CN112655282A - 带有端子的电路基板和电路基板组件 - Google Patents

带有端子的电路基板和电路基板组件 Download PDF

Info

Publication number
CN112655282A
CN112655282A CN201980051922.6A CN201980051922A CN112655282A CN 112655282 A CN112655282 A CN 112655282A CN 201980051922 A CN201980051922 A CN 201980051922A CN 112655282 A CN112655282 A CN 112655282A
Authority
CN
China
Prior art keywords
circuit board
sub
terminal
board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980051922.6A
Other languages
English (en)
Chinese (zh)
Inventor
樱井洋平
土桥大亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiseisha
Original Assignee
Taiseisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiseisha filed Critical Taiseisha
Publication of CN112655282A publication Critical patent/CN112655282A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Details Of Aerials (AREA)
  • Multi-Conductor Connections (AREA)
CN201980051922.6A 2018-08-07 2019-07-08 带有端子的电路基板和电路基板组件 Pending CN112655282A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-148540 2018-08-07
JP2018148540A JP7210186B2 (ja) 2018-08-07 2018-08-07 回路基板組立体
PCT/JP2019/026993 WO2020031584A1 (fr) 2018-08-07 2019-07-08 Carte de circuit imprimé dotée d'une borne et ensemble carte de circuit imprimé

Publications (1)

Publication Number Publication Date
CN112655282A true CN112655282A (zh) 2021-04-13

Family

ID=69413745

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980051922.6A Pending CN112655282A (zh) 2018-08-07 2019-07-08 带有端子的电路基板和电路基板组件

Country Status (5)

Country Link
US (1) US11664615B2 (fr)
EP (1) EP3836763A4 (fr)
JP (1) JP7210186B2 (fr)
CN (1) CN112655282A (fr)
WO (1) WO2020031584A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6947657B2 (ja) * 2018-01-31 2021-10-13 株式会社デンソー 電子回路
JP7770785B2 (ja) 2021-05-19 2025-11-17 ＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｊａｐａｎ合同会社 回路基板組立体の製造方法
US12069800B2 (en) * 2021-09-08 2024-08-20 Rohde & Schwarz Gmbh & Co. Kg Circuit board arrangement, differential probe circuit and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02132970U (fr) * 1989-04-11 1990-11-05
US20090213562A1 (en) * 2008-02-27 2009-08-27 Julian Thevenard System for interconnecting two substrates each comprising at least one transmission line
US20110122045A1 (en) * 2009-11-23 2011-05-26 Samsung Electronics Co. Ltd. Built-in printed circuit board antenna of mobile terminal
CN102105017A (zh) * 2009-12-17 2011-06-22 松下电工株式会社 印制布线板连接构造
JP2011222826A (ja) * 2010-04-12 2011-11-04 Mitsubishi Electric Engineering Co Ltd プリント基板間の接続構造
CN108184333A (zh) * 2015-11-05 2018-06-19 阿莫技术有限公司 组合式天线模块

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2013258C3 (de) * 1970-03-20 1975-05-22 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verfahren zur Herstellung von stiftförmigen Anschlußteilen einer gedruckten Schaltungsplatte
JPS534146Y2 (fr) 1973-02-21 1978-02-01
JPS558953Y2 (fr) * 1975-04-04 1980-02-27
JPS5493455A (en) 1977-12-30 1979-07-24 Matsushita Electric Works Ltd Printed circuit board for small electronic appliance
US4513064A (en) * 1982-12-17 1985-04-23 The United States Of America As Represented By The Secretary Of The Army Package for rugged electronics
JPS5996874U (ja) 1982-12-21 1984-06-30 オムロン株式会社 電子機器の組立構造
JPH02132970A (ja) 1988-11-14 1990-05-22 Sanyo Electric Co Ltd ２値画像列中のデータ変化点の検出方法
JPH11121895A (ja) * 1997-10-17 1999-04-30 Toyo Electric Mfg Co Ltd プリント配線基板の取付構造
US6239765B1 (en) * 1999-02-27 2001-05-29 Rangestar Wireless, Inc. Asymmetric dipole antenna assembly
DE50002850D1 (de) * 1999-05-31 2003-08-14 Tyco Electronics Logistics Ag Intelligentes leistungsmodul
US6404394B1 (en) * 1999-12-23 2002-06-11 Tyco Electronics Logistics Ag Dual polarization slot antenna assembly
US6824391B2 (en) * 2000-02-03 2004-11-30 Tyco Electronics Corporation Electrical connector having customizable circuit board wafers
JP2001284761A (ja) 2000-03-30 2001-10-12 Omron Corp プリント配線板固定装置と、このプリント配線板固定装置を用いた電子機器
US6461169B1 (en) * 2001-05-04 2002-10-08 Intel Corporation Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts
AU2002366135A1 (en) * 2001-11-20 2003-06-10 Ube Industries, Ltd. Dielectric antenna module
US6808399B2 (en) * 2002-12-02 2004-10-26 Tyco Electronics Corporation Electrical connector with wafers having split ground planes
KR100586698B1 (ko) * 2003-12-23 2006-06-08 삼성전자주식회사 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈
JP2005197493A (ja) 2004-01-08 2005-07-21 Ihi Aerospace Co Ltd 回路基板組立体
JP2005236089A (ja) 2004-02-20 2005-09-02 Matsushita Electric Ind Co Ltd 三次元実装構造体、三次元実装構造体を備えた携帯用電子機器、および、三次元実装構造体の製造方法
US6932649B1 (en) * 2004-03-19 2005-08-23 Tyco Electronics Corporation Active wafer for improved gigabit signal recovery, in a serial point-to-point architecture
DE502005002413D1 (de) * 2005-05-31 2008-02-14 Siemens Ag Verfahren zur Herstellung einer Leiterplatte und eines Leiterplattensystems sowie mittels solcher Verfahren hergestellte Leiterplattten und Leiterplattensysteme
JP2007068106A (ja) 2005-09-02 2007-03-15 Auto Network Gijutsu Kenkyusho:Kk 車載用無線受信装置
US7379021B2 (en) * 2005-11-01 2008-05-27 Arcadyan Technology Corporation Circuit board
EP1804561B1 (fr) * 2005-12-30 2015-01-28 Omron Europe B.V. Carte de circuit imprimé pour connection perpendiculaire de composants électroniques
US7705365B2 (en) * 2006-01-24 2010-04-27 Denso Corporation Lighting device and light emitting module for the same
US7338292B2 (en) * 2006-01-26 2008-03-04 Agilent Technologies, Inc. Board-to-board electronic interface using hemi-ellipsoidal surface features
DE202006020076U1 (de) * 2006-04-06 2007-10-04 Behr-Hella Thermocontrol Gmbh Leiterkartenanordnung
JP2008027869A (ja) 2006-07-25 2008-02-07 Jisedai Gijutsu:Kk 基板コネクタ
AT504960B1 (de) * 2007-01-31 2012-11-15 Siemens Ag Anordnung eines ersten schaltungsträgers auf einem zweiten schaltungsträger
FR2915054B1 (fr) * 2007-04-12 2009-06-26 Sagem Monetel Soc Par Actions Dispositif de protection d'un composant electronique
US7864544B2 (en) * 2007-08-01 2011-01-04 Delphi Technologies, Inc. Printed circuit board assembly
US7716821B2 (en) * 2007-12-12 2010-05-18 Sauer-Danfoss Inc. Method of manufacturing a circuit board assembly for a controller
CN101752735B (zh) * 2008-12-16 2012-08-29 鸿富锦精密工业（深圳）有限公司 板卡固定装置
WO2010099415A1 (fr) * 2009-02-27 2010-09-02 Delphi Technologies, Inc. Système audio léger pour applications automobiles et procédé
TWI417013B (zh) * 2010-05-14 2013-11-21 Kuang Hong Prec Co Ltd 立體電路元件及其製作方法
US8897032B2 (en) * 2011-05-24 2014-11-25 Xirrus, Inc. Surface mount antenna contacts
WO2012171565A1 (fr) * 2011-06-16 2012-12-20 Siemens Aktiengesellschaft Système de contact électrique servant à relier des circuits imprimés
EP2544300A1 (fr) * 2011-07-08 2013-01-09 Tyco Electronics Belgium EC BVBA Antenne imprimée
JP2013219109A (ja) 2012-04-05 2013-10-24 Denso Corp 基板組立体、およびこの基板組立体を用いた燃料性状センサ
US9252528B2 (en) * 2013-07-02 2016-02-02 Germane Systems, Llc Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket
JP2015082538A (ja) 2013-10-22 2015-04-27 住友電装株式会社 プリント基板およびプリント基板を備えた電子機器並びにプリント基板の製造方法
JP6215068B2 (ja) * 2014-01-28 2017-10-18 日本航空電子工業株式会社 コネクタ
US9356366B2 (en) * 2014-04-24 2016-05-31 Tyco Electronics Corporation Cable connector assembly for a communication system
EP3146811B1 (fr) * 2014-05-22 2023-08-02 Signify Holding B.V. Agencement de carte de circuit imprimé
CN105698037A (zh) * 2014-11-25 2016-06-22 鸿富锦精密工业（深圳）有限公司 灯具
US20160268034A1 (en) * 2015-03-13 2016-09-15 Bose Corporation Planar Magnetic Components and Assemblies
EP3286801B1 (fr) * 2015-04-20 2022-12-28 InterDigital Madison Patent Holdings, SAS Connecteur de câblage d'antenne à détendeur dans un dispositif électronique
JP2017017089A (ja) 2015-06-29 2017-01-19 三菱電機株式会社 立体型プリント基板
CA2941284C (fr) * 2015-09-08 2022-04-05 Ross Video Limited Disposition de coussinet de circuit imprime et dispositif de fixation mecanique
DE202015008007U1 (de) * 2015-11-19 2016-01-11 Siemens Aktiengesellschaft Leiterplattenanordnung
JP6672737B2 (ja) 2015-11-19 2020-03-25 三菱電機株式会社 調光器、照明システム
US9976898B2 (en) * 2015-12-09 2018-05-22 Pixart Imaging Inc. Optical sensing module with multi-directional optical sensing function
DE202016101086U1 (de) * 2016-03-01 2017-06-02 Tridonic Gmbh & Co Kg Leiterplattenanordnung
US10971880B2 (en) * 2016-10-26 2021-04-06 Neptune Technology Group Inc. Connection for printed circuit board assemblies
JP6914583B2 (ja) 2016-12-26 2021-08-04 ダイハツ工業株式会社 車載用無線受信装置
WO2019087352A1 (fr) * 2017-11-02 2019-05-09 三菱電機株式会社 Ensemble carte de circuit imprimé
EP3489082B1 (fr) * 2017-11-28 2021-10-06 ZKW Group GmbH Module lumineux et phare de véhicule
JP6925447B2 (ja) * 2017-12-08 2021-08-25 三菱電機株式会社 プリント配線板およびその製造方法
EP3829271A4 (fr) * 2018-07-26 2021-09-29 Mitsubishi Electric Corporation Carte de circuit imprimé
WO2020200464A1 (fr) * 2019-04-04 2020-10-08 Huawei Technologies Co., Ltd. Procédé de fabrication d'un élément d'antenne
DE102020104100B3 (de) * 2020-02-17 2021-08-05 Interplex NAS Electronics GmbH Leiterkarten-Eckverbinder sowie Kartenverbindungsanordnung
US10998678B1 (en) * 2020-03-26 2021-05-04 TE Connectivity Services Gmbh Modular electrical connector with additional grounding

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02132970U (fr) * 1989-04-11 1990-11-05
US20090213562A1 (en) * 2008-02-27 2009-08-27 Julian Thevenard System for interconnecting two substrates each comprising at least one transmission line
US20110122045A1 (en) * 2009-11-23 2011-05-26 Samsung Electronics Co. Ltd. Built-in printed circuit board antenna of mobile terminal
CN102105017A (zh) * 2009-12-17 2011-06-22 松下电工株式会社 印制布线板连接构造
JP2011222826A (ja) * 2010-04-12 2011-11-04 Mitsubishi Electric Engineering Co Ltd プリント基板間の接続構造
CN108184333A (zh) * 2015-11-05 2018-06-19 阿莫技术有限公司 组合式天线模块

Also Published As

Publication number Publication date
US11664615B2 (en) 2023-05-30
JP7210186B2 (ja) 2023-01-23
US20210159623A1 (en) 2021-05-27
EP3836763A1 (fr) 2021-06-16
EP3836763A4 (fr) 2022-04-27
WO2020031584A1 (fr) 2020-02-13
JP2020025012A (ja) 2020-02-13

Similar Documents

Publication Publication Date Title
JP2623435B2 (ja) 等長ライトアングルコネクタ
CN101529650A (zh) 阻抗匹配的电路板
JP2006236657A (ja) コネクタ装置
CN112655282A (zh) 带有端子的电路基板和电路基板组件
US20200045815A1 (en) Circuit board and electronic device including the same
JP2011119123A (ja) コネクタ
CN107528119A (zh) 一种天线装置及终端
JP2008198814A (ja) 立ち基板の取付構造
US20120168221A1 (en) Relay board for transmission connector use
KR102088323B1 (ko) 인쇄회로기판의 결합구조
JPH0528918B2 (fr)
JP6597810B2 (ja) 実装構造、構造部品、実装構造の製造方法
JP2001156204A (ja) 表面実装部品
JP2010176924A (ja) 基板用コネクタ及びコネクタを備えた配線基板
KR20070084174A (ko) 2편형 중간 평면
JP7341851B2 (ja) コネクタ、電気配線板付きコネクタ及びコネクタの製造方法
JPH0752790B2 (ja) 親子基板の実装方法
JP2010129878A (ja) 部品内蔵プリント基板
JPH06188533A (ja) プリント配線板
US20140291002A1 (en) Printed circuit board module
JP6738688B2 (ja) 基板セット及び固定用サブ基板
JP2019016554A (ja) 端子金具
JP2007281303A (ja) プリント配線基板およびその製造方法
JP6177427B2 (ja) プリント配線板ユニット
JP2007165217A (ja) 同軸コネクタ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination