CN103517543A - Circuit board structure and backlight module using same - Google Patents
Circuit board structure and backlight module using same Download PDFInfo
- Publication number
- CN103517543A CN103517543A CN201210206664.4A CN201210206664A CN103517543A CN 103517543 A CN103517543 A CN 103517543A CN 201210206664 A CN201210206664 A CN 201210206664A CN 103517543 A CN103517543 A CN 103517543A
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- China
- Prior art keywords
- circuit
- conducting wire
- board structure
- wire pattern
- base material
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Abstract
The invention provides a circuit board structure which comprises a substrate, conductive circuit patterns formed on the substrate, and a protective layer covering the conductive circuit patterns. The conductive circuit patterns are evaporated in areas, needing to be electrically connected, of the substrate. The protective layer is provided with openings corresponding to positions, in which electronic components need to be installed, of the conductive circuit patterns. The invention further provides a backlight module using the circuit board structure.
Description
Technical field
The present invention relates to a kind of board structure of circuit and use the backlight module of this board structure of circuit.
Background technology
General circuit board need to be folded in the conductive layer that is provided with circuit pattern in the middle of a plurality of sheet materials conventionally.Therefore, when making circuit board, need to carry out pressing repeatedly, comparatively elapsed time.And sandwich construction causes the thermal resistance of circuit board integral body higher, thereby cause heat dissipation for circuit board difficulty.
Summary of the invention
Given this, be necessary to provide a kind of simple in structure, make board structure of circuit easily and use the backlight module of this board structure of circuit.
, the protective layer that it comprises base material, is formed on base material Shang conducting wire pattern and covers described conducting wire pattern.Described conducting wire pattern is deposited on needs the subregion that is electrically connected on described base material.On described protective layer, corresponding conducting wire pattern needs the position of installing electronic elements to offer opening.
, it comprises framework, board structure of circuit, is arranged on the light source on described board structure of circuit and is arranged on the light guide plate on described board structure of circuit.
Described framework comprise horizontally disposed the first supporting part and with vertical the second supporting part being connected of described the first supporting part.
Described board structure of circuit comprises base material, conducting wire pattern and protective layer.Described base material comprise be arranged on the first supporting part Shang support portion, be arranged on the second supporting part for circuit and the connecting portion that extended away from one end of support portion by electrical connection section.Described conducting wire pattern is deposited on described electrical connection section.Described protective layer covers described conducting wire pattern.
On described protective layer to offering a plurality of openings to expose conducting wire pattern in requisition for the position that light source is installed.Described light source is arranged on the conducting wire pattern exposing by opening.
Described light guide plate comprise the incidence surface that be arranged in parallel and exiting surface and with described exiting surface and the vertical incidence surface being connected of reflecting surface.Described incidence surface is towards light source setting.Described reflecting surface is set directly on described support portion.Described connecting portion is connected on described exiting surface away from one end of circuit connecting section.
With respect to prior art, board structure of circuit provided by the present invention directly needs the place of mounting circuit element to adopt the method for evaporation to form conducting wire pattern protective mulch on base material, has improved the production efficiency of circuit board.And can select as required different base materials, thus circuit structure and other function element are combined as a whole, improve the applicability of board structure of circuit.
Accompanying drawing explanation
The structural representation of the board structure of circuit that Fig. 1 provides for embodiment of the present invention.
The backlight module of board structure of circuit in use Fig. 1 that Fig. 2 provides for the invention process side examination.
Main element symbol description
| Board structure of circuit | 1 |
| |
10 |
| Conducting |
12 |
| |
14 |
| |
140 |
| |
100 |
| |
102 |
| Connecting |
104 |
| |
2 |
| Framework | 3 |
| Light guide plate | 4 |
| |
5 |
| The first supporting |
30 |
| The second supporting |
32 |
| Exiting |
40 |
| Reflecting |
42 |
| |
44 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, the board structure of circuit 1 that embodiment of the present invention provides comprises base material 10, conducting wire pattern 12 and protective layer 14.Described conducting wire pattern 12 is arranged on the upper surface of described base material 10.Described protective layer 14 covers described conducting wire pattern 12.On described protective layer 14, corresponding conducting wire pattern 12 needs external part to offer opening 140(referring to Fig. 2) to expose conducting wire pattern 12.
Described conducting wire pattern 12 is formed on described base material 10 by evaporation processing procedure.Described evaporation processing procedure can adopt physical vapour deposition (PVD) (Physical Vapor Deposition, PVD) or chemical vapour deposition (CVD) (Chemical Vapor Deposition, CVD), when making, according to the concrete material of conducting wire pattern 12 and the equipment that has, select to adopt which kind of evaporation coating method.
Described protective layer 14 is insulating material, and it can be by the method drape forming Hao conducting wire pattern 12 of coating or evaporation.Opening 140 on described protective layer 14 can form by the method for shade is set in the position that needs opening when making.
Described base material 10 can adopt high-strength material, high thermal conductivity coefficient material, highly reflective material or flexible material etc. according to the concrete application demand of board structure of circuit 1.
The backlight module 2 of the described board structure of circuit 1 of employing that as shown in Figure 2, embodiment of the present invention provides.Described backlight module 2 comprises framework 3, board structure of circuit 1, light guide plate 4 and light source 5.Described board structure of circuit 1 arranges on the inner surface of framework 3.Described light guide plate 4 is arranged on board structure of circuit 1.Described light source 5 is arranged on board structure of circuit 1.In the present embodiment, described light source 5 is light-emitting diode chip for backlight unit.
Described framework 3 comprises the first supporting part 30 and the second supporting part 32.Described the first supporting part 30 is a horizontally disposed flat board, and it is for carrying described light guide plate 4.Described the second supporting part 32 is a vertically disposed flat board, and it is connected to carry described light source 5 with the wherein side of described the first supporting part 30 is vertical.
The base material 10 of described board structure of circuit 1 comprises that correspondence is arranged on that the first supporting part 30Shang support portion 100, correspondence are arranged on electrical connection section 102 on the second supporting part 32 and for connecting the connecting portion 104 at described electrical connection section 102 tops and light guide plate 4 tops.In the present embodiment, described base material 10 is made by highly reflective material.Described base material 10 is one continuous whole and form described support portion 100, electrical connection section 102 and connecting portion 104 by bending processing procedure.Described board structure of circuit 1 is only formed with conducting wire pattern 12 and covers the protective layer 14 of conducting wire pattern 12 on described electrical connection section 102.14 pairs of described protective layers offer opening 140 to expose conducting wire pattern 12 in requisition for the position that light source 5 is set.Described light source 5 is directly installed on the conducting wire pattern 12 exposing by opening 140.
Described light guide plate 4 comprise the exiting surface 40 that is arranged in parallel and reflecting surface 42 and with described exiting surface 40 and the vertical incidence surface being connected 44 of reflecting surface 42.The light source 5 of described incidence surface 44 on board structure of circuit 10.The reflecting surface 42 of described light guide plate 4 is set directly on described support portion 100.The reflecting element of light guide plate 4 belows is directly served as in described support portion 100, with by the light reflection in light guide plate 4 to incidence surface 44.Described connecting portion 104 is connected to the top of described light guide plate 4 away from electrical connection section 102 one end, thereby to improve the utilization ratio of light by not being mapped to light reflection on incidence surface 44 incidence surface 44 that goes back.
Board structure of circuit 1 provided by the present invention directly needs the place of mounting circuit element to adopt the method for evaporation to form conducting wire pattern 12 protective mulch 14 on base material 10, has improved the production efficiency of circuit board.And can select as required different base material 10, thus circuit structure and other function element are combined as a whole, improve the applicability of board structure of circuit 1.
Those skilled in the art will be appreciated that; above execution mode is only for the present invention is described; and be not used as limitation of the invention; as long as within connotation scope of the present invention, within the appropriate change that above embodiment is done and variation all drop on the scope of protection of present invention.
Claims (10)
1. a board structure of circuit; the protective layer that it comprises base material, is formed on base material Shang conducting wire pattern and covers described conducting wire pattern; described conducting wire pattern is deposited on needs the subregion that is electrically connected on described base material, on described protective layer, corresponding conducting wire pattern needs the position of installing electronic elements to offer opening.
2. board structure of circuit as claimed in claim 1, is characterized in that: described evaporation coating method is selected from the combination of physical vapour deposition (PVD) and chemical vapour deposition (CVD).
3. board structure of circuit as claimed in claim 1, is characterized in that: described protective layer is insulating material.
4. board structure of circuit as claimed in claim 1, is characterized in that: described base material is selected from high-strength material, high thermal conductivity coefficient material, highly reflective material and flexible material.
5. a backlight module, it comprises:
Framework, it comprise horizontally disposed the first supporting part and with vertical the second supporting part being connected of described the first supporting part;
Board structure of circuit, it comprises base material, conducting wire pattern and protective layer, described base material comprises and is arranged on the first supporting part Shang support portion and is arranged on the electrical connection section on the second supporting part, described conducting wire pattern is deposited on described electrical connection section, and described protective layer covers described conducting wire pattern;
Be arranged on the light source on board structure of circuit, on described protective layer, to offering a plurality of openings to expose conducting wire pattern in requisition for the position that light source is installed, described light source is arranged on the conducting wire pattern exposing by opening; And
Be arranged on the light guide plate on board structure of circuit, it comprises the exiting surface that is oppositely arranged and reflecting surface and the incidence surface being connected with described exiting surface and reflecting surface, and described incidence surface is towards light source setting.
6. backlight module as claimed in claim 5, is characterized in that: described light source is light-emitting diode chip for backlight unit.
7. backlight module as claimed in claim 6, is characterized in that: described base material is made by highly reflective material, and described reflecting surface is set directly on described support portion, and light guide plate is returned the light reflection that is mapped to this base material in described support portion.
8. backlight module as claimed in claim 7, is characterized in that: described base material further comprises the connecting portion being extended away from one end of support portion by electrical connection section, and described connecting portion is connected on described exiting surface away from one end of circuit connecting section.
9. backlight module as claimed in claim 5, is characterized in that: described evaporation coating method is selected from the combination of physical vapour deposition (PVD) and chemical vapour deposition (CVD).
10. backlight module as claimed in claim 5, is characterized in that: described protective layer is insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210206664.4A CN103517543A (en) | 2012-06-21 | 2012-06-21 | Circuit board structure and backlight module using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210206664.4A CN103517543A (en) | 2012-06-21 | 2012-06-21 | Circuit board structure and backlight module using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103517543A true CN103517543A (en) | 2014-01-15 |
Family
ID=49899305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210206664.4A Pending CN103517543A (en) | 2012-06-21 | 2012-06-21 | Circuit board structure and backlight module using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103517543A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105386004A (en) * | 2015-10-23 | 2016-03-09 | 衢州顺络电路板有限公司 | Circuit board for replacing connecting finger and manufacturing method of circuit board |
-
2012
- 2012-06-21 CN CN201210206664.4A patent/CN103517543A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105386004A (en) * | 2015-10-23 | 2016-03-09 | 衢州顺络电路板有限公司 | Circuit board for replacing connecting finger and manufacturing method of circuit board |
| CN105386004B (en) * | 2015-10-23 | 2018-11-13 | 衢州顺络电路板有限公司 | Replace the wiring board and its manufacturing method of golden finger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140115 |