CN1160177C - 分离片状衬底的方法和装置 - Google Patents

分离片状衬底的方法和装置 Download PDF

Info

Publication number
CN1160177C
CN1160177C CNB008143714A CN00814371A CN1160177C CN 1160177 C CN1160177 C CN 1160177C CN B008143714 A CNB008143714 A CN B008143714A CN 00814371 A CN00814371 A CN 00814371A CN 1160177 C CN1160177 C CN 1160177C
Authority
CN
China
Prior art keywords
substrate
sheet
substrates
gripper
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008143714A
Other languages
English (en)
Chinese (zh)
Other versions
CN1379708A (zh
Inventor
Լɪ��������
约瑟夫·根蒂舍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmid Technology Systems GmbH
Original Assignee
ACR Automation in Cleanroom GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACR Automation in Cleanroom GmbH filed Critical ACR Automation in Cleanroom GmbH
Publication of CN1379708A publication Critical patent/CN1379708A/zh
Application granted granted Critical
Publication of CN1160177C publication Critical patent/CN1160177C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manipulator (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
CNB008143714A 1999-10-16 2000-10-12 分离片状衬底的方法和装置 Expired - Fee Related CN1160177C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19950068A DE19950068B4 (de) 1999-10-16 1999-10-16 Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE19950068.1 1999-10-16

Publications (2)

Publication Number Publication Date
CN1379708A CN1379708A (zh) 2002-11-13
CN1160177C true CN1160177C (zh) 2004-08-04

Family

ID=7925995

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008143714A Expired - Fee Related CN1160177C (zh) 1999-10-16 2000-10-12 分离片状衬底的方法和装置

Country Status (9)

Country Link
EP (1) EP1220739B1 (de)
JP (1) JP4731077B2 (de)
CN (1) CN1160177C (de)
AT (1) ATE294056T1 (de)
AU (1) AU777067B2 (de)
CA (1) CA2388730A1 (de)
DE (2) DE19950068B4 (de)
ES (1) ES2240189T3 (de)
WO (1) WO2001028745A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
US20080190981A1 (en) * 2003-12-04 2008-08-14 Yasutomo Okajima Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate
DE102004060040B3 (de) * 2004-12-14 2006-06-14 Richter, Uwe, Dr. Vorrichtung zum Vereinzeln und Sortieren scheibenförmiger Substrate
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102005028112A1 (de) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
CN101356047B (zh) * 2006-07-06 2011-11-09 Rena有限责任公司 用于分开和输送基片的装置和方法
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE502006001352D1 (de) * 2006-12-15 2008-09-25 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
US20080146003A1 (en) * 2006-12-19 2008-06-19 Rec Scanwafer As Method and device for separating silicon wafers
DE102007020864A1 (de) * 2007-05-02 2008-11-06 Scolomatic Gmbh Flächengreifereinheit
DE502007002047D1 (de) 2007-05-04 2009-12-31 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur Vereinzelung
DE102007021512A1 (de) 2007-05-04 2008-11-13 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur Vereinzelung
GB2465591B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for separating sliced wafers
KR101066978B1 (ko) * 2009-03-16 2011-09-23 주식회사 에스에프에이 태양전지용 웨이퍼의 분리 및 이송 장치
KR101127655B1 (ko) * 2010-04-16 2012-07-16 금오공과대학교 산학협력단 워터젯을 이용한 태양전지용 실리콘 웨이퍼 박판 분리장치 및 이를 이용한 분리 방법
CN101950778A (zh) * 2010-09-02 2011-01-19 董维来 太阳能硅片湿法自动分片方法
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
CN102126616A (zh) * 2010-12-16 2011-07-20 尹青 一种行走吸盘上下片台
JP2013004627A (ja) * 2011-06-14 2013-01-07 Shinryo Corp ウエハの分離装置
CN102633118A (zh) * 2012-04-25 2012-08-15 佛山市科利得机械有限公司 一种瓷砖自动分拣装置
JP5849201B2 (ja) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 切り残し部除去装置
JP6450637B2 (ja) * 2015-04-21 2019-01-09 株式会社ディスコ リフトオフ方法及び超音波ホーン
CN104986380B (zh) * 2015-05-20 2017-07-18 杭州厚达自动化系统有限公司 厅门装箱机构
JP6682907B2 (ja) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106345926B (zh) * 2016-11-01 2018-02-13 浙江大成智能装备股份有限公司 一种铝片冲压成型自动化上下料的自动分张机构
CN107082277B (zh) * 2017-06-08 2023-10-27 江苏四达重工有限公司 一种缓存送料装置
WO2019138881A1 (ja) * 2018-01-09 2019-07-18 東京エレクトロン株式会社 洗浄装置、洗浄方法及びコンピュータ記憶媒体
CN109264416A (zh) * 2018-09-20 2019-01-25 上海西重所重型机械成套有限公司 金属板板垛分板装置
CN111099368B (zh) * 2020-01-13 2020-12-29 卢荣芳 一种建筑基材转运工序的恒量运输装置
WO2025204668A1 (ja) * 2024-03-29 2025-10-02 芝浦メカトロニクス株式会社 分離装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729206A (en) * 1971-10-21 1973-04-24 Ibm Vacuum holding apparatus
US4252497A (en) * 1977-08-22 1981-02-24 Heico Inc. Article handling system
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
DE3338897A1 (de) * 1983-10-27 1985-05-09 Messwandler-Bau Gmbh, 8600 Bamberg Blechhubeinrichtung zum schichten von eisenkernen aus einzelblechen
JPS6165750A (ja) * 1984-09-04 1986-04-04 Osaka Titanium Seizo Kk ウエハ−の枚葉取出し装置
DE3609549A1 (de) * 1986-03-21 1987-10-01 Mabeg Maschinenbau Gmbh Nachf Trennvorrichtung
JPH02139148A (ja) * 1988-11-14 1990-05-29 Nippon Seiko Kk 真空吸着テーブル
JPH0851140A (ja) * 1994-08-05 1996-02-20 Dowa Mining Co Ltd 積層薄板体の２枚取り防止装置及び防止方法
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
CH691169A5 (fr) * 1996-04-16 2001-05-15 Hct Shaping Systems Sa Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
KR100471936B1 (ko) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 웨이퍼의세정·박리방법및장치
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
JP3209116B2 (ja) * 1996-10-11 2001-09-17 株式会社東京精密 スライスベース剥離装置
JP3870496B2 (ja) * 1997-08-04 2007-01-17 株式会社東京精密 スライスベース剥離装置
JP4022672B2 (ja) * 1998-03-04 2007-12-19 株式会社東京精密 スライスベース剥離装置
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung

Also Published As

Publication number Publication date
EP1220739B1 (de) 2005-04-27
ES2240189T3 (es) 2005-10-16
AU777067B2 (en) 2004-09-30
DE19950068A1 (de) 2001-04-26
CA2388730A1 (en) 2001-04-26
CN1379708A (zh) 2002-11-13
DE50010186D1 (de) 2005-06-02
ATE294056T1 (de) 2005-05-15
EP1220739A1 (de) 2002-07-10
JP4731077B2 (ja) 2011-07-20
DE19950068B4 (de) 2006-03-02
WO2001028745A1 (de) 2001-04-26
JP2003512196A (ja) 2003-04-02
AU1136801A (en) 2001-04-30

Similar Documents

Publication Publication Date Title
CN1160177C (zh) 分离片状衬底的方法和装置
JP5006880B2 (ja) 基板を分離搬送する装置及び方法
US8701734B2 (en) Separating apparatus and separating method
TWI428971B (zh) 工件之裂片方法及裝置、刻劃及裂片方法暨附裂片功能之刻劃裝置
CN100334706C (zh) 半导体器件以及半导体器件的制造方法
EP2122676B1 (de) Verfahren und einrichtung zur trennung von siliziumwafern
KR100931551B1 (ko) 웨이퍼 디마운트 방법, 웨이퍼 디마운트 장치 및 웨이퍼디마운트 이송기
KR101440414B1 (ko) 기판을 분리하고 이송하는 장치 및 방법
US20050009299A1 (en) Method of manufacturing a semiconductor device
WO2008068943A1 (ja) 液中ウェハ単離方法及び液中ウェハ単離装置
CN102292275A (zh) 用于分离切片晶片的方法和设备
JP2013115291A (ja) Ｌｅｄチップもしくはｌｄチップの粘着シートからの剥離搬送装置
JP2655173B2 (ja) 半導体ウェーハの分離方法及び装置
CN108461443B (zh) 膜材分离机和膜材分离方法
US20060261117A1 (en) Breaking device for separating ceramic printed circuit boards
KR101513226B1 (ko) 저주파 진동을 이용한 반도체 칩의 픽업 방법
JP4752790B2 (ja) 電子部品のピックアップ方法とそれに用いるピックアップ装置
JP2009515349A (ja) 付着力を用いて円盤状基板を分離する方法
JP2010129857A (ja) 半導体ウェーハのスクライブ装置、およびそれを備えたスクライブシステム
JP2009291972A (ja) コンクリートブロックの表面処理装置及びコンクリートブロックの表面処理方法
JP4108628B2 (ja) 板状物分離装置
JPH031549A (ja) 集積回路チップ供給装置
CN121717012A (zh) 撕膜机构和撕膜设备
JP2003218134A (ja) ダイボンディング装置
CN117917762A (zh) 膜剥离装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SCHMID TECHNOLOGY SYSTEM CO., LTD.

Free format text: FORMER NAME OR ADDRESS: ACR AUTOMATION IN CLEANROOM GMBH

CP01 Change in the name or title of a patent holder

Address after: Germany need summer lotus

Patentee after: Schmid Technology Systems GmbH

Address before: Germany need summer lotus

Patentee before: ACR Automation in Cleanroom GmbH

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee