CN1051198C - 电阻金属层及其制造方法 - Google Patents

电阻金属层及其制造方法 Download PDF

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Publication number
CN1051198C
CN1051198C CN89102522A CN89102522A CN1051198C CN 1051198 C CN1051198 C CN 1051198C CN 89102522 A CN89102522 A CN 89102522A CN 89102522 A CN89102522 A CN 89102522A CN 1051198 C CN1051198 C CN 1051198C
Authority
CN
China
Prior art keywords
layer
electroplate liquid
lamination
source
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN89102522A
Other languages
English (en)
Chinese (zh)
Other versions
CN1040298A (zh
Inventor
悉尼·丁克劳沙
李金和
玛丽·凯瑟琳·普罗科普
克里斯托弗·J·休威尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of CN1040298A publication Critical patent/CN1040298A/zh
Application granted granted Critical
Publication of CN1051198C publication Critical patent/CN1051198C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques
    • H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by chemical deposition
    • H01C17/16—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by chemical deposition using electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
CN89102522A 1988-02-26 1989-02-24 电阻金属层及其制造方法 Expired - Fee Related CN1051198C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US16079588A 1988-02-26 1988-02-26
US16079488A 1988-02-26 1988-02-26
US160,794 1988-02-26
US160,795 1988-02-26
US30749389A 1989-02-09 1989-02-09
US307,493 1989-02-09

Publications (2)

Publication Number Publication Date
CN1040298A CN1040298A (zh) 1990-03-07
CN1051198C true CN1051198C (zh) 2000-04-05

Family

ID=27388511

Family Applications (1)

Application Number Title Priority Date Filing Date
CN89102522A Expired - Fee Related CN1051198C (zh) 1988-02-26 1989-02-24 电阻金属层及其制造方法

Country Status (9)

Country Link
EP (2) EP0330210A3 (2)
JP (1) JP3022969B2 (2)
KR (1) KR920007430B1 (2)
CN (1) CN1051198C (2)
AU (1) AU622637B2 (2)
BR (1) BR8900871A (2)
IL (1) IL89407A0 (2)
IN (1) IN171824B (2)
MY (1) MY104939A (2)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US6281090B1 (en) * 1996-10-16 2001-08-28 Macdermid, Incorporated Method for the manufacture of printed circuit boards with plated resistors
US6194990B1 (en) * 1999-03-16 2001-02-27 Motorola, Inc. Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
US6622374B1 (en) * 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
EP1261241A1 (en) * 2001-05-17 2002-11-27 Shipley Co. L.L.C. Resistor and printed wiring board embedding those resistor
JP4761792B2 (ja) * 2005-03-02 2011-08-31 ローム株式会社 低抵抗のチップ抵抗器とその製造方法
CN100397960C (zh) * 2005-04-08 2008-06-25 神基科技股份有限公司 印刷电路板结构及其制造方法
JP4487875B2 (ja) 2005-07-20 2010-06-23 セイコーエプソン株式会社 電子基板の製造方法及び電気光学装置の製造方法並びに電子機器の製造方法
CN119325191B (zh) * 2024-12-18 2025-05-23 安徽华威铜箔科技有限公司 一种埋阻铜箔及其制备方法和电子产品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2165622C3 (de) * 1971-12-30 1979-01-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Dünnschichtschaltkreis
US3886578A (en) * 1973-02-26 1975-05-27 Multi State Devices Ltd Low ohmic resistance platinum contacts for vanadium oxide thin film devices
JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers
JPS6016117B2 (ja) * 1982-06-16 1985-04-23 日東電工株式会社 抵抗体付き回路基板とその製造法
US4532186A (en) * 1982-06-16 1985-07-30 Nitto Electric Industrial Co., Ltd. Circuit substrate with resistance layer and process for producing the same
US4808967A (en) * 1985-05-29 1989-02-28 Ohmega Electronics Circuit board material
US4682143A (en) * 1985-10-30 1987-07-21 Advanced Micro Devices, Inc. Thin film chromium-silicon-carbon resistor

Also Published As

Publication number Publication date
EP0330210A3 (en) 1990-11-07
AU622637B2 (en) 1992-04-16
IL89407A0 (en) 1989-09-10
EP1011111A1 (en) 2000-06-21
BR8900871A (pt) 1989-10-17
JPH01309301A (ja) 1989-12-13
EP0330210A2 (en) 1989-08-30
KR890013225A (ko) 1989-09-22
KR920007430B1 (ko) 1992-08-31
JP3022969B2 (ja) 2000-03-21
IN171824B (2) 1993-01-23
MY104939A (en) 1994-07-30
CN1040298A (zh) 1990-03-07
AU3075289A (en) 1989-08-31

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee