DD127720A1 - Anpress-und spanneinrichtung fuer halbleiterbauelemente - Google Patents

Anpress-und spanneinrichtung fuer halbleiterbauelemente

Info

Publication number: DD127720A1
Authority: DD; German Democratic Republic
Prior art keywords: semi; pressing; clamping device; conductor components; conductor
Prior art date: 1975-11-28

Application number

DD7600195456A

Other languages

German (de)

English (en)

Inventor

Jaroslav Zuna

Jiri Kovar

Pavel Kafunek

Pavel Reichel

Oldrich Pokorny

Michal Pellant

Jindrich Kratina

Original Assignee

Ckd Praha

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-11-28

Filing date

1976-10-26

Publication date

1977-10-12

1976-10-26 Application filed by Ckd Praha filed Critical Ckd Praha

1977-10-12 Publication of DD127720A1 publication Critical patent/DD127720A1/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W78/00—Detachable holders for supporting packaged chips in operation
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

DD7600195456A 1975-11-28 1976-10-26 Anpress-und spanneinrichtung fuer halbleiterbauelemente DD127720A1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CS7500008082A CS180334B1 (en)	1975-11-28	1975-11-28	Power semiconducting disc elements suppressing and jigging equipment

Publications (1)

Publication Number	Publication Date
DD127720A1 true DD127720A1 (de)	1977-10-12

Family

ID=5430929

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DD7600195456A DD127720A1 (de)	1975-11-28	1976-10-26	Anpress-und spanneinrichtung fuer halbleiterbauelemente

Country Status (9)

Country	Link
US (1)	US4104677A (cs)
CH (1)	CH596669A5 (cs)
CS (1)	CS180334B1 (cs)
DD (1)	DD127720A1 (cs)
DE (1)	DE2649824A1 (cs)
FR (1)	FR2333351A1 (cs)
GB (1)	GB1511100A (cs)
PL (1)	PL99632B1 (cs)
SE (1)	SE7612392L (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH616537A5 (cs) *	1978-01-17	1980-03-31	Bbc Brown Boveri & Cie
US5549155A (en) *	1995-04-18	1996-08-27	Thermacore, Inc.	Integrated circuit cooling apparatus
TW335503B (en) *	1996-02-23	1998-07-01	Semiconductor Energy Lab Kk	Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL288523A (cs) *	1961-08-04	1900-01-01
CH442502A (de) *	1965-04-23	1967-08-31	Siemens Ag	Gleichrichteranlage
DE1514477C3 (de) *	1965-06-10	1975-06-26	Siemens Ag, 1000 Berlin Und 8000 Muenchen	Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
GB1260657A (en) *	1968-11-26	1972-01-19	Westinghouse Brake & Signal	Improvements relating to mountings for rectifier devices
DE2224040C3 (de) *	1970-09-30	1981-07-30	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
DE2049012C3 (de) *	1970-09-30	1979-07-12	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes
US3688159A (en) *	1970-10-28	1972-08-29	Cutler Hammer Inc	Compression mounted scr clamp with heat sink means
US3715632A (en) *	1971-01-08	1973-02-06	Gen Electric	Liquid cooled semiconductor device clamping assembly
US3743893A (en) *	1971-05-27	1973-07-03	Mitsubishi Electric Corp	Fluid cooled compression bonded semiconductor device structure
SU439034A1 (ru) *	1972-06-07	1974-08-05	Предприятие П/Я Р-6517	Устройство дл охлаждени
US3808471A (en) *	1972-10-26	1974-04-30	Borg Warner	Expandible pressure mounted semiconductor assembly

1975
- 1975-11-28 CS CS7500008082A patent/CS180334B1/cs unknown
1976
- 1976-10-26 DD DD7600195456A patent/DD127720A1/xx unknown
- 1976-10-27 PL PL1976193305A patent/PL99632B1/xx unknown
- 1976-10-28 CH CH1362176A patent/CH596669A5/xx not_active IP Right Cessation
- 1976-10-29 DE DE19762649824 patent/DE2649824A1/de active Pending
- 1976-11-05 SE SE7612392A patent/SE7612392L/xx unknown
- 1976-11-24 GB GB48952/76A patent/GB1511100A/en not_active Expired
- 1976-11-26 FR FR7635809A patent/FR2333351A1/fr active Pending
- 1976-11-26 US US05/745,201 patent/US4104677A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE2649824A1 (de)	1977-06-30
PL99632B1 (pl)	1978-07-31
CH596669A5 (cs)	1978-03-15
US4104677A (en)	1978-08-01
CS180334B1 (en)	1977-12-30
SE7612392L (sv)	1977-05-29
GB1511100A (en)	1978-05-17
FR2333351A1 (fr)	1977-06-24

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