CH596669A5 - - Google Patents

Info

Publication number
CH596669A5
CH596669A5 CH1362176A CH1362176A CH596669A5 CH 596669 A5 CH596669 A5 CH 596669A5 CH 1362176 A CH1362176 A CH 1362176A CH 1362176 A CH1362176 A CH 1362176A CH 596669 A5 CH596669 A5 CH 596669A5
Authority
CH
Switzerland
Application number
CH1362176A
Inventor
Jiri Kovar
Pavel Kafunek
Pavel Reichel
Oldrich Pokorny
Michal Pellant
Jindrich Kratina
Jaroslav Zuna
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of CH596669A5 publication Critical patent/CH596669A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
CH1362176A 1975-11-28 1976-10-28 CH596669A5 (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS7500008082A CS180334B1 (en) 1975-11-28 1975-11-28 Power semiconducting disc elements suppressing and jigging equipment

Publications (1)

Publication Number Publication Date
CH596669A5 true CH596669A5 (cs) 1978-03-15

Family

ID=5430929

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1362176A CH596669A5 (cs) 1975-11-28 1976-10-28

Country Status (9)

Country Link
US (1) US4104677A (cs)
CH (1) CH596669A5 (cs)
CS (1) CS180334B1 (cs)
DD (1) DD127720A1 (cs)
DE (1) DE2649824A1 (cs)
FR (1) FR2333351A1 (cs)
GB (1) GB1511100A (cs)
PL (1) PL99632B1 (cs)
SE (1) SE7612392L (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH616537A5 (cs) * 1978-01-17 1980-03-31 Bbc Brown Boveri & Cie
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
TW335503B (en) * 1996-02-23 1998-07-01 Semiconductor Energy Lab Kk Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL288523A (cs) * 1961-08-04 1900-01-01
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
DE1514477C3 (de) * 1965-06-10 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
DE2049012C3 (de) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
DE2224040C3 (de) * 1970-09-30 1981-07-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
US3688159A (en) * 1970-10-28 1972-08-29 Cutler Hammer Inc Compression mounted scr clamp with heat sink means
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
SU439034A1 (ru) * 1972-06-07 1974-08-05 Предприятие П/Я Р-6517 Устройство дл охлаждени
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly

Also Published As

Publication number Publication date
CS180334B1 (en) 1977-12-30
DD127720A1 (de) 1977-10-12
US4104677A (en) 1978-08-01
DE2649824A1 (de) 1977-06-30
PL99632B1 (pl) 1978-07-31
SE7612392L (sv) 1977-05-29
FR2333351A1 (fr) 1977-06-24
GB1511100A (en) 1978-05-17

Similar Documents

Publication Publication Date Title
AU8233875A (cs)
CH606440A5 (cs)
CH599967A5 (cs)
BG22191A1 (cs)
BG22665A1 (cs)
BG22870A1 (cs)
BG22877A1 (cs)
BG22941A1 (cs)
CH404775A4 (cs)
CH586956A5 (cs)
CH587601A5 (cs)
CH589129A5 (cs)
CH592280A5 (cs)
CH594131A5 (cs)
CH594560A5 (cs)
CH594811A5 (cs)
CH595479A5 (cs)
CH596018A5 (cs)
CH596119A5 (cs)
CH596436A5 (cs)
CH596999A5 (cs)
CH597693A5 (cs)
CH597845A5 (cs)
CH598003A5 (cs)
CH598005A5 (cs)

Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased