TWI641729B - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath Download PDF

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Publication number
TWI641729B
TWI641729B TW104125247A TW104125247A TWI641729B TW I641729 B TWI641729 B TW I641729B TW 104125247 A TW104125247 A TW 104125247A TW 104125247 A TW104125247 A TW 104125247A TW I641729 B TWI641729 B TW I641729B
Authority
TW
Taiwan
Prior art keywords
copper
compound
tin alloy
alloy plating
group
Prior art date
Application number
TW104125247A
Other languages
English (en)
Chinese (zh)
Other versions
TW201612362A (en
Inventor
辻本貴光
長尾敏光
�原健二
片山順一
大塚邦顯
Original Assignee
日商奧野製藥工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商奧野製藥工業股份有限公司 filed Critical 日商奧野製藥工業股份有限公司
Publication of TW201612362A publication Critical patent/TW201612362A/zh
Application granted granted Critical
Publication of TWI641729B publication Critical patent/TWI641729B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW104125247A 2014-08-08 2015-08-04 Copper-tin alloy plating bath TWI641729B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014162294 2014-08-08
JP2014-162294 2014-08-08

Publications (2)

Publication Number Publication Date
TW201612362A TW201612362A (en) 2016-04-01
TWI641729B true TWI641729B (zh) 2018-11-21

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125247A TWI641729B (zh) 2014-08-08 2015-08-04 Copper-tin alloy plating bath

Country Status (7)

Country Link
US (1) US20170204528A1 (fr)
EP (1) EP3178969B1 (fr)
JP (1) JP6048712B2 (fr)
CN (1) CN106661752B (fr)
CA (1) CA2957587C (fr)
TW (1) TWI641729B (fr)
WO (1) WO2016021439A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (ja) * 2017-09-15 2019-04-04 上村工業株式会社 電解Sn又はSn合金めっき液及びSn又はSn合金めっき物の製造方法
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN110205659B (zh) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 一种电镀锡添加剂及其制备方法
CN120485893A (zh) * 2025-06-18 2025-08-15 东强(连州)铜箔有限公司 一种超高精细化pcb用高强度vlp铜箔及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201037103A (en) * 2008-12-31 2010-10-16 Rohm & Haas Elect Mat Lead-free tin alloy electroplating compositions and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
EP1325175B1 (fr) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Electrolyte et procede pour deposer des couches d'alliages etain-cuivre
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
WO2010055825A1 (fr) * 2008-11-11 2010-05-20 ユケン工業株式会社 Bain de zingage à base de zincate
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201037103A (en) * 2008-12-31 2010-10-16 Rohm & Haas Elect Mat Lead-free tin alloy electroplating compositions and methods

Also Published As

Publication number Publication date
EP3178969B1 (fr) 2020-01-01
CA2957587A1 (fr) 2016-02-11
TW201612362A (en) 2016-04-01
EP3178969A4 (fr) 2017-12-27
CN106661752B (zh) 2021-08-10
JPWO2016021439A1 (ja) 2017-04-27
JP6048712B2 (ja) 2016-12-21
US20170204528A1 (en) 2017-07-20
EP3178969A1 (fr) 2017-06-14
CA2957587C (fr) 2019-03-05
CN106661752A (zh) 2017-05-10
WO2016021439A1 (fr) 2016-02-11
HK1232261A1 (zh) 2018-01-05

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