CN105585937B - 环氧树脂组合物 - Google Patents

环氧树脂组合物 Download PDF

Info

Publication number
CN105585937B
CN105585937B CN201510738266.0A CN201510738266A CN105585937B CN 105585937 B CN105585937 B CN 105585937B CN 201510738266 A CN201510738266 A CN 201510738266A CN 105585937 B CN105585937 B CN 105585937B
Authority
CN
China
Prior art keywords
component
epoxy resin
mass
parts
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510738266.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN105585937A (zh
Inventor
田泽由衣
坂本宽树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Three Bond Fine Chemical Co Ltd
Original Assignee
Three Bond Fine Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Fine Chemical Co Ltd filed Critical Three Bond Fine Chemical Co Ltd
Publication of CN105585937A publication Critical patent/CN105585937A/zh
Application granted granted Critical
Publication of CN105585937B publication Critical patent/CN105585937B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
CN201510738266.0A 2014-11-12 2015-11-03 环氧树脂组合物 Active CN105585937B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014229500 2014-11-12
JP2014-229500 2014-11-12

Publications (2)

Publication Number Publication Date
CN105585937A CN105585937A (zh) 2016-05-18
CN105585937B true CN105585937B (zh) 2020-01-03

Family

ID=55925854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510738266.0A Active CN105585937B (zh) 2014-11-12 2015-11-03 环氧树脂组合物

Country Status (3)

Country Link
JP (1) JP6849899B2 (ko)
KR (1) KR102359684B1 (ko)
CN (1) CN105585937B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7814666B2 (ja) * 2022-03-07 2026-02-17 味の素株式会社 硬化性樹脂組成物、接着剤、および接着方法
JP2024140652A (ja) * 2023-03-28 2024-10-10 味の素株式会社 組成物、接着剤、硬化物及び電子部品

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501258B2 (ja) * 1991-08-30 1996-05-29 住友ベークライト株式会社 絶縁樹脂ペ―スト
EP0872504A1 (en) * 1995-08-04 1998-10-21 Asahi Denka Kogyo Kabushiki Kaisha Curable epoxy resin composition which gives flexible cured article
JPH0987363A (ja) * 1995-09-25 1997-03-31 Nippon Zeon Co Ltd 光硬化性組成物、シール材、シール方法、および液晶封止体
JPH11106483A (ja) * 1997-09-30 1999-04-20 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPH11256013A (ja) * 1998-03-12 1999-09-21 Ajinomoto Co Inc エポキシ樹脂組成物
DE102006033136A1 (de) * 2006-07-18 2008-01-31 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
WO2008078706A1 (ja) * 2006-12-22 2008-07-03 Denki Kagaku Kogyo Kabushiki Kaisha 非晶質シリカ質粉末、その製造方法及び半導体封止材
CN101679613A (zh) * 2007-06-15 2010-03-24 积水化学工业株式会社 光半导体元件用密封剂及光半导体元件
CN101386700A (zh) * 2007-09-12 2009-03-18 德古萨有限责任公司 包含煅制二氧化硅的可固化组合物
JP5441447B2 (ja) * 2009-03-06 2014-03-12 ソマール株式会社 電子部品用絶縁塗料およびこれを利用した電子部品
JP4839392B2 (ja) 2009-05-07 2011-12-21 ルネサスエレクトロニクス株式会社 固体撮像装置
EP2635619A1 (en) * 2010-11-05 2013-09-11 Henkel Ireland Limited Epoxy-thiol compositions with improved stability
CN103282401A (zh) * 2011-01-05 2013-09-04 纳美仕有限公司 树脂组合物
JP5598343B2 (ja) * 2011-01-17 2014-10-01 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び半導体装置
JP5855420B2 (ja) * 2011-10-27 2016-02-09 株式会社タムラ製作所 導電性樹脂組成物及び導電性樹脂組成物を用いたプリント配線板
JP2015042696A (ja) * 2011-12-22 2015-03-05 味の素株式会社 導電性接着剤
JP5929466B2 (ja) 2012-04-23 2016-06-08 味の素株式会社 樹脂組成物
JP5716871B2 (ja) * 2012-11-28 2015-05-13 味の素株式会社 樹脂硬化剤および一液性エポキシ樹脂組成物

Also Published As

Publication number Publication date
JP2016102206A (ja) 2016-06-02
KR102359684B1 (ko) 2022-02-07
KR20160056784A (ko) 2016-05-20
CN105585937A (zh) 2016-05-18
JP6849899B2 (ja) 2021-03-31

Similar Documents

Publication Publication Date Title
JP6534189B2 (ja) 樹脂組成物
JP6216345B2 (ja) 樹脂組成物
TWI827873B (zh) 環氧樹脂組成物
US10472460B2 (en) Use of substituted benzyl alcohols in reactive epoxy systems
KR102555587B1 (ko) 에폭시 수지 조성물
CN112823177B (zh) 树脂组合物
TWI817988B (zh) 環氧樹脂組成物
WO2017043405A1 (ja) 樹脂組成物
JP2019156965A (ja) エポキシ樹脂組成物
CN109563238B (zh) 环氧树脂组合物以及含有其的导电性胶粘剂
CN105585937B (zh) 环氧树脂组合物
TWI801488B (zh) 樹脂組成物及其硬化物、電子零件用接著劑、半導體裝置，以及電子零件
JP6439924B2 (ja) 熱伝導性樹脂組成物
WO2018159564A1 (ja) 樹脂組成物
JP2006022146A (ja) 硬化性樹脂組成物
WO2025023048A1 (ja) エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
JP5279036B2 (ja) 新規エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
JP5159684B2 (ja) 熱硬化性樹脂組成物
KR102187518B1 (ko) 에폭시 수지 조성물
JP2021031666A (ja) エポキシ樹脂組成物
JP7107802B2 (ja) 樹脂組成物
JP2018109085A (ja) シリコーン樹脂組成物及び光半導体装置
CN119585336A (zh) 环氧树脂组合物
JP2016008303A (ja) エポキシ樹脂組成物、接着剤、硬化物及び電子部材

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant