CN111149197B - 吸附平台 - Google Patents

吸附平台 Download PDF

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Publication number
CN111149197B
CN111149197B CN201880062674.0A CN201880062674A CN111149197B CN 111149197 B CN111149197 B CN 111149197B CN 201880062674 A CN201880062674 A CN 201880062674A CN 111149197 B CN111149197 B CN 111149197B
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CN
China
Prior art keywords
adsorption
check valve
valve
vacuum
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880062674.0A
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English (en)
Chinese (zh)
Other versions
CN111149197A (zh
Inventor
小林泰人
马诘邦彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Intelligent Machinery Co ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN111149197A publication Critical patent/CN111149197A/zh
Application granted granted Critical
Publication of CN111149197B publication Critical patent/CN111149197B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN201880062674.0A 2017-09-28 2018-09-18 吸附平台 Active CN111149197B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-188635 2017-09-28
JP2017188635 2017-09-28
PCT/JP2018/034388 WO2019065355A1 (fr) 2017-09-28 2018-09-18 Étage de fixation par aspiration

Publications (2)

Publication Number Publication Date
CN111149197A CN111149197A (zh) 2020-05-12
CN111149197B true CN111149197B (zh) 2023-06-02

Family

ID=65901325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880062674.0A Active CN111149197B (zh) 2017-09-28 2018-09-18 吸附平台

Country Status (6)

Country Link
JP (1) JP6817658B2 (fr)
KR (1) KR102339079B1 (fr)
CN (1) CN111149197B (fr)
SG (1) SG11202004896TA (fr)
TW (1) TWI684223B (fr)
WO (1) WO2019065355A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102788896B1 (ko) * 2020-04-01 2025-04-02 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP7630956B2 (ja) * 2020-10-30 2025-02-18 三星電子株式会社 半導体製造装置およびチップハンドリング方法
KR102787801B1 (ko) * 2020-11-24 2025-03-31 주식회사 기가레인 흡착 플레이트
KR102630948B1 (ko) * 2020-12-29 2024-01-30 세메스 주식회사 반도체 패키지 이송 방법과 반도체 패키지 이송 모듈 및 반도체 패키지 절단 및 분류 장치
CN114939852B (zh) * 2022-06-06 2023-02-24 深圳宜美智科技股份有限公司 高精度可移动真空吸附平台及高精度检测设备
KR102893069B1 (ko) * 2024-06-14 2025-12-01 양진석 다이 이송 장치 및 다이 이송 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0490946U (fr) * 1990-12-26 1992-08-07
JP2009212254A (ja) * 2008-03-04 2009-09-17 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
CN101794726A (zh) * 2009-02-02 2010-08-04 优志旺电机株式会社 工件台及使用该工件台的曝光装置
CN103904013A (zh) * 2012-12-28 2014-07-02 上海微电子装备有限公司 一种真空吸附装置及吸附测校方法
JP2015013737A (ja) * 2013-07-08 2015-01-22 三菱電機株式会社 ワーク吸着装置およびワーク吸着方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618250A (ja) * 1984-06-23 1986-01-14 Mitsubishi Electric Corp 真空吸着台
JPH081464A (ja) * 1992-06-17 1996-01-09 Shibayama Kikai Kk ユニバーサルチャック機構の自動切換装置
WO2007114331A1 (fr) * 2006-04-04 2007-10-11 Miraial Co., Ltd. Recipient a plaques minces
JP2009200377A (ja) * 2008-02-25 2009-09-03 Panasonic Corp ダイボンディング装置
TWI529829B (zh) * 2011-05-27 2016-04-11 東麗工程股份有限公司 Installation method and installation device
JP5815345B2 (ja) 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5953068B2 (ja) * 2012-02-29 2016-07-13 ファスフォードテクノロジ株式会社 電子部品の載置テーブルと同テーブルを備えたダイボンダ
JP2013232466A (ja) * 2012-04-27 2013-11-14 Mitsuboshi Diamond Industrial Co Ltd 基板吸着装置
AT517792A3 (de) * 2013-09-26 2018-04-15 Suss Microtec Lithography Gmbh Aufspannvorrichtung zum Ansaugen und Halten eines Wafers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0490946U (fr) * 1990-12-26 1992-08-07
JP2009212254A (ja) * 2008-03-04 2009-09-17 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
CN101794726A (zh) * 2009-02-02 2010-08-04 优志旺电机株式会社 工件台及使用该工件台的曝光装置
CN103904013A (zh) * 2012-12-28 2014-07-02 上海微电子装备有限公司 一种真空吸附装置及吸附测校方法
JP2015013737A (ja) * 2013-07-08 2015-01-22 三菱電機株式会社 ワーク吸着装置およびワーク吸着方法

Also Published As

Publication number Publication date
KR20200051815A (ko) 2020-05-13
JPWO2019065355A1 (ja) 2020-07-30
SG11202004896TA (en) 2020-06-29
JP6817658B2 (ja) 2021-01-27
CN111149197A (zh) 2020-05-12
TW201921522A (zh) 2019-06-01
TWI684223B (zh) 2020-02-01
WO2019065355A1 (fr) 2019-04-04
KR102339079B1 (ko) 2021-12-14

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Effective date of registration: 20251216

Address after: Tokyo, Japan

Patentee after: Yamaha Intelligent Machinery Co.,Ltd.

Country or region after: Japan

Address before: Japan, Tokyo, Musashino City, Inahira 2-chome 51-banchi no 1 (Postal code: 208-8585)

Patentee before: SHINKAWA Ltd.

Country or region before: Japan