ATE397843T1 - Verfahren zum ätzen von kupfer auf karten - Google Patents

Verfahren zum ätzen von kupfer auf karten

Info

Publication number
ATE397843T1
ATE397843T1 AT02798066T AT02798066T ATE397843T1 AT E397843 T1 ATE397843 T1 AT E397843T1 AT 02798066 T AT02798066 T AT 02798066T AT 02798066 T AT02798066 T AT 02798066T AT E397843 T1 ATE397843 T1 AT E397843T1
Authority
AT
Austria
Prior art keywords
card
state
copper
electrolyte
cathode
Prior art date
Application number
AT02798066T
Other languages
English (en)
Inventor
Goeran Frennesson
Gust Bierings
Bjarni Bjarnason
Jenny Sjoeberg
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Application granted granted Critical
Publication of ATE397843T1 publication Critical patent/ATE397843T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Catalysts (AREA)
AT02798066T 2001-09-10 2002-09-09 Verfahren zum ätzen von kupfer auf karten ATE397843T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102994A SE519898C2 (sv) 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Publications (1)

Publication Number Publication Date
ATE397843T1 true ATE397843T1 (de) 2008-06-15

Family

ID=20285274

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02798066T ATE397843T1 (de) 2001-09-10 2002-09-09 Verfahren zum ätzen von kupfer auf karten

Country Status (9)

Country Link
US (1) US7767074B2 (de)
EP (1) EP1425948B1 (de)
JP (1) JP4216718B2 (de)
CN (1) CN1554215A (de)
AT (1) ATE397843T1 (de)
AU (1) AU2002334517A1 (de)
DE (1) DE60226984D1 (de)
SE (1) SE519898C2 (de)
WO (1) WO2003024172A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten
FR2937054B1 (fr) 2008-10-13 2010-12-10 Commissariat Energie Atomique Procede et dispositif de decontamination d'une surface metallique.
PL2508267T3 (pl) * 2011-04-04 2014-11-28 J Wagner Ag Odwracalna dysza do materiałów powłokowych do pistoletu natryskowego do powlekania obrabianego przedmiotu materiałem powłokowym
KR102179814B1 (ko) * 2013-11-08 2020-11-17 엘지전자 주식회사 가전기기용 외장 패널 및 그 제조방법
WO2019066584A1 (ko) * 2017-09-28 2019-04-04 주식회사 어썸리드 전해연마용 전극 프레임 및 이를 포함하는 전해연마 장치
IT201700110569A1 (it) * 2017-10-03 2019-04-03 Univ Degli Studi Di Palermo Apparato e metodo per il recupero di rame a partire da scarti di dispositivi elettrici ed elettronici

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1362159A (en) * 1917-04-04 1920-12-14 Jackson S Weeks Composition for electrolytes for electrical etching
NL268373A (de) * 1960-08-23
JPS5313177B2 (de) * 1973-06-20 1978-05-08
DE2850542C2 (de) * 1978-11-22 1982-07-01 Kernforschungsanlage Jülich GmbH, 5170 Jülich Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
DE3020012C2 (de) * 1980-05-24 1983-03-03 Daimler-Benz Ag, 7000 Stuttgart Verfahren zum Freilegen der Siliciumkristalle an der Oberfläche eines Körpers aus einer Aluminiumlegierung mit hohem Siliciumgehalt
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
US5035778A (en) * 1989-05-12 1991-07-30 International Business Machines Corporation Regeneration of spent ferric chloride etchants
US5302240A (en) * 1991-01-22 1994-04-12 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US5284554A (en) 1992-01-09 1994-02-08 International Business Machines Corporation Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
AU4141697A (en) 1996-09-06 1998-03-26 Obducat Ab Method for anisotropic etching of structures in conducting materials
US6143158A (en) * 1997-04-25 2000-11-07 Fuji Photo Film Co., Ltd. Method for producing an aluminum support for a lithographic printing plate
EP0889680A3 (de) 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Verfahren zur Entfernung und/oder Aufbringung von leitendem Material
JP4431203B2 (ja) 1998-08-10 2010-03-10 義和 小林 塩化第二鉄エッチング液の管理装置
US6638686B2 (en) * 1999-12-09 2003-10-28 Fuji Photo Film Co., Ltd. Planographic printing plate

Also Published As

Publication number Publication date
WO2003024172A3 (en) 2003-06-05
US7767074B2 (en) 2010-08-03
DE60226984D1 (de) 2008-07-17
JP2005502785A (ja) 2005-01-27
SE0102994D0 (sv) 2001-09-10
SE0102994L (sv) 2003-03-11
WO2003024172A8 (en) 2004-05-06
WO2003024172A2 (en) 2003-03-20
JP4216718B2 (ja) 2009-01-28
SE519898C2 (sv) 2003-04-22
CN1554215A (zh) 2004-12-08
US20050082257A1 (en) 2005-04-21
EP1425948A2 (de) 2004-06-09
AU2002334517A1 (en) 2003-03-24
EP1425948B1 (de) 2008-06-04

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Legal Events

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