CA2957587C - Bain de placage d'alliage de cuivre-etain - Google Patents

Bain de placage d'alliage de cuivre-etain Download PDF

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Publication number
CA2957587C
CA2957587C CA2957587A CA2957587A CA2957587C CA 2957587 C CA2957587 C CA 2957587C CA 2957587 A CA2957587 A CA 2957587A CA 2957587 A CA2957587 A CA 2957587A CA 2957587 C CA2957587 C CA 2957587C
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CA
Canada
Prior art keywords
copper
compound
tin alloy
amount
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2957587A
Other languages
English (en)
Other versions
CA2957587A1 (fr
Inventor
Takamitsu TSUJIMOTO
Toshimitsu Nagao
Kenji Hara
Junichi Katayama
Kuniaki Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Publication of CA2957587A1 publication Critical patent/CA2957587A1/fr
Application granted granted Critical
Publication of CA2957587C publication Critical patent/CA2957587C/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La présente invention a pour objet un bain de placage d'alliage de cuivre-étain qui permet de former un film épais sans l'utilisation d'ions cyanure et qui peut convenir à un placage au tonneau. Le bain de placage d'alliage de cuivre-étain selon la présente invention est composé d'une solution aqueuse qui contient un composé hydrosoluble du cuivre, un composé hydrosoluble de l'étain divalent, un composé contenant du soufre représenté par la formule (1) et un composé aromatique ayant un groupe hydroxyle. R-(CH2)l-S-(CH2)m-S-(CH2)n-R (1) (Dans la formule, R représente H, OH ou SO3Na; et chacun de l, m et n représente indépendamment un nombre entier de 0 à 3.)
CA2957587A 2014-08-08 2015-07-28 Bain de placage d'alliage de cuivre-etain Active CA2957587C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-162294 2014-08-08
JP2014162294 2014-08-08
PCT/JP2015/071330 WO2016021439A1 (fr) 2014-08-08 2015-07-28 Bain de placage d'alliage de cuivre-étain

Publications (2)

Publication Number Publication Date
CA2957587A1 CA2957587A1 (fr) 2016-02-11
CA2957587C true CA2957587C (fr) 2019-03-05

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2957587A Active CA2957587C (fr) 2014-08-08 2015-07-28 Bain de placage d'alliage de cuivre-etain

Country Status (7)

Country Link
US (1) US20170204528A1 (fr)
EP (1) EP3178969B1 (fr)
JP (1) JP6048712B2 (fr)
CN (1) CN106661752B (fr)
CA (1) CA2957587C (fr)
TW (1) TWI641729B (fr)
WO (1) WO2016021439A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (ja) * 2017-09-15 2019-04-04 上村工業株式会社 電解Ｓｎ又はＳｎ合金めっき液及びＳｎ又はＳｎ合金めっき物の製造方法
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN110205659B (zh) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 一种电镀锡添加剂及其制备方法
CN120485893A (zh) * 2025-06-18 2025-08-15 东强（连州）铜箔有限公司 一种超高精细化pcb用高强度vlp铜箔及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
EP1325175B1 (fr) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Electrolyte et procede pour deposer des couches d'alliages etain-cuivre
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
EP2357268A4 (fr) * 2008-11-11 2012-12-05 Yuken Kogyo Co Ltd Bain de zingage à base de zincate
EP2221396A1 (fr) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Compositions de dépôt électrique à l'alliage d'étain sans plomb et procédés
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液

Also Published As

Publication number Publication date
JPWO2016021439A1 (ja) 2017-04-27
WO2016021439A1 (fr) 2016-02-11
TW201612362A (en) 2016-04-01
CN106661752A (zh) 2017-05-10
US20170204528A1 (en) 2017-07-20
EP3178969B1 (fr) 2020-01-01
TWI641729B (zh) 2018-11-21
HK1232261A1 (zh) 2018-01-05
JP6048712B2 (ja) 2016-12-21
CA2957587A1 (fr) 2016-02-11
EP3178969A4 (fr) 2017-12-27
CN106661752B (zh) 2021-08-10
EP3178969A1 (fr) 2017-06-14

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Effective date: 20170207

H11 Ip right ceased following rejected request for revival

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Effective date: 20250129