CH665656A5 - Bain d'or acide et utilisation de ce bain en electroplastie. - Google Patents

Bain d'or acide et utilisation de ce bain en electroplastie. Download PDF

Info

Publication number: CH665656A5
Authority: CH; Switzerland
Prior art keywords: acid; bath; gold; phosphonic; methylene
Prior art date: 1983-12-29

Application number

CH696183A

Other languages

English (en)

French (fr)

Inventor

Heinz Emmenegger

Original Assignee

Heinz Emmenegger

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-12-29

Filing date

1983-12-29

Publication date

1988-05-31

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4317752&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CH665656(A5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1983-12-29 Application filed by Heinz Emmenegger filed Critical Heinz Emmenegger

1983-12-29 Priority to CH696183A priority Critical patent/CH665656A5/fr

1984-12-20 Priority to EP19840115879 priority patent/EP0149830B2/de

1984-12-20 Priority to DE8484115879T priority patent/DE3477588D1/de

1984-12-20 Priority to DE1984115879 priority patent/DE149830T1/de

1988-05-31 Publication of CH665656A5 publication Critical patent/CH665656A5/fr

Links

PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 26
229910052737 gold Inorganic materials 0.000 title claims description 26
239000010931 gold Substances 0.000 title claims description 26
239000002253 acid Substances 0.000 title claims description 22
238000000151 deposition Methods 0.000 claims description 10
150000007513 acids Chemical class 0.000 claims description 7
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 5
239000000203 mixture Substances 0.000 claims description 5
229910052783 alkali metal Inorganic materials 0.000 claims description 4
150000001340 alkali metals Chemical class 0.000 claims description 4
239000007983 Tris buffer Substances 0.000 claims description 3
LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 3
BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
239000008139 complexing agent Substances 0.000 claims description 2
235000011090 malic acid Nutrition 0.000 claims description 2
239000001630 malic acid Substances 0.000 claims description 2
NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims 2
XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims 1
159000000011 group IA salts Chemical class 0.000 claims 1
229940005657 pyrophosphoric acid Drugs 0.000 claims 1
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 8
230000001464 adherent effect Effects 0.000 description 8
230000008021 deposition Effects 0.000 description 8
229910052751 metal Inorganic materials 0.000 description 8
239000002184 metal Substances 0.000 description 8
229910052700 potassium Inorganic materials 0.000 description 8
239000011591 potassium Substances 0.000 description 8
239000000243 solution Substances 0.000 description 7
238000005868 electrolysis reaction Methods 0.000 description 5
239000010935 stainless steel Substances 0.000 description 5
229910001220 stainless steel Inorganic materials 0.000 description 5
229910001020 Au alloy Inorganic materials 0.000 description 4
229910052759 nickel Inorganic materials 0.000 description 4
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical class Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
230000002378 acidificating effect Effects 0.000 description 3
229910045601 alloy Inorganic materials 0.000 description 3
239000000956 alloy Substances 0.000 description 3
239000003353 gold alloy Substances 0.000 description 3
LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 3
238000000034 method Methods 0.000 description 3
239000000126 substance Substances 0.000 description 3
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
229910052804 chromium Inorganic materials 0.000 description 2
239000011651 chromium Substances 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
238000002425 crystallisation Methods 0.000 description 2
230000008025 crystallization Effects 0.000 description 2
235000011167 hydrochloric acid Nutrition 0.000 description 2
-1 hydroxy-methyl-phosphonic acid sulfuric acid sulfamic acid pyrophosphoric acid Chemical compound 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
238000007747 plating Methods 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
229910052708 sodium Inorganic materials 0.000 description 2
239000011734 sodium Substances 0.000 description 2
QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
229910001369 Brass Inorganic materials 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
FQHTWYRBBHNCJW-UHFFFAOYSA-N ClC(C(=O)O)(Cl)Cl.ClC(C(=O)O)Cl.ClCC(=O)O Chemical compound ClC(C(=O)O)(Cl)Cl.ClC(C(=O)O)Cl.ClCC(=O)O FQHTWYRBBHNCJW-UHFFFAOYSA-N 0.000 description 1
229910000914 Mn alloy Inorganic materials 0.000 description 1
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
229910001260 Pt alloy Inorganic materials 0.000 description 1
229910001128 Sn alloy Inorganic materials 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
239000010953 base metal Substances 0.000 description 1
239000010951 brass Substances 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000004299 exfoliation Methods 0.000 description 1
JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
239000010439 graphite Substances 0.000 description 1
229910002804 graphite Inorganic materials 0.000 description 1
239000012535 impurity Substances 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
229910052750 molybdenum Inorganic materials 0.000 description 1
239000011733 molybdenum Substances 0.000 description 1
XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
150000002825 nitriles Chemical class 0.000 description 1
OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
235000011007 phosphoric acid Nutrition 0.000 description 1
238000005554 pickling Methods 0.000 description 1
UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 1
239000000758 substrate Substances 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
239000002023 wood Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Electroplating Methods And Accessories (AREA)

CH696183A 1983-12-29 1983-12-29 Bain d'or acide et utilisation de ce bain en electroplastie. CH665656A5 (fr)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
CH696183A CH665656A5 (fr)	1983-12-29	1983-12-29	Bain d'or acide et utilisation de ce bain en electroplastie.
EP19840115879 EP0149830B2 (de)	1983-12-29	1984-12-20	Elekrolytisches Bad für das Abscheiden dünner Schichten reinen Goldes
DE8484115879T DE3477588D1 (en)	1983-12-29	1984-12-20	Electrolytic bath for the deposition of thin layers of pure gold
DE1984115879 DE149830T1 (de)	1983-12-29	1984-12-20	Elekrolytisches bad fuer das absetzen duenner schichten reinen goldes.

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH696183A CH665656A5 (fr)	1983-12-29	1983-12-29	Bain d'or acide et utilisation de ce bain en electroplastie.

Publications (1)

Publication Number	Publication Date
CH665656A5 true CH665656A5 (fr)	1988-05-31

Family

ID=4317752

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH696183A CH665656A5 (fr)	1983-12-29	1983-12-29	Bain d'or acide et utilisation de ce bain en electroplastie.

Country Status (3)

Country	Link
EP (1)	EP0149830B2 (de)
CH (1)	CH665656A5 (de)
DE (2)	DE149830T1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3902977A (en) *	1973-12-13	1975-09-02	Engelhard Min & Chem	Gold plating solutions and method
AT353071B (de) *	1977-10-06	1979-10-25	Oxy Metal Industries Corp	Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen
US4168214A (en) *	1978-06-14	1979-09-18	American Chemical And Refining Company, Inc.	Gold electroplating bath and method of making the same
GB2038361B (en) *	1978-11-11	1983-08-17	Ibm	Trivalent chromium plating bath
DE3012999C2 (de) *	1980-04-03	1984-02-16	Degussa Ag, 6000 Frankfurt	Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen
DE3021665A1 (de) *	1980-06-10	1981-12-17	Degussa Ag, 6000 Frankfurt	Stark saures goldlegierungsbad

1983
- 1983-12-29 CH CH696183A patent/CH665656A5/fr not_active IP Right Cessation
1984
- 1984-12-20 EP EP19840115879 patent/EP0149830B2/de not_active Expired - Lifetime
- 1984-12-20 DE DE1984115879 patent/DE149830T1/de active Pending
- 1984-12-20 DE DE8484115879T patent/DE3477588D1/de not_active Expired

Also Published As

Publication number	Publication date
DE149830T1 (de)	1985-10-24
EP0149830B2 (de)	1992-05-13
DE3477588D1 (en)	1989-05-11
EP0149830A3 (en)	1986-10-15
EP0149830B1 (de)	1989-04-05
EP0149830A2 (de)	1985-07-31

Legal Events

Date	Code	Title	Description
2004-01-30	PL	Patent ceased

Publication	Publication Date	Title
FR2699556A1 (fr)	1994-06-24	Bains pour former un dépôt électrolytique de cuivre et procédé de dépôt électrolytique utilisant ce bain.
FR2502184A1 (fr)	1982-09-24	Bain de revetement non-electrolytique en or
FR2672306A1 (fr)	1992-08-07	Solutions perfectionnees de zincate pour le traitement de l'aluminium et des alliages d'aluminium.
EP1272691B1 (de)	2004-03-17	Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen
US3230098A (en)	1966-01-18	Immersion plating with noble metals
EP1423557B1 (de)	2004-12-22	Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
US4349390A (en)	1982-09-14	Method for the electrolytical metal coating of magnesium articles
WO2001077025A1 (fr)	2001-10-18	Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot du palladium ou d'un de ses alliages
CH665656A5 (fr)	1988-05-31	Bain d'or acide et utilisation de ce bain en electroplastie.
FR2568270A2 (fr)	1986-01-31	Procede de traitement de surface de pieces en titane
EP1520063B1 (de)	2005-10-26	Bad für galvanischen goldniederschlag
JP4078977B2 (ja)	2008-04-23	無電解金めっき液及び無電解金めっき方法
FR2639654A1 (fr)	1990-06-01	Bain de dorure autocatalytique et son procede d'utilisation
JPH0219473A (ja)	1990-01-23	無電解金沈積
JP3373356B2 (ja)	2003-02-04	銅又は銅合金の変色防止液及び変色防止方法並びにそれを適用してなる電子部品材料
FR2617195A1 (fr)	1988-12-30	Revetement electrogalvanise ameliore pour acier
JP3026527B2 (ja)	2000-03-27	無電解めっきの前処理方法および前処理液
FR2539145A1 (fr)	1984-07-13	Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede
FR3155008A1 (fr)	2025-05-09	Composition de bain d’argenture sans cyanure et ses utilisations
BE1003584A5 (fr)	1992-04-28	Composition et procede de conversion.
CH610354A5 (en)	1979-04-12	Gold-plated article
FR3152520A1 (fr)	2025-03-07	Bain d’argentage sans cyanure, son procédé de préparation, procédé d’argentage correspondant et applications
FR2558853A1 (fr)	1985-08-02	Bain exempt de citrate pour deposer, par electrolyse, des alliages d'or et son procede d'utilisation
EP1070771A1 (de)	2001-01-24	Wässeriges, saures Bad für Zinkplattierungsverfahren und das Bad verwendes Zinkplattierungsverfahren
CH710185B1 (fr)	2016-03-31	Préparation pour bain galvanique d'alliage d'or et bain galvanique.