CH427937A - Elektrische Schaltungsplatte - Google Patents

Elektrische Schaltungsplatte

Info

Publication number
CH427937A
CH427937A CH1755465A CH1755465A CH427937A CH 427937 A CH427937 A CH 427937A CH 1755465 A CH1755465 A CH 1755465A CH 1755465 A CH1755465 A CH 1755465A CH 427937 A CH427937 A CH 427937A
Authority
CH
Switzerland
Prior art keywords
circuit board
electrical circuit
electrical
board
circuit
Prior art date
Application number
CH1755465A
Other languages
English (en)
Inventor
Seki Hajime
Philip Seraphim Donald
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH427937A publication Critical patent/CH427937A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CH1755465A 1964-12-23 1965-12-20 Elektrische Schaltungsplatte CH427937A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US420580A US3312871A (en) 1964-12-23 1964-12-23 Interconnection arrangement for integrated circuits

Publications (1)

Publication Number Publication Date
CH427937A true CH427937A (de) 1967-01-15

Family

ID=23667047

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1755465A CH427937A (de) 1964-12-23 1965-12-20 Elektrische Schaltungsplatte

Country Status (7)

Country Link
US (1) US3312871A (de)
BE (1) BE673009A (de)
CH (1) CH427937A (de)
DE (1) DE1298194B (de)
FR (1) FR1473933A (de)
GB (1) GB1082106A (de)
NL (1) NL6516158A (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095413A (de) * 1964-12-24
US3436611A (en) * 1965-01-25 1969-04-01 Texas Instruments Inc Insulation structure for crossover leads in integrated circuitry
US3383568A (en) * 1965-02-04 1968-05-14 Texas Instruments Inc Semiconductor device utilizing glass and oxides as an insulator for hermetically sealing the junctions
US3368113A (en) * 1965-06-28 1968-02-06 Westinghouse Electric Corp Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation
NL6606912A (de) * 1966-05-19 1967-11-20
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
US3365707A (en) * 1967-06-23 1968-01-23 Rca Corp Lsi array and standard cells
US3597834A (en) * 1968-02-14 1971-08-10 Texas Instruments Inc Method in forming electrically continuous circuit through insulating layer
GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly
US3539705A (en) * 1968-05-31 1970-11-10 Westinghouse Electric Corp Microelectronic conductor configurations and method of making the same
US3633268A (en) * 1968-06-04 1972-01-11 Telefunken Patent Method of producing one or more large integrated semiconductor circuits
US3641661A (en) * 1968-06-25 1972-02-15 Texas Instruments Inc Method of fabricating integrated circuit arrays
US3634929A (en) * 1968-11-02 1972-01-18 Tokyo Shibaura Electric Co Method of manufacturing semiconductor integrated circuits
US3571918A (en) * 1969-03-28 1971-03-23 Texas Instruments Inc Integrated circuits and fabrication thereof
US3638202A (en) * 1970-03-19 1972-01-25 Bell Telephone Labor Inc Access circuit arrangement for equalized loading in integrated circuit arrays
FR2112024B1 (de) * 1970-07-02 1973-11-16 Commissariat Energie Atomique
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
US3861023A (en) * 1973-04-30 1975-01-21 Hughes Aircraft Co Fully repairable integrated circuit interconnections
FR2243578B1 (de) * 1973-09-12 1976-11-19 Honeywell Bull Soc Ind
US4161662A (en) * 1976-01-22 1979-07-17 Motorola, Inc. Standardized digital logic chip
JPS5925381B2 (ja) * 1977-12-30 1984-06-16 富士通株式会社 半導体集積回路装置
US4249193A (en) * 1978-05-25 1981-02-03 International Business Machines Corporation LSI Semiconductor device and fabrication thereof
FR2495835A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres a reseau metallique d'interconnexion, et procede de fabrication de ce dispositif
US4458297A (en) * 1981-01-16 1984-07-03 Mosaic Systems, Inc. Universal interconnection substrate
WO1982002640A1 (en) * 1981-01-16 1982-08-05 Robert Royce Johnson Universal interconnection substrate
US4467400A (en) * 1981-01-16 1984-08-21 Burroughs Corporation Wafer scale integrated circuit
US4495498A (en) * 1981-11-02 1985-01-22 Trw Inc. N by M planar configuration switch for radio frequency applications
JPS58112343A (ja) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd 半導体装置およびその製造方法
JPS5925260A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 半導体装置
DE3235839A1 (de) * 1982-09-28 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Halbleiterschaltung
JPS5969948A (ja) * 1982-10-15 1984-04-20 Fujitsu Ltd マスタ−スライス型半導体集積回路
JPH07120709B2 (ja) * 1985-03-22 1995-12-20 日本電気株式会社 半導体集積回路の配線方式
US5367208A (en) * 1986-09-19 1994-11-22 Actel Corporation Reconfigurable programmable interconnect architecture
US4880754A (en) * 1987-07-06 1989-11-14 International Business Machines Corp. Method for providing engineering changes to LSI PLAs
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
US5025306A (en) * 1988-08-09 1991-06-18 Texas Instruments Incorporated Assembly of semiconductor chips
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177405A (en) * 1959-12-23 1965-04-06 Sippican Corp Modular electrical assembly
US3114867A (en) * 1960-09-21 1963-12-17 Rca Corp Unipolar transistors and assemblies therefor
US3199002A (en) * 1961-04-17 1965-08-03 Fairchild Camera Instr Co Solid-state circuit with crossing leads and method for making the same
NL285921A (de) * 1961-12-19
CA753218A (en) * 1962-01-31 1967-02-21 International Business Machines Corporation Method for effecting superconductive connections

Also Published As

Publication number Publication date
NL6516158A (de) 1966-06-24
US3312871A (en) 1967-04-04
DE1298194B (de) 1969-06-26
BE673009A (de) 1966-03-16
FR1473933A (fr) 1967-03-24
GB1082106A (en) 1967-09-06

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