CN1075000C - 印模材料 - Google Patents

印模材料 Download PDF

Info

Publication number: CN1075000C
Authority: CN; China
Prior art keywords: impression; photosensitive resin; resin; base; stamp
Prior art date: 1995-03-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CN96107307A

Other languages

English (en)

Chinese (zh)

Other versions

CN1139620A (zh

Inventor

栗山弘

小平洋一

行田幸三

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Seiko Epson Corp

Original Assignee

Seiko Epson Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-03-30

Filing date

1996-03-29

Publication date

2001-11-21

1996-03-29 Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp

1997-01-08 Publication of CN1139620A publication Critical patent/CN1139620A/zh

2001-11-21 Application granted granted Critical

2001-11-21 Publication of CN1075000C publication Critical patent/CN1075000C/zh

2016-03-29 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

239000000463 material Substances 0.000 title claims abstract description 126
229920005989 resin Polymers 0.000 claims abstract description 133
239000011347 resin Substances 0.000 claims abstract description 133
239000002023 wood Substances 0.000 claims abstract description 18
239000007787 solid Substances 0.000 claims abstract description 9
239000012790 adhesive layer Substances 0.000 claims description 25
239000000853 adhesive Substances 0.000 claims description 22
230000001070 adhesive effect Effects 0.000 claims description 22
229920002050 silicone resin Polymers 0.000 claims description 7
230000007423 decrease Effects 0.000 claims description 3
239000005022 packaging material Substances 0.000 abstract description 7
239000010410 layer Substances 0.000 description 38
238000009423 ventilation Methods 0.000 description 8
238000003860 storage Methods 0.000 description 6
230000000903 blocking effect Effects 0.000 description 5
229920006267 polyester film Polymers 0.000 description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
230000006866 deterioration Effects 0.000 description 4
238000000034 method Methods 0.000 description 4
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
239000002390 adhesive tape Substances 0.000 description 3
230000007246 mechanism Effects 0.000 description 3
230000002093 peripheral effect Effects 0.000 description 3
238000004382 potting Methods 0.000 description 3
239000003566 sealing material Substances 0.000 description 3
206010034972 Photosensitivity reaction Diseases 0.000 description 2
230000009471 action Effects 0.000 description 2
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
230000008901 benefit Effects 0.000 description 2
238000001514 detection method Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
239000012528 membrane Substances 0.000 description 2
239000001301 oxygen Substances 0.000 description 2
229910052760 oxygen Inorganic materials 0.000 description 2
230000035699 permeability Effects 0.000 description 2
230000036211 photosensitivity Effects 0.000 description 2
230000008569 process Effects 0.000 description 2
238000007789 sealing Methods 0.000 description 2
239000000758 substrate Substances 0.000 description 2
BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
238000004804 winding Methods 0.000 description 2
239000004925 Acrylic resin Substances 0.000 description 1
229920000178 Acrylic resin Polymers 0.000 description 1
239000004677 Nylon Substances 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
230000008094 contradictory effect Effects 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
230000002542 deteriorative effect Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000008393 encapsulating agent Substances 0.000 description 1
239000012530 fluid Substances 0.000 description 1
238000011010 flushing procedure Methods 0.000 description 1
239000011888 foil Substances 0.000 description 1
239000007789 gas Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
239000007791 liquid phase Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000004745 nonwoven fabric Substances 0.000 description 1
229920001778 nylon Polymers 0.000 description 1
238000004321 preservation Methods 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000005871 repellent Substances 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000007790 solid phase Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1

Images

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Manufacture Or Reproduction Of Printing Formes (AREA)

CN96107307A 1995-03-30 1996-03-29 印模材料 Expired - Fee Related CN1075000C (zh)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
JP99775/95		1995-03-30
JP99775/1995		1995-03-30
JP9977595		1995-03-30
JP35242/96		1996-02-22
JP8035242A JPH08324087A (ja)	1995-03-30	1996-02-22	スタンプ素材およびスタンプ素材用パッケージ
JP35242/1996		1996-02-22

Publications (2)

Publication Number	Publication Date
CN1139620A CN1139620A (zh)	1997-01-08
CN1075000C true CN1075000C (zh)	2001-11-21

Family

ID=26374192

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN96107307A Expired - Fee Related CN1075000C (zh)	1995-03-30	1996-03-29	印模材料

Country Status (5)

Country	Link
US (1)	US5915299A (2)
JP (1)	JPH08324087A (2)
KR (1)	KR100203543B1 (2)
CN (1)	CN1075000C (2)
TW (1)	TW314491B (2)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6460456B1 (en) *	1999-03-31	2002-10-08	Brother Kogo Kabushiki Kaisha	Stamp making apparatus and attachment thereof
KR100689166B1 (ko) *	1999-07-06	2007-03-08	부라더 고교 가부시키가이샤	스탬프용 도장 부재 및 이를 이용한 스탬프 유닛
US6371022B1 (en) *	1999-07-31	2002-04-16	Enid R. Crystal	Detachable handle for inkpads
US6732649B1 (en) *	1999-09-28	2004-05-11	Alexander C. Wall	Methods for providing custom rubber stamps
WO2003014832A1 (en) *	2001-08-10	2003-02-20	Paul Mayo Holt	Methods and apparatus for use in photopolymer plate manufacture
GB2372575B (en) *	2001-08-10	2003-01-15	Chemence Ltd	Method for forming a sachet
US10029396B2 (en) *	2014-10-30	2018-07-24	Shachihata Inc.	Seal carving apparatus and thermal carving machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5085027A (2) *	1973-12-03	1975-07-09
JPH0585027A (ja) *	1991-09-27	1993-04-06	Taisei Plus Kk	押印具の製造方法及び押印具材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3317126B2 (ja) *	1995-03-30	2002-08-26	セイコーエプソン株式会社	スタンプ素材およびスタンプ素材の作成方法

1996
- 1996-02-22 JP JP8035242A patent/JPH08324087A/ja active Pending
- 1996-03-18 TW TW085103215A patent/TW314491B/zh not_active IP Right Cessation
- 1996-03-28 KR KR1019960008685A patent/KR100203543B1/ko not_active Expired - Fee Related
- 1996-03-28 US US08/623,403 patent/US5915299A/en not_active Expired - Fee Related
- 1996-03-29 CN CN96107307A patent/CN1075000C/zh not_active Expired - Fee Related

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5085027A (2) *	1973-12-03	1975-07-09
JPH0585027A (ja) *	1991-09-27	1993-04-06	Taisei Plus Kk	押印具の製造方法及び押印具材料

Also Published As

Publication number	Publication date
KR100203543B1 (ko)	1999-06-15
TW314491B (2)	1997-09-01
JPH08324087A (ja)	1996-12-10
US5915299A (en)	1999-06-29
CN1139620A (zh)	1997-01-08

Legal Events

Date	Code	Title	Description
1996-12-18	C10	Entry into substantive examination
1996-12-18	SE01	Entry into force of request for substantive examination
1997-01-08	C06	Publication
1997-01-08	PB01	Publication
1997-04-02	C10	Entry into substantive examination
1997-04-02	SE01	Entry into force of request for substantive examination
2001-11-21	C14	Grant of patent or utility model
2001-11-21	GR01	Patent grant
2011-06-01	C17	Cessation of patent right
2011-06-01	CF01	Termination of patent right due to non-payment of annual fee	Granted publication date: 20011121 Termination date: 20100329

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