CH711570A1 - Vorrichtung für die Montage von Bauelementen auf einem Substrat. - Google Patents

Vorrichtung für die Montage von Bauelementen auf einem Substrat. Download PDF

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Publication number
CH711570A1
CH711570A1 CH01401/15A CH14012015A CH711570A1 CH 711570 A1 CH711570 A1 CH 711570A1 CH 01401/15 A CH01401/15 A CH 01401/15A CH 14012015 A CH14012015 A CH 14012015A CH 711570 A1 CH711570 A1 CH 711570A1
Authority
CH
Switzerland
Prior art keywords
camera
substrate
deflection system
optical
optical deflection
Prior art date
Application number
CH01401/15A
Other languages
English (en)
Other versions
CH711570B1 (de
Inventor
Bilewicz Norbert
Selhofer Hubert
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Priority to CH01401/15A priority Critical patent/CH711570B1/de
Priority to FR1658082A priority patent/FR3041860B1/fr
Priority to SG10201607243PA priority patent/SG10201607243PA/en
Priority to DE102016116235.3A priority patent/DE102016116235B4/de
Priority to MYPI2016703193A priority patent/MY178737A/en
Priority to JP2016178030A priority patent/JP6881923B2/ja
Priority to KR1020160122945A priority patent/KR102491721B1/ko
Priority to CN201610885117.1A priority patent/CN106559977B/zh
Priority to MX2016012518A priority patent/MX365047B/es
Priority to TW105131023A priority patent/TWI700515B/zh
Priority to US15/278,529 priority patent/US10288413B2/en
Publication of CH711570A1 publication Critical patent/CH711570A1/de
Publication of CH711570B1 publication Critical patent/CH711570B1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/008—Systems specially adapted to form image relays or chained systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/149—Beam splitting or combining systems operating by reflection only using crossed beamsplitting surfaces, e.g. cross-dichroic cubes or X-cubes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by monitoring or safety
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

Die Erfindung ist eine Vorrichtung für die Montage von Bauelementen (1) auf einem Substrat (3) umfasst ein Pick und Place System (5) mit einem Bondkopf (6), eine Kamera (7) und zwei optische Umlenksysteme (8, 9). Das erste optische Umlenksystem (8) und die Kamera (7) bilden ein erstes Bilderfassungssystem für die Aufnahme eines Bildes des Substratplatzes (2), auf dem das Bauelement (1) zu montieren ist. Das erste optische Umlenksystem (8), das zweite optische Umlenksystem (9) und die Kamera (7) bilden ein zweites Bilderfassungssystem für die Aufnahme eines Bildes einer Unterseite des Bauelements (1). Das Pick und Place System (5) bewegt den Schlitten (13) von einem Aufnahmeort des Bauelements (1) zu dem Substratplatz (2) jeweils in einer vorbestimmten Höhe H 1 über das zweite optische Umlenksystem (9), so dass sich die Unterseite des Bauelements (1) in einer Schärfenebene der Kamera (7) befindet, und hebt den Schlitten (13) jeweils auf eine vorbestimmte Höhe H 2 an, so dass sich der Substratplatz (2) in der Schärfenebene der Kamera (7) befindet.
CH01401/15A 2015-09-28 2015-09-28 Vorrichtung für die Montage von Bauelementen auf einem Substrat. CH711570B1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
CH01401/15A CH711570B1 (de) 2015-09-28 2015-09-28 Vorrichtung für die Montage von Bauelementen auf einem Substrat.
FR1658082A FR3041860B1 (fr) 2015-09-28 2016-08-31 Appareil pour monter des composants sur un substrat
SG10201607243PA SG10201607243PA (en) 2015-09-28 2016-08-31 Apparatus for mounting components on a substrate
DE102016116235.3A DE102016116235B4 (de) 2015-09-28 2016-08-31 Vorrichtung für die Montage von Bauelementen auf einem Substrat
MYPI2016703193A MY178737A (en) 2015-09-28 2016-09-01 Apparatus for mounting components on a substrate
JP2016178030A JP6881923B2 (ja) 2015-09-28 2016-09-12 部品を基板上に取り付ける装置
KR1020160122945A KR102491721B1 (ko) 2015-09-28 2016-09-26 기판에 부품들을 장착하기 위한 장치
CN201610885117.1A CN106559977B (zh) 2015-09-28 2016-09-26 用于在衬底上安装部件的装置
MX2016012518A MX365047B (es) 2015-09-28 2016-09-26 Aparato para montar componentes sobre un sustrato.
TW105131023A TWI700515B (zh) 2015-09-28 2016-09-26 用於將部件安裝在基板上的裝置
US15/278,529 US10288413B2 (en) 2015-09-28 2016-09-28 Apparatus for mounting components on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01401/15A CH711570B1 (de) 2015-09-28 2015-09-28 Vorrichtung für die Montage von Bauelementen auf einem Substrat.

Publications (2)

Publication Number Publication Date
CH711570A1 true CH711570A1 (de) 2017-03-31
CH711570B1 CH711570B1 (de) 2019-02-15

Family

ID=58282076

Family Applications (1)

Application Number Title Priority Date Filing Date
CH01401/15A CH711570B1 (de) 2015-09-28 2015-09-28 Vorrichtung für die Montage von Bauelementen auf einem Substrat.

Country Status (11)

Country Link
US (1) US10288413B2 (de)
JP (1) JP6881923B2 (de)
KR (1) KR102491721B1 (de)
CN (1) CN106559977B (de)
CH (1) CH711570B1 (de)
DE (1) DE102016116235B4 (de)
FR (1) FR3041860B1 (de)
MX (1) MX365047B (de)
MY (1) MY178737A (de)
SG (1) SG10201607243PA (de)
TW (1) TWI700515B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9929121B2 (en) * 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
US11011435B2 (en) * 2018-11-20 2021-05-18 Asm Technology Singapore Pte Ltd Apparatus and method inspecting bonded semiconductor dice
JP7299728B2 (ja) * 2019-03-22 2023-06-28 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
TWI775198B (zh) * 2019-12-17 2022-08-21 日商新川股份有限公司 半導體裝置的製造裝置以及半導體裝置的製造方法
KR102756267B1 (ko) * 2020-08-24 2025-01-21 엘지전자 주식회사 마이크로 엘이디 디스플레이의 리페어 공정을 위한 칩 제거장치
US12051604B2 (en) * 2021-01-06 2024-07-30 Samsung Electronics Co., Ltd. Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
JP7645077B2 (ja) * 2021-01-06 2025-03-13 三星電子株式会社 半導体装置の製造装置及び半導体装置の製造方法
JP7343942B2 (ja) * 2021-01-18 2023-09-13 株式会社新川 位置制御装置、位置制御方法、位置制御プログラムおよびボンディング装置
EP4304312B1 (de) * 2021-03-03 2026-04-22 Panasonic Intellectual Property Management Co., Ltd. Abbildungsvorrichtung und montagevorrichtung

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JPH04199600A (ja) * 1990-11-29 1992-07-20 Juki Corp 部品実装装置
US5752446A (en) * 1993-11-22 1998-05-19 Dek Printing Machines Limited Alignment systems
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Publication number Priority date Publication date Assignee Title
JPS6163099A (ja) * 1984-09-04 1986-04-01 松下電器産業株式会社 電子部品取付装置
JPH04199600A (ja) * 1990-11-29 1992-07-20 Juki Corp 部品実装装置
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Also Published As

Publication number Publication date
KR102491721B1 (ko) 2023-01-25
TWI700515B (zh) 2020-08-01
FR3041860A1 (fr) 2017-03-31
JP2017069554A (ja) 2017-04-06
DE102016116235B4 (de) 2021-01-07
CH711570B1 (de) 2019-02-15
CN106559977A (zh) 2017-04-05
US20170092613A1 (en) 2017-03-30
MX365047B (es) 2019-03-29
DE102016116235A1 (de) 2017-03-30
TW201721222A (zh) 2017-06-16
MY178737A (en) 2020-10-20
SG10201607243PA (en) 2017-04-27
KR20170037837A (ko) 2017-04-05
US10288413B2 (en) 2019-05-14
CN106559977B (zh) 2020-02-07
JP6881923B2 (ja) 2021-06-02
MX2016012518A (es) 2017-03-27
FR3041860B1 (fr) 2018-11-16

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