CA2450258A1 - Procede de regeneration pour solution de placage - Google Patents
Procede de regeneration pour solution de placage Download PDFInfo
- Publication number
- CA2450258A1 CA2450258A1 CA002450258A CA2450258A CA2450258A1 CA 2450258 A1 CA2450258 A1 CA 2450258A1 CA 002450258 A CA002450258 A CA 002450258A CA 2450258 A CA2450258 A CA 2450258A CA 2450258 A1 CA2450258 A1 CA 2450258A1
- Authority
- CA
- Canada
- Prior art keywords
- metal
- tin
- ions
- oxidation state
- auxiliary cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007747 plating Methods 0.000 title claims abstract description 83
- 238000011069 regeneration method Methods 0.000 title claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 129
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 54
- 230000008929 regeneration Effects 0.000 claims abstract description 33
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 31
- 230000003647 oxidation Effects 0.000 claims abstract description 30
- 238000000151 deposition Methods 0.000 claims abstract description 27
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 26
- 230000001172 regenerating effect Effects 0.000 claims abstract description 6
- 150000002500 ions Chemical class 0.000 claims description 74
- 239000010949 copper Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000003011 anion exchange membrane Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000003014 ion exchange membrane Substances 0.000 claims description 2
- 239000012466 permeate Substances 0.000 claims 1
- -1 tin (II) ions Chemical class 0.000 abstract description 11
- 238000001465 metallisation Methods 0.000 abstract 1
- 229910001432 tin ion Inorganic materials 0.000 abstract 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 26
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 25
- 150000001875 compounds Chemical class 0.000 description 16
- 150000003839 salts Chemical class 0.000 description 11
- 238000004090 dissolution Methods 0.000 description 10
- 229910001128 Sn alloy Inorganic materials 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
- 239000004202 carbamide Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 3
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 2
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 229940079864 sodium stannate Drugs 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003585 thioureas Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
L'invention concerne un procédé de dépôt d'une couche de métal ainsi qu'un procédé de régénération d'une solution contenant des ions métalliques présentant une oxydation avancée. Pour régénérer les ions d'étain consumés à partir d'une solution de placage à l'étain par dépôt métallique, la technique actuelle consiste à déposer la solution de placage sur un étain métallique en vue d'entraîner la formation d'ions d'étain (II). Or, on a observé que la quantité d'étain contenu dans les bains ainsi régénérés augmente lentement de manière continue. La solution à ce problème consiste à utiliser une cellule de régénération électrolytique dotée d'au moins une cathode auxiliaire et d'au moins une anode auxiliaire. L'étain destiné à une régénération est déposé par voie électrolytique à partir de la solution sur ladite cathode auxiliaire dans la cellule de régénération électrolytique. On dépose alors ladite solution sur l'étain de régénération, d'où la réduction des ions d'étain de type (IV) formés en ions d'étain de type (II).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| DE10132478.2 | 2001-07-03 | ||
| PCT/EP2002/006654 WO2003004725A2 (fr) | 2001-07-03 | 2002-06-17 | Procede de regeneration pour solution de placage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2450258A1 true CA2450258A1 (fr) | 2003-01-16 |
Family
ID=7690626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002450258A Abandoned CA2450258A1 (fr) | 2001-07-03 | 2002-06-17 | Procede de regeneration pour solution de placage |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US20040245108A1 (fr) |
| EP (1) | EP1427869B1 (fr) |
| JP (1) | JP4157838B2 (fr) |
| KR (1) | KR100827259B1 (fr) |
| CN (1) | CN1232677C (fr) |
| AT (1) | ATE289633T1 (fr) |
| AU (1) | AU2002321069A1 (fr) |
| BR (1) | BR0210829B1 (fr) |
| CA (1) | CA2450258A1 (fr) |
| DE (2) | DE10132478C1 (fr) |
| ES (1) | ES2236552T3 (fr) |
| MX (1) | MXPA03011772A (fr) |
| MY (1) | MY130423A (fr) |
| TW (1) | TWI279456B (fr) |
| WO (1) | WO2003004725A2 (fr) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2004301610C1 (en) | 2003-07-16 | 2008-05-15 | Interdigital Technology Corporation | Method and system for transferring information between network management entities of a wireless communication system |
| EP1630252A1 (fr) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Procédé de dépot d'etain ou d'alliages d'etain sur des substrats contenant de l'antimoine |
| JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
| EP2298960A1 (fr) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Procédé de placage anélectrolytique pour l'étain et les alliages d'étain |
| DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
| CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
| EP2671968B1 (fr) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Procédé et appareil de régénération pour régénérer un composition de placage |
| CN106801235B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 降低加工成本的超临界复合电铸体系回收利用装置 |
| CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
| JP6990240B2 (ja) * | 2016-10-24 | 2022-01-12 | アトテック・ドイチュラント・ゲーエムベーハー | 金属基板へのスズ層の被覆方法、および、ニッケル／リン合金下層と、前記方法による前記スズ層と、を備えた構造の使用 |
| CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充系统及方法 |
| CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
| CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
| WO2024116456A1 (fr) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | Procédé et dispositif de régénération de composition de placage |
| CN116288292A (zh) * | 2023-03-20 | 2023-06-23 | 聂柱根 | 一种化学锡药水锡还原再生除铜装置 |
| WO2025164402A1 (fr) * | 2024-01-30 | 2025-08-07 | 株式会社村田製作所 | Composition de placage et son procédé de production |
| WO2025169771A1 (fr) * | 2024-02-06 | 2025-08-14 | 株式会社村田製作所 | Procédé et appareil de production d'une composition de placage |
| WO2025249197A1 (fr) * | 2024-05-30 | 2025-12-04 | 株式会社村田製作所 | Procédé de production d'une composition de placage |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
| JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
| DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
| US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
| US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
| CA2083196C (fr) * | 1991-11-27 | 1998-02-17 | Randal D. King | Procede pour prolonger la duree de vie d'un bain de galvanoplastie par jet mobile |
| JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
| US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
| US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
| DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
| US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
| JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko not_active Expired - Lifetime
- 2002-06-17 CA CA002450258A patent/CA2450258A1/fr not_active Abandoned
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/fr not_active Ceased
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/fr not_active Expired - Lifetime
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1232677C (zh) | 2005-12-21 |
| JP4157838B2 (ja) | 2008-10-01 |
| BR0210829B1 (pt) | 2011-07-26 |
| KR20040030725A (ko) | 2004-04-09 |
| AU2002321069A1 (en) | 2003-01-21 |
| DE60203050D1 (de) | 2005-03-31 |
| ES2236552T3 (es) | 2005-07-16 |
| HK1062926A1 (en) | 2004-12-03 |
| TWI279456B (en) | 2007-04-21 |
| US20040245108A1 (en) | 2004-12-09 |
| KR100827259B1 (ko) | 2008-05-07 |
| WO2003004725A2 (fr) | 2003-01-16 |
| EP1427869B1 (fr) | 2005-02-23 |
| DE10132478C1 (de) | 2003-04-30 |
| MY130423A (en) | 2007-06-29 |
| CN1524132A (zh) | 2004-08-25 |
| MXPA03011772A (es) | 2004-04-02 |
| DE60203050T2 (de) | 2006-02-23 |
| BR0210829A (pt) | 2005-05-03 |
| EP1427869A2 (fr) | 2004-06-16 |
| ATE289633T1 (de) | 2005-03-15 |
| WO2003004725A3 (fr) | 2004-04-15 |
| JP2004534151A (ja) | 2004-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1427869B1 (fr) | Procede de regeneration pour solution de plaquage | |
| CN1468324A (zh) | 在金属表面上无电电镀银的浴及方法 | |
| WO2004085706A1 (fr) | Solution pour graver des surfaces de cuivre et procede de depot de metal sur des surfaces de cuivre | |
| KR100292944B1 (ko) | 지지체 금속표면을 다른 금속으로 치환 도금하는 방법 | |
| US5217751A (en) | Stabilized spray displacement plating process | |
| JP3314967B2 (ja) | 置換めっき浴の寿命を延長させる方法 | |
| EP0088852B1 (fr) | Procédé et dispositif pour la régénération des bains de dépôt chimique | |
| JP4143694B2 (ja) | 無電解メッキ用パラジウム触媒除去剤 | |
| JPH03170680A (ja) | 非導電性支持体を直接金属被覆する方法 | |
| CA2069933C (fr) | Produit d'attaque contenant un catalyseur au vanadium | |
| CN101027427B (zh) | 用锡和锡合金涂布含有锑化合物的衬底的方法 | |
| HK1062926B (en) | Regeneration method for a plating solution | |
| JPS62243776A (ja) | 無電解銅メッキ浴の再生方法 | |
| CA2193007C (fr) | Procede servant a allonger la duree de vie d'un bain de galvanoplastie par deplacement | |
| KR100272318B1 (ko) | 부식액 | |
| JP2007046092A (ja) | シート状ワークの銅めっき装置および方法 | |
| HK1022399A (en) | Method for structuring synthetic surfaces, specially for producing data carriers to store data |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |