CN103059630A - Flame-retardant halogen-free heat-dissipating insulating varnish and preparation method thereof - Google Patents
Flame-retardant halogen-free heat-dissipating insulating varnish and preparation method thereof Download PDFInfo
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- 239000003063 flame retardant Substances 0.000 title claims abstract description 33
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000002966 varnish Substances 0.000 title abstract description 29
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims abstract description 8
- 239000003999 initiator Substances 0.000 claims abstract description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims abstract 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052736 halogen Inorganic materials 0.000 claims description 13
- 150000002367 halogens Chemical class 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- -1 alkyl glycidyl ether Chemical compound 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 5
- 229920000180 alkyd Polymers 0.000 claims description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 3
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 3
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 3
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- ZXJBWUAALADCRI-UHFFFAOYSA-N 2-(octadecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCCCCCCCOCC1CO1 ZXJBWUAALADCRI-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims 8
- 230000005855 radiation Effects 0.000 claims 3
- 239000012745 toughening agent Substances 0.000 claims 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 2
- 238000012986 modification Methods 0.000 claims 2
- 230000004048 modification Effects 0.000 claims 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims 1
- HDFFVHSMHLDSLO-UHFFFAOYSA-N Dibenzyl phosphate Chemical compound C=1C=CC=CC=1COP(=O)(O)OCC1=CC=CC=C1 HDFFVHSMHLDSLO-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 claims 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims 1
- CAAULPUQFIIOTL-UHFFFAOYSA-L methyl phosphate(2-) Chemical compound COP([O-])([O-])=O CAAULPUQFIIOTL-UHFFFAOYSA-L 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims 1
- 150000003014 phosphoric acid esters Chemical class 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 239000003623 enhancer Substances 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 5
- 239000003085 diluting agent Substances 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000005543 nano-size silicon particle Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical group CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- YASRHLDAFCMIPB-UHFFFAOYSA-N (1-oxo-2,6,7-trioxa-1$l^{5}-phosphabicyclo[2.2.2]octan-4-yl)methanol Chemical compound C1OP2(=O)OCC1(CO)CO2 YASRHLDAFCMIPB-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- HDFFVHSMHLDSLO-UHFFFAOYSA-M dibenzyl phosphate Chemical compound C=1C=CC=CC=1COP(=O)([O-])OCC1=CC=CC=C1 HDFFVHSMHLDSLO-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开了一种阻燃型无卤散热绝缘漆及其制备方法，含有稀释剂、无卤阻燃剂、散热增强剂、引发剂、无卤改性树脂按比例均匀混合制得的。其中散热增强剂由纳米碳化硅、纳米三氧化二铝混合而成。本发明在室温制备的阻燃型无卤散热绝缘漆的散热性能好、绝缘性高、存储寿命长、阻燃性好，且满足无卤要求，具有较大的实用价值。The invention discloses a flame-retardant halogen-free heat-dissipating insulating varnish and a preparation method thereof, which comprises a diluent, a halogen-free flame retardant, a heat-dissipating enhancer, an initiator, and a halogen-free modified resin, which are uniformly mixed in proportion. The heat-dissipating enhancer is a mixture of nano silicon carbide and nano aluminum oxide. The flame-retardant halogen-free heat-dissipating insulating varnish prepared at room temperature by the invention has good heat-dissipating performance, high insulation, long storage life, good flame retardancy, meets halogen-free requirements, and has great practical value.
Description
技术领域 technical field
本发明涉及绝缘漆技术领域，是对现有技术的改进，具体涉及一种阻燃型无卤散热绝缘漆及其制备方法。 The invention relates to the technical field of insulating varnish and is an improvement on the prior art, in particular to a flame-retardant halogen-free heat-dissipating insulating varnish and a preparation method thereof.
背景技术 Background technique
绝缘漆是现代电子电器行业中不可或缺的一种重要材料，其质量对电子电器产品的长期可靠性和经济技术指标等起着关键作用。电子电器产品的不断发展，对绝缘漆也提出了更多、更严格的要求。目前市场上的绝缘漆往往存在散热性差、阻燃剂含有卤素、存储寿命短等问题而无法满足更高的使用要求。 Insulating varnish is an indispensable and important material in the modern electronic and electrical industry, and its quality plays a key role in the long-term reliability and economic and technical indicators of electronic and electrical products. The continuous development of electronic and electrical products has also put forward more and stricter requirements for insulating varnishes. At present, insulating varnishes on the market often have problems such as poor heat dissipation, halogen-containing flame retardants, and short storage life, which cannot meet higher requirements for use.
专利CN 101139495A公开了一种助焊阻燃绝缘漆的生产方法，其含有甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丁酯等加热到82℃~85℃反应1小时，升温至90℃~95℃保持1小时，进行聚合。但本发明的生产过程加热温度高，耗费能源且存在安全隐患；另一方面，本发明采用的阻燃剂有丙烯酸二溴丙基酯、三（2，3-二溴丙基）磷酸盐等，含有卤素，无法满足市场对绝缘漆的无卤要求。 Patent CN 101139495A discloses a production method of flux-flame retardant insulating varnish, which contains methyl methacrylate, ethyl methacrylate, butyl methacrylate, etc., and is heated to 82°C~85°C for 1 hour, then heated to Keep at 90°C~95°C for 1 hour to carry out polymerization. But the heating temperature of the production process of the present invention is high, consumes energy and has potential safety hazards; , contains halogen, and cannot meet the halogen-free requirements of the market for insulating varnish.
发明内容 Contents of the invention
本发明的目的是避免上述现有技术中的不足之处而提供的一种阻燃型无卤散热绝缘漆及其制备方法，在室温制备的该阻燃型无卤散热绝缘漆具有散热性能好、绝缘性高、存储寿命长、阻燃性好，且满足无卤要求，具有较大的实用价值。 The object of the present invention is to avoid the deficiencies in the above-mentioned prior art and provide a flame-retardant halogen-free heat-dissipating insulating varnish and a preparation method thereof. The flame-retardant halogen-free heat-dissipating insulating varnish prepared at room temperature has good heat dissipation performance , high insulation, long storage life, good flame retardancy, and meets the requirements of halogen-free, and has great practical value.
本发明的目的可通过下列的措施来实现： The purpose of the present invention can be achieved through the following measures:
本发明阻燃型无卤散热绝缘漆，其所含成分重量百分比（%）为： The flame-retardant halogen-free heat-dissipating insulating varnish of the present invention contains the following ingredients in weight percent (%):
稀释剂 20.0~48.0% Thinner 20.0~48.0%
无卤阻燃剂 1.0~4.0% Halogen-free flame retardant 1.0~4.0%
散热增强剂 0.5~5.0% Heat dissipation enhancer 0.5~5.0%
引发剂 0.5~4.0% Initiator 0.5~4.0%
其余为无卤改性树脂，各成分重量之和为100%。 The rest is halogen-free modified resin, and the weight sum of each component is 100%.
所述的稀释剂为醋酸丁酯、醋酸乙酯、正丙醇、正丁醇、异丁醇、异丙醇、二丙二醇甲醚、乙二醇单丁醚、碳12-14烷基缩水甘油醚、十八烷基缩水甘油醚等中的一种或几种。其主要作用是一方面降低绝缘漆的黏度便于使用，另一方面提高绝缘漆的使用寿命。 The diluent is butyl acetate, ethyl acetate, n-propanol, n-butanol, isobutanol, isopropanol, dipropylene glycol methyl ether, ethylene glycol monobutyl ether, carbon 12-14 alkyl glycidol One or more of ether, stearyl glycidyl ether, etc. Its main function is to reduce the viscosity of the insulating varnish for ease of use on the one hand, and to increase the service life of the insulating varnish on the other hand.
所述的无卤阻燃剂为三（1-氧代-1-磷杂-2，6，7-三氧杂双环[2，2，2]辛烷-4-亚甲基）磷酸酯、1-氧-4-羟甲基-2，6，7-三氧杂-1-磷杂双环[2，2，2]辛烷、甲基磷酸二甲酯、N，N-对苯二胺基（2-羟基）二苄基磷酸四乙酯、磷酸三甲苯酯、磷酸三异丙苯酯中的一种或多种。其主要作用是使绝缘漆具有阻燃性能，增加绝缘漆的使用安全性。 The halogen-free flame retardant is tris(1-oxo-1-phospha-2,6,7-trioxabicyclo[2,2,2]octane-4-methylene)phosphate, 1-Oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2,2,2]octane, dimethyl methyl phosphate, N,N-p-phenylenediamine One or more of (2-hydroxy) dibenzyl tetraethyl phosphate, tricresyl phosphate, and tricumyl phosphate. Its main function is to make the insulating varnish flame retardant and increase the safety of the insulating varnish.
所述的散热增强剂为粉状纳米三氧化二铝、粉状纳米碳化硅、N-(β一氨乙基)-γ-氨丙基三甲(乙)氧基硅烷改性三氧化二铝、乙烯基三甲氧基硅烷改性三氧化二铝中的一种或多种。其主要作用是提高绝缘漆的导热能力，增强电子电器产品的散热效果。 The heat dissipation enhancer is powdered nano-alumina, powdered nano-silicon carbide, N-(β-aminoethyl)-γ-aminopropyltrimethyl(ethyl)oxysilane modified aluminum oxide, One or more of vinyl trimethoxysilane modified aluminum oxide. Its main function is to improve the thermal conductivity of insulating paint and enhance the heat dissipation effect of electronic and electrical products.
所述的引发剂为异丙苯过氧化氢、过氧化苯甲酰、N，N-二甲基苯胺中的一种或几种。其主要是在室温引发聚合反应，并延长产品的存储周期。 The initiator is one or more of cumene hydroperoxide, benzoyl peroxide and N,N-dimethylaniline. It mainly initiates the polymerization reaction at room temperature and prolongs the storage period of the product.
所述的无卤改性树脂为有机硅改性丙烯酸树脂、丙烯酸改性醇酸树脂、聚氨酯改性环氧树脂、聚氨酯改性丙烯酸树脂、有机硅改性醇酸树脂、有机硅改性聚氨酯、丙烯酸改性聚氨酯中的一种或几种。其主要作用是在绝缘漆固化后获得具有绝缘功能的薄膜层。 The halogen-free modified resin is silicone-modified acrylic resin, acrylic-modified alkyd resin, polyurethane-modified epoxy resin, polyurethane-modified acrylic resin, silicone-modified alkyd resin, silicone-modified polyurethane, One or more of acrylic modified polyurethane. Its main function is to obtain a thin film layer with insulating function after the insulating varnish is cured.
本发明阻燃型无卤散热绝缘漆的制备方法，包括如下步骤：（1）按重量百分比称取无卤改性树脂和20.0~48.0%稀释剂，倒入反应釜中以300转/分±50转/分的转速搅拌30分钟；（2）再依次加入1.0~4.0%无卤阻燃剂、0.5~5.0%散热增强剂、0.5~4.0%引发剂，以300转/分±50转/分的转速搅拌60分钟，即得本发明阻燃型无卤散热绝缘漆。 The preparation method of the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention comprises the following steps: (1) Weigh the halogen-free modified resin and 20.0~48.0% diluent by weight percentage, pour them into the reaction kettle at 300 rpm ± Stir at a speed of 50 rpm for 30 minutes; (2) Add 1.0~4.0% halogen-free flame retardant, 0.5~5.0% heat dissipation enhancer, 0.5~4.0% initiator in sequence, at 300 rpm ± 50 rpm Stir at a rotating speed of 10 minutes for 60 minutes to obtain the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention.
本发明相比现有技术具有如下优点：一是散热增强剂的添加使绝缘漆在具备较高的阻燃性、绝缘性和存储性的同时，还具有较好的散热性；二是本发明采用无卤阻燃剂等无卤原材料，制备出的绝缘漆满足无卤要求，更能满足市场要求。本发明具有较大的实用价值和市场潜力。 Compared with the prior art, the present invention has the following advantages: one is that the addition of the heat dissipation enhancer enables the insulating varnish to have better heat dissipation while possessing higher flame retardancy, insulation and storage properties; Using halogen-free flame retardants and other halogen-free raw materials, the insulating varnish prepared meets the halogen-free requirements and can better meet market requirements. The invention has great practical value and market potential.
具体实施方式 Detailed ways
实施例1：按以下方法制备本发明阻燃型无卤散热绝缘漆：（1）按重量百分比称取78.0%有机硅改性丙烯酸树脂、18.0%醋酸乙酯和2.0%十八烷基缩水甘油醚，倒入反应釜中以300转/分±50转/分的转速搅拌30分钟；（2）再依次加入1.0%三（1-氧代-1-磷杂-2，6，7-三氧杂双环[2，2，2]辛烷-4-亚甲基）磷酸酯、0.5%粉状纳米三氧化二铝、0.5%异丙苯过氧化氢，以300转/分±50转/分的转速搅拌60分钟，即得本发明阻燃型无卤散热绝缘漆。 Example 1: Prepare the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention as follows: (1) Weigh 78.0% organic silicon-modified acrylic resin, 18.0% ethyl acetate and 2.0% octadecyl glycidol by weight percentage Ether, pour it into the reaction kettle and stir for 30 minutes at a speed of 300 rpm ± 50 rpm; (2) Add 1.0% tris(1-oxo-1-phospha-2,6,7-tris Oxabicyclo[2,2,2]octane-4-methylene) phosphate, 0.5% powdered nano-alumina, 0.5% cumene hydroperoxide, at 300 rpm ± 50 rpm Stir at a rotating speed of 10 minutes for 60 minutes to obtain the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention.
实施例2：按以下方法制备本发明阻燃型无卤散热绝缘漆：（1）按重量百分比称取56.2%丙烯酸改性聚氨酯、30.0%醋酸丁酯和5.0%异丙醇，倒入反应釜中以300转/分±50转/分的转速搅拌30分钟；（2）再依次加入2.5%1-氧-4-羟甲基-2，6，7-三氧杂-1-磷杂双环[2，2，2]辛烷、3.5% N-(β一氨乙基)-γ-氨丙基三甲(乙)氧基硅烷改性三氧化二铝、2.8%N，N-二甲基苯胺，以300转/分±50转/分的转速搅拌60分钟，即得本发明阻燃型无卤散热绝缘漆。 Example 2: The flame-retardant halogen-free heat-dissipating insulating varnish of the present invention is prepared according to the following method: (1) Weigh 56.2% acrylic modified polyurethane, 30.0% butyl acetate and 5.0% isopropanol by weight percentage, and pour them into a reaction kettle Stir at 300 rpm ± 50 rpm for 30 minutes; (2) Add 2.5% 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo [2,2,2]octane, 3.5% N-(β-aminoethyl)-γ-aminopropyltrimethyl(ethyl)oxysilane modified aluminum oxide, 2.8% N,N-dimethyl Aniline was stirred at a speed of 300 rpm ± 50 rpm for 60 minutes to obtain the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention.
实施例3：按以下方法制备本发明阻燃型无卤散热绝缘漆：（1）按重量百分比称取56.2%有机硅改性醇酸树脂和48.0%醋酸丁酯，倒入反应釜中以300转/分±50转/分的转速搅拌30分钟；（2）再依次加入4.0% N，N-对苯二胺基（2-羟基）二苄基磷酸四乙酯、5.0%乙烯基三甲氧基硅烷改性三氧化二铝、4.0%异丙苯过氧化氢，以300转/分±50转/分的转速搅拌60分钟，即得本发明阻燃型无卤散热绝缘漆。 Example 3: The flame-retardant halogen-free heat-dissipating insulating varnish of the present invention is prepared according to the following method: (1) Weigh 56.2% organosilicon-modified alkyd resin and 48.0% butyl acetate by weight percentage, pour it into a reaction kettle with 300 Stir for 30 minutes at a speed of rpm ± 50 rpm; (2) Add 4.0% N, N-p-phenylenediamine (2-hydroxyl) tetraethyl dibenzyl phosphate, 5.0% vinyl trimethoxy Silane-modified aluminum oxide, 4.0% cumene hydroperoxide, and stirred at a speed of 300 rpm ± 50 rpm for 60 minutes to obtain the flame-retardant halogen-free heat-dissipating insulating varnish of the present invention.
表1为本发明实施例1-3与一款市售绝缘漆的主要性能试验对比数据。 Table 1 shows the comparison data of main performance tests between Examples 1-3 of the present invention and a commercially available insulating varnish.
表1 实施例1-3的主要性能试验结果对比数据 The main performance test result comparative data of table 1 embodiment 1-3
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| CN109868030A (en) * | 2018-12-25 | 2019-06-11 | 蔡冠之 | A kind of coatings and its application method and application |
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