CN1554215A - 腐蚀卡上的铜的方法 - Google Patents

腐蚀卡上的铜的方法 Download PDF

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Publication number
CN1554215A
CN1554215A CNA028176588A CN02817658A CN1554215A CN 1554215 A CN1554215 A CN 1554215A CN A028176588 A CNA028176588 A CN A028176588A CN 02817658 A CN02817658 A CN 02817658A CN 1554215 A CN1554215 A CN 1554215A
Authority
CN
China
Prior art keywords
electrolyte
state
cathode
copper
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028176588A
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English (en)
Chinese (zh)
Inventor
����� Լ�������
约兰·弗伦内松
古斯特·比宁斯
比亚尔尼·比亚尔纳松
珍妮·舍贝里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Obducat AB
Original Assignee
Obducat AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat AB filed Critical Obducat AB
Publication of CN1554215A publication Critical patent/CN1554215A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Catalysts (AREA)
CNA028176588A 2001-09-10 2002-09-09 腐蚀卡上的铜的方法 Pending CN1554215A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE01029941 2001-09-10
SE0102994A SE519898C2 (sv) 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Publications (1)

Publication Number Publication Date
CN1554215A true CN1554215A (zh) 2004-12-08

Family

ID=20285274

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028176588A Pending CN1554215A (zh) 2001-09-10 2002-09-09 腐蚀卡上的铜的方法

Country Status (9)

Country Link
US (1) US7767074B2 (de)
EP (1) EP1425948B1 (de)
JP (1) JP4216718B2 (de)
CN (1) CN1554215A (de)
AT (1) ATE397843T1 (de)
AU (1) AU2002334517A1 (de)
DE (1) DE60226984D1 (de)
SE (1) SE519898C2 (de)
WO (1) WO2003024172A2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101163823B (zh) * 2005-03-04 2011-04-13 吉布尔·施密德有限责任公司 蚀刻基体的装置与方法
CN104630873A (zh) * 2013-11-08 2015-05-20 Lg电子株式会社 家用电器的外部装饰面板及其制造的方法
CN111699285A (zh) * 2017-09-28 2020-09-22 南韩商奥森里德股份有限公司 电解研磨用电极框架及包括其的电解研磨装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937054B1 (fr) 2008-10-13 2010-12-10 Commissariat Energie Atomique Procede et dispositif de decontamination d'une surface metallique.
PL2508267T3 (pl) * 2011-04-04 2014-11-28 J Wagner Ag Odwracalna dysza do materiałów powłokowych do pistoletu natryskowego do powlekania obrabianego przedmiotu materiałem powłokowym
IT201700110569A1 (it) * 2017-10-03 2019-04-03 Univ Degli Studi Di Palermo Apparato e metodo per il recupero di rame a partire da scarti di dispositivi elettrici ed elettronici

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1362159A (en) * 1917-04-04 1920-12-14 Jackson S Weeks Composition for electrolytes for electrical etching
NL268373A (de) * 1960-08-23
JPS5313177B2 (de) * 1973-06-20 1978-05-08
DE2850542C2 (de) * 1978-11-22 1982-07-01 Kernforschungsanlage Jülich GmbH, 5170 Jülich Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
DE3020012C2 (de) * 1980-05-24 1983-03-03 Daimler-Benz Ag, 7000 Stuttgart Verfahren zum Freilegen der Siliciumkristalle an der Oberfläche eines Körpers aus einer Aluminiumlegierung mit hohem Siliciumgehalt
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
US5035778A (en) * 1989-05-12 1991-07-30 International Business Machines Corporation Regeneration of spent ferric chloride etchants
US5302240A (en) * 1991-01-22 1994-04-12 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US5284554A (en) 1992-01-09 1994-02-08 International Business Machines Corporation Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
AU4141697A (en) 1996-09-06 1998-03-26 Obducat Ab Method for anisotropic etching of structures in conducting materials
US6143158A (en) * 1997-04-25 2000-11-07 Fuji Photo Film Co., Ltd. Method for producing an aluminum support for a lithographic printing plate
EP0889680A3 (de) 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Verfahren zur Entfernung und/oder Aufbringung von leitendem Material
JP4431203B2 (ja) 1998-08-10 2010-03-10 義和 小林 塩化第二鉄エッチング液の管理装置
US6638686B2 (en) * 1999-12-09 2003-10-28 Fuji Photo Film Co., Ltd. Planographic printing plate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101163823B (zh) * 2005-03-04 2011-04-13 吉布尔·施密德有限责任公司 蚀刻基体的装置与方法
CN104630873A (zh) * 2013-11-08 2015-05-20 Lg电子株式会社 家用电器的外部装饰面板及其制造的方法
CN104630873B (zh) * 2013-11-08 2017-08-08 Lg电子株式会社 家用电器的外部装饰面板及其制造的方法
US9746765B2 (en) 2013-11-08 2017-08-29 Lg Electronics Inc. Exterior décor panel for home appliance and method of manufacturing the same
CN111699285A (zh) * 2017-09-28 2020-09-22 南韩商奥森里德股份有限公司 电解研磨用电极框架及包括其的电解研磨装置

Also Published As

Publication number Publication date
WO2003024172A3 (en) 2003-06-05
US7767074B2 (en) 2010-08-03
DE60226984D1 (de) 2008-07-17
JP2005502785A (ja) 2005-01-27
ATE397843T1 (de) 2008-06-15
SE0102994D0 (sv) 2001-09-10
SE0102994L (sv) 2003-03-11
WO2003024172A8 (en) 2004-05-06
WO2003024172A2 (en) 2003-03-20
JP4216718B2 (ja) 2009-01-28
SE519898C2 (sv) 2003-04-22
US20050082257A1 (en) 2005-04-21
EP1425948A2 (de) 2004-06-09
AU2002334517A1 (en) 2003-03-24
EP1425948B1 (de) 2008-06-04

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Application publication date: 20041208