CH435458A - Procédé pour établir des connexions sur des dispositifs semi-conducteurs - Google Patents

Procédé pour établir des connexions sur des dispositifs semi-conducteurs

Info

Publication number
CH435458A
CH435458A CH694365A CH694365A CH435458A CH 435458 A CH435458 A CH 435458A CH 694365 A CH694365 A CH 694365A CH 694365 A CH694365 A CH 694365A CH 435458 A CH435458 A CH 435458A
Authority
CH
Switzerland
Prior art keywords
semiconductor devices
establishing connections
establishing
connections
semiconductor
Prior art date
Application number
CH694365A
Other languages
English (en)
Inventor
James Carroll Arlan
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of CH435458A publication Critical patent/CH435458A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
CH694365A 1964-05-20 1965-05-18 Procédé pour établir des connexions sur des dispositifs semi-conducteurs CH435458A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US368878A US3292241A (en) 1964-05-20 1964-05-20 Method for connecting semiconductor devices

Publications (1)

Publication Number Publication Date
CH435458A true CH435458A (fr) 1967-05-15

Family

ID=23453134

Family Applications (1)

Application Number Title Priority Date Filing Date
CH694365A CH435458A (fr) 1964-05-20 1965-05-18 Procédé pour établir des connexions sur des dispositifs semi-conducteurs

Country Status (5)

Country Link
US (1) US3292241A (fr)
CH (1) CH435458A (fr)
DE (1) DE1514197A1 (fr)
GB (1) GB1043942A (fr)
NL (1) NL6506313A (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374400A (en) * 1964-09-02 1968-03-19 Fujitsu Ltd Compound electronic unit
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3344387A (en) * 1964-10-07 1967-09-26 Western Electric Co Variable thin film electrical component
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3414968A (en) * 1965-02-23 1968-12-10 Solitron Devices Method of assembly of power transistors
US3414969A (en) * 1965-02-25 1968-12-10 Solitron Devices Connection arrangement for three-element component to a micro-electronics circuit
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3384956A (en) * 1965-06-03 1968-05-28 Gen Dynamics Corp Module assembly and method therefor
US3461462A (en) * 1965-12-02 1969-08-12 United Aircraft Corp Method for bonding silicon semiconductor devices
US3501832A (en) * 1966-02-26 1970-03-24 Sony Corp Method of making electrical wiring and wiring connections for electrical components
US3508209A (en) * 1966-03-31 1970-04-21 Ibm Monolithic integrated memory array structure including fabrication and package therefor
US3371148A (en) * 1966-04-12 1968-02-27 Radiation Inc Semiconductor device package and method of assembly therefor
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3381372A (en) * 1966-07-13 1968-05-07 Sperry Rand Corp Method of electrically connecting and hermetically sealing packages for microelectronic circuits
US3501829A (en) * 1966-07-18 1970-03-24 United Aircraft Corp Method of applying contacts to a microcircuit
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3388302A (en) * 1966-12-30 1968-06-11 Coors Porcelain Co Ceramic housing for semiconductor components
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US3436606A (en) * 1967-04-03 1969-04-01 Texas Instruments Inc Packaged multilead semiconductor device with improved jumper connection
US3497947A (en) * 1967-08-18 1970-03-03 Frank J Ardezzone Miniature circuit connection and packaging techniques
US3500440A (en) * 1968-01-08 1970-03-10 Interamericano Projects Inc Functional building blocks facilitating mass production of electronic equipment by unskilled labor
US3504096A (en) * 1968-01-31 1970-03-31 Westinghouse Electric Corp Semiconductor device and method
US3634731A (en) * 1970-08-06 1972-01-11 Atomic Energy Commission Generalized circuit
US3919709A (en) * 1974-11-13 1975-11-11 Gen Electric Metallic plate-semiconductor assembly and method for the manufacture thereof
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
DE2938567C2 (de) * 1979-09-24 1982-04-29 Siemens AG, 1000 Berlin und 8000 München Gehäuse für hochintegrierte Schaltkreise
US4701363A (en) * 1986-01-27 1987-10-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby
US4837928A (en) * 1986-10-17 1989-06-13 Cominco Ltd. Method of producing a jumper chip for semiconductor devices
US4735678A (en) * 1987-04-13 1988-04-05 Olin Corporation Forming a circuit pattern in a metallic tape by electrical discharge machining

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3107414A (en) * 1959-12-24 1963-10-22 Ibm Method of forming circuit cards
NL268834A (fr) * 1960-09-02
US3200490A (en) * 1962-12-07 1965-08-17 Philco Corp Method of forming ohmic bonds to a germanium-coated silicon body with eutectic alloyforming materials

Also Published As

Publication number Publication date
NL6506313A (fr) 1965-11-22
US3292241A (en) 1966-12-20
DE1514197A1 (de) 1969-07-17
GB1043942A (en) 1966-09-28

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