CN1153068C - 具有接触检查电路的半导体装置 - Google Patents

具有接触检查电路的半导体装置 Download PDF

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Publication number
CN1153068C
CN1153068C CNB981040934A CN98104093A CN1153068C CN 1153068 C CN1153068 C CN 1153068C CN B981040934 A CNB981040934 A CN B981040934A CN 98104093 A CN98104093 A CN 98104093A CN 1153068 C CN1153068 C CN 1153068C
Authority
CN
China
Prior art keywords
contact
transistors
contacts
semiconductor device
chip select
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB981040934A
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English (en)
Chinese (zh)
Other versions
CN1205522A (zh
Inventor
谷田进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN1205522A publication Critical patent/CN1205522A/zh
Application granted granted Critical
Publication of CN1153068C publication Critical patent/CN1153068C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26—Functional testing
    • G06F11/273—Tester hardware, i.e. output processing circuits
    • G06F11/2733—Test interface between tester and unit under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
CNB981040934A 1997-07-14 1998-02-04 具有接触检查电路的半导体装置 Expired - Fee Related CN1153068C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP188405/97 1997-07-14
JP188405/1997 1997-07-14
JP9188405A JPH1139898A (ja) 1997-07-14 1997-07-14 半導体装置

Publications (2)

Publication Number Publication Date
CN1205522A CN1205522A (zh) 1999-01-20
CN1153068C true CN1153068C (zh) 2004-06-09

Family

ID=16223080

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB981040934A Expired - Fee Related CN1153068C (zh) 1997-07-14 1998-02-04 具有接触检查电路的半导体装置

Country Status (6)

Country Link
US (1) US5962868A (2)
JP (1) JPH1139898A (2)
KR (1) KR100280024B1 (2)
CN (1) CN1153068C (2)
DE (1) DE19801557B4 (2)
TW (1) TW366492B (2)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6150669A (en) * 1998-12-18 2000-11-21 Texas Instruments Incorporated Combination test structures for in-situ measurements during fabrication of semiconductor devices
DE19924315C2 (de) * 1999-05-27 2003-10-09 Rohde & Schwarz Verfahren zum Überwachen der Kontaktierungssicherheit eines Netzwerkanalysators
US6115305A (en) * 1999-06-15 2000-09-05 Atmel Corporation Method and apparatus for testing a video display chip
JP2001083217A (ja) * 1999-09-16 2001-03-30 Oki Micro Design Co Ltd 集積回路
EP1320760A2 (en) * 2000-09-28 2003-06-25 Koninklijke Philips Electronics N.V. Device for testing contacts
GB0030346D0 (en) * 2000-12-13 2001-01-24 Mitel Semiconductor Ltd Integrated circuit test structure
US6503765B1 (en) 2001-07-31 2003-01-07 Xilinx, Inc. Testing vias and contacts in integrated circuit fabrication
JP4405802B2 (ja) * 2001-10-16 2010-01-27 メディカル・インスティル・テクノロジーズ・インコーポレイテッド 計量された量の物質を供給するための、密閉チャンバ及び一方向弁を備えたディスペンサ
JP2004085247A (ja) * 2002-08-23 2004-03-18 Mitsubishi Electric Corp プローブカード
FI20050982A0 (fi) * 2005-09-30 2005-09-30 Microsalo Oy Menetelmä, piirilevy ja testauslaite juotosliitosten testaamiseksi
JP4726679B2 (ja) * 2006-03-31 2011-07-20 ルネサスエレクトロニクス株式会社 半導体試験方法および半導体装置
US7776728B2 (en) * 2007-03-02 2010-08-17 United Microelectronics Corp. Rapid thermal process method and rapid thermal process device
JP4774071B2 (ja) 2007-04-05 2011-09-14 ルネサスエレクトロニクス株式会社 プローブ抵抗値測定方法、プローブ抵抗値測定用パッドを有する半導体装置
KR101274208B1 (ko) * 2007-08-07 2013-06-17 삼성전자주식회사 접촉 불량 검출회로를 구비하는 반도체 장치
KR101438575B1 (ko) * 2008-01-24 2014-09-12 엘지이노텍 주식회사 튜너
JP2011196813A (ja) * 2010-03-19 2011-10-06 Toshiba Corp 半導体集積回路のテスト方法、および、テストシステム
US9575114B2 (en) * 2013-07-10 2017-02-21 Elite Semiconductor Memory Technology Inc. Test system and device
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置
TWI639206B (zh) 2018-01-16 2018-10-21 中美矽晶製品股份有限公司 用以檢測半導體元件之通孔電極的導通狀態之檢測系統及檢測方法
CN111273198B (zh) * 2020-02-26 2023-01-24 深圳市元征科技股份有限公司 一种sim检测卡以及检测sim卡座瞬断的方法
US11892521B2 (en) 2021-08-19 2024-02-06 Elite Semiconductor Microelectronics Technology Inc. Semiconductor device with contact check circuitry

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781683A (en) * 1971-03-30 1973-12-25 Ibm Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration
US4801869A (en) * 1987-04-27 1989-01-31 International Business Machines Corporation Semiconductor defect monitor for diagnosing processing-induced defects
JPH04147637A (ja) * 1990-10-09 1992-05-21 Mitsubishi Electric Corp 半導体集積回路のテストプログラムによる試験方法
JPH04333252A (ja) * 1991-05-09 1992-11-20 Nec Corp 半導体論理集積回路
JP2715936B2 (ja) * 1994-09-30 1998-02-18 日本電気株式会社 薄膜トランジスタ型液晶表示装置とその製造方法

Also Published As

Publication number Publication date
KR100280024B1 (ko) 2001-03-02
CN1205522A (zh) 1999-01-20
TW366492B (en) 1999-08-11
DE19801557A1 (de) 1999-02-11
KR19990013347A (ko) 1999-02-25
JPH1139898A (ja) 1999-02-12
US5962868A (en) 1999-10-05
DE19801557B4 (de) 2004-08-05

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PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee