substances 0.000 claims abstract description 213
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 173
- 239000008119 colloidal silica Substances 0.000 claims abstract description 87
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 40
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 40
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 40
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 40
- 238000009826 distribution Methods 0.000 claims abstract description 37
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 13
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 76
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 32
- 229910052757 nitrogen Inorganic materials 0.000 claims description 30
- 238000001179 sorption measurement Methods 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 25
- 239000011164 primary particle Substances 0.000 claims description 25
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims description 24
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims description 16
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 14
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 13
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 8
- 239000004310 lactic acid Substances 0.000 claims description 7
- 235000014655 lactic acid Nutrition 0.000 claims description 7
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 6
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 6
- 150000002506 iron compounds Chemical class 0.000 claims description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims description 4
- 235000015165 citric acid Nutrition 0.000 claims description 4
- 239000000174 gluconic acid Substances 0.000 claims description 4
- 235000012208 gluconic acid Nutrition 0.000 claims description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 4
- 239000011976 maleic acid Substances 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 3
- NLXYLZCLIHHPMA-UHFFFAOYSA-K aluminum;trisulfamate Chemical compound [Al+3].NS([O-])(=O)=O.NS([O-])(=O)=O.NS([O-])(=O)=O NLXYLZCLIHHPMA-UHFFFAOYSA-K 0.000 claims description 3
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims description 3
- 229910000360 iron(III) sulfate Inorganic materials 0.000 claims description 3
- RZEWPBTZTSBBAK-UHFFFAOYSA-J potassium;iron(3+);disulfate Chemical compound [K+].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RZEWPBTZTSBBAK-UHFFFAOYSA-J 0.000 claims description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 description 31
- 239000004065 semiconductor Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011034 rock crystal Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 235000010980 cellulose Nutrition 0.000 description 2
- HSJPMRKMPBAUAU-UHFFFAOYSA-N cerium(3+);trinitrate Chemical compound [Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O HSJPMRKMPBAUAU-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 101000941356 Nostoc ellipsosporum Cyanovirin-N Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- -1 aluminum compound Chemical class 0.000 description 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
- 229940010552 ammonium molybdate Drugs 0.000 description 1
- 235000018660 ammonium molybdate Nutrition 0.000 description 1
- 239000011609 ammonium molybdate Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- BUACSMWVFUNQET-UHFFFAOYSA-H dialuminum;trisulfate;hydrate Chemical compound O.[Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BUACSMWVFUNQET-UHFFFAOYSA-H 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052598 goethite Inorganic materials 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- AEIXRCIKZIZYPM-UHFFFAOYSA-M hydroxy(oxo)iron Chemical compound [O][Fe]O AEIXRCIKZIZYPM-UHFFFAOYSA-M 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- UJVRJBAUJYZFIX-UHFFFAOYSA-N nitric acid;oxozirconium Chemical compound [Zr]=O.O[N+]([O-])=O.O[N+]([O-])=O UJVRJBAUJYZFIX-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
L'invention concerne des disques durs en aluminium et en verre. Ces disques, qui présentent une ondulation moyenne inférieure à 3 angströms, sont prévus pour augmenter la densité de capacité de mémoire. La présente invention concerne également des compositions de polissage grâce auxquelles les surfaces des disques peuvent être polies de manière régulière. Lesdites compositions de polissage conviennent aux disques ou substrats en aluminium présentant de la silice sur leur surface. Ces compositions contiennent des groupes de particules de silice colloïdales de tailles différentes et d'une concentration de SiO2 comprise entre 0,5 et 50 % en poids.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002607856A CA2607856C (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-139671 | 2000-05-12 | ||
| JP2000139671 | 2000-05-12 | ||
| PCT/JP2001/003818 WO2001085868A1 (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002607856A Division CA2607856C (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2407800A1 CA2407800A1 (fr) | 2001-11-15 |
| CA2407800C true CA2407800C (fr) | 2008-08-05 |
Family
ID=18647077
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002607856A Expired - Fee Related CA2607856C (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
| CA 2407800 Expired - Fee Related CA2407800C (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002607856A Expired - Fee Related CA2607856C (fr) | 2000-05-12 | 2001-05-07 | Composition de polissage |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6719819B2 (fr) |
| EP (2) | EP1287088B1 (fr) |
| JP (2) | JP4450142B2 (fr) |
| KR (2) | KR100826072B1 (fr) |
| CN (1) | CN1200066C (fr) |
| CA (2) | CA2607856C (fr) |
| MY (1) | MY130609A (fr) |
| TW (1) | TW538111B (fr) |
| WO (1) | WO2001085868A1 (fr) |
Families Citing this family (57)
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| TWI307712B (en) * | 2002-08-28 | 2009-03-21 | Kao Corp | Polishing composition |
| US7553345B2 (en) | 2002-12-26 | 2009-06-30 | Kao Corporation | Polishing composition |
| JP3997152B2 (ja) * | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
| MY134679A (en) * | 2002-12-26 | 2007-12-31 | Kao Corp | Polishing composition |
| TWI254741B (en) * | 2003-02-05 | 2006-05-11 | Kao Corp | Polishing composition |
| JP2004331852A (ja) * | 2003-05-09 | 2004-11-25 | Tama Kagaku Kogyo Kk | 分散安定性に優れた研磨剤スラリー及び基板の製造方法 |
| GB2402941B (en) * | 2003-06-09 | 2007-06-27 | Kao Corp | Method for manufacturing substrate |
| KR20030061746A (ko) * | 2003-06-23 | 2003-07-22 | 신세현 | 혈구 유변계 |
| ES2436215T3 (es) * | 2003-07-11 | 2013-12-27 | W.R. Grace & Co. - Conn. | Partículas abrasivas para pulido químico-mecánico |
| JP4608196B2 (ja) * | 2003-09-30 | 2011-01-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| KR100850877B1 (ko) | 2004-06-18 | 2008-08-07 | 주식회사 동진쎄미켐 | 철 함유 콜로이달 실리카를 포함하는 화학 기계적 연마슬러리 조성물 |
| KR101167869B1 (ko) * | 2004-06-22 | 2012-07-23 | 아사히 가라스 가부시키가이샤 | 유리 기판의 연마 방법 및 유리 기판 |
| EP1758962B1 (fr) * | 2004-06-22 | 2013-10-30 | Asahi Glass Company, Limited | Substrat de verre et mode de polissage |
| JP5090633B2 (ja) * | 2004-06-22 | 2012-12-05 | 旭硝子株式会社 | ガラス基板の研磨方法 |
| JP4761901B2 (ja) * | 2004-09-22 | 2011-08-31 | Ｈｏｙａ株式会社 | マスクブランクス用基板の製造方法、マスクブランクスの製造方法、露光用マスクの製造方法、反射型マスクの製造方法及び半導体装置の製造方法 |
| US20060196849A1 (en) * | 2005-03-04 | 2006-09-07 | Kevin Moeggenborg | Composition and method for polishing a sapphire surface |
| JP2007179612A (ja) * | 2005-12-27 | 2007-07-12 | Kao Corp | 磁気ディスク基板用研磨液組成物 |
| TWI411667B (zh) * | 2006-04-28 | 2013-10-11 | Kao Corp | 磁碟基板用之研磨液組成物 |
| GB2454343B (en) | 2007-10-29 | 2012-07-11 | Kao Corp | Polishing composition for hard disk substrate |
| JP2009163810A (ja) * | 2007-12-28 | 2009-07-23 | Kao Corp | ハードディスク基板の製造方法 |
| JP5407555B2 (ja) * | 2008-06-11 | 2014-02-05 | 信越化学工業株式会社 | 合成石英ガラス基板用研磨剤 |
| MY155533A (en) | 2008-06-11 | 2015-10-30 | Shinetsu Chemical Co | Polishing agent for synthetic quartz glass substrate |
| JP5396047B2 (ja) * | 2008-09-03 | 2014-01-22 | 三井金属鉱業株式会社 | ガラス用研摩材スラリー |
| GB2477067B (en) * | 2008-11-06 | 2012-10-17 | Kao Corp | Polishing liquid composition for magnetic disk substrate |
| JP2009187657A (ja) * | 2009-04-02 | 2009-08-20 | Kao Corp | 基板の製造方法 |
| JP4941501B2 (ja) * | 2009-04-20 | 2012-05-30 | 旭硝子株式会社 | ガラス基板用研磨液及びその製造方法、並びに前記研磨液を用いたガラス基板の研磨方法及び前記研磨方法により得られたガラス基板 |
| CN101693813B (zh) * | 2009-09-01 | 2013-04-10 | 湖南皓志新材料股份有限公司 | 一种硅基精抛液 |
| JP5251861B2 (ja) * | 2009-12-28 | 2013-07-31 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
| CN102115633A (zh) * | 2009-12-30 | 2011-07-06 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| WO2012005142A1 (fr) * | 2010-07-09 | 2012-01-12 | 旭硝子株式会社 | Agent de polissage et procédé de polissage |
| JP5168387B2 (ja) * | 2011-06-08 | 2013-03-21 | 旭硝子株式会社 | 磁気記録媒体用ガラス基板の製造方法 |
| CN102358825B (zh) * | 2011-08-05 | 2013-08-21 | 清华大学 | 一种用于蓝宝石晶片的抛光组合物 |
| JP6266504B2 (ja) * | 2012-02-29 | 2018-01-24 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法 |
| KR102105844B1 (ko) | 2012-08-24 | 2020-04-29 | 에코랍 유에스에이 인코퍼레이티드 | 사파이어 표면 폴리싱 방법 |
| EP2915859A4 (fr) * | 2012-10-31 | 2015-10-28 | Fujimi Inc | Composition de polissage |
| CN105189043B (zh) * | 2013-03-15 | 2019-11-08 | 艺康美国股份有限公司 | 抛光蓝宝石表面的方法 |
| JP6156207B2 (ja) | 2013-04-02 | 2017-07-05 | 信越化学工業株式会社 | 合成石英ガラス基板の製造方法 |
| US9633831B2 (en) * | 2013-08-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same |
| CN104745084B (zh) * | 2013-12-25 | 2018-09-14 | 安集微电子（上海）有限公司 | 一种用于铝的化学机械抛光液及使用方法 |
| JP6373069B2 (ja) * | 2014-05-30 | 2018-08-15 | 山口精研工業株式会社 | 精密研磨剤組成物 |
| JP6316680B2 (ja) * | 2014-06-30 | 2018-04-25 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| US9551075B2 (en) * | 2014-08-04 | 2017-01-24 | Sinmat, Inc. | Chemical mechanical polishing of alumina |
| CN104559798B (zh) * | 2014-12-24 | 2017-08-29 | 上海新安纳电子科技有限公司 | 一种氧化铝基化学机械抛光液 |
| CN104893587A (zh) * | 2015-03-09 | 2015-09-09 | 江苏中晶科技有限公司 | 高效c向蓝宝石抛光液及其制备方法 |
| WO2016194614A1 (fr) * | 2015-06-03 | 2016-12-08 | 株式会社フジミインコーポレーテッド | Composition de polissage, procédé de polissage, et procédé de production |
| CN104907895B (zh) * | 2015-06-16 | 2017-09-29 | 哈尔滨秋冠光电科技有限公司 | 蓝宝石双抛片的快速加工方法 |
| US10144850B2 (en) * | 2015-09-25 | 2018-12-04 | Versum Materials Us, Llc | Stop-on silicon containing layer additive |
| JP6584945B2 (ja) * | 2015-12-14 | 2019-10-02 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| JP7032327B2 (ja) * | 2016-05-19 | 2022-03-08 | ドンジン セミケム カンパニー リミテッド | 化学－機械的研磨用スラリー組成物 |
| JP6706149B2 (ja) * | 2016-06-08 | 2020-06-03 | 山口精研工業株式会社 | 研磨剤組成物 |
| US10377014B2 (en) | 2017-02-28 | 2019-08-13 | Ecolab Usa Inc. | Increased wetting of colloidal silica as a polishing slurry |
| US20210130176A1 (en) * | 2017-10-11 | 2021-05-06 | Applied Material Solutions, Inc. | Multimodal Particles for Retention and Drainage for Paper-Making Machines |
| CN108081117A (zh) * | 2017-11-29 | 2018-05-29 | 浙江工业大学 | 一种基于软质磨料固着磨具的钽酸锂抛光方法 |
| CN109988509B (zh) * | 2017-12-29 | 2021-07-09 | 浙江新创纳电子科技有限公司 | 一种钽酸锂还原片抛光液及其制备方法和用途 |
| JP7384725B2 (ja) * | 2020-03-25 | 2023-11-21 | 山口精研工業株式会社 | 研磨剤組成物 |
| JP7662350B2 (ja) * | 2021-02-15 | 2025-04-15 | 花王株式会社 | 磁気ディスク用シリカ分散液の製造方法 |
| CN114536208B (zh) * | 2022-01-13 | 2023-05-09 | 北京通美晶体技术股份有限公司 | 一种磷化铟研磨工艺与磷化铟 |
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| US6258140B1 (en) * | 1999-09-27 | 2001-07-10 | Fujimi America Inc. | Polishing composition |
| US6527817B1 (en) * | 1999-11-15 | 2003-03-04 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
| US6454820B2 (en) * | 2000-02-03 | 2002-09-24 | Kao Corporation | Polishing composition |
-
2001
- 2001-05-07 EP EP01926131A patent/EP1287088B1/fr not_active Expired - Lifetime
- 2001-05-07 KR KR1020077016893A patent/KR100826072B1/ko not_active Expired - Fee Related
- 2001-05-07 WO PCT/JP2001/003818 patent/WO2001085868A1/fr not_active Ceased
- 2001-05-07 CA CA002607856A patent/CA2607856C/fr not_active Expired - Fee Related
- 2001-05-07 CN CNB018093949A patent/CN1200066C/zh not_active Expired - Fee Related
- 2001-05-07 EP EP08169757A patent/EP2045307A1/fr not_active Withdrawn
- 2001-05-07 KR KR1020027015200A patent/KR100803876B1/ko not_active Expired - Fee Related
- 2001-05-07 CA CA 2407800 patent/CA2407800C/fr not_active Expired - Fee Related
- 2001-05-09 MY MYPI20012153 patent/MY130609A/en unknown
- 2001-05-09 TW TW090111054A patent/TW538111B/zh not_active IP Right Cessation
- 2001-05-09 JP JP2001138133A patent/JP4450142B2/ja not_active Expired - Fee Related
-
2002
- 2002-10-28 US US10/281,104 patent/US6719819B2/en not_active Expired - Fee Related
-
2009
- 2009-11-25 JP JP2009267655A patent/JP5177445B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2607856A1 (fr) | 2001-11-15 |
| JP5177445B2 (ja) | 2013-04-03 |
| TW538111B (en) | 2003-06-21 |
| KR20070087204A (ko) | 2007-08-27 |
| JP4450142B2 (ja) | 2010-04-14 |
| US6719819B2 (en) | 2004-04-13 |
| CA2407800A1 (fr) | 2001-11-15 |
| EP1287088A1 (fr) | 2003-03-05 |
| KR100803876B1 (ko) | 2008-02-14 |
| US20030110711A1 (en) | 2003-06-19 |
| EP1287088B1 (fr) | 2011-10-05 |
| KR20030003280A (ko) | 2003-01-09 |
| EP2045307A1 (fr) | 2009-04-08 |
| CA2607856C (fr) | 2009-10-20 |
| WO2001085868A1 (fr) | 2001-11-15 |
| JP2010042509A (ja) | 2010-02-25 |
| JP2002030274A (ja) | 2002-01-31 |
| EP1287088A4 (fr) | 2008-04-16 |
| KR100826072B1 (ko) | 2008-04-29 |
| CN1200066C (zh) | 2005-05-04 |
| CN1434846A (zh) | 2003-08-06 |
| MY130609A (en) | 2007-07-31 |
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