SE519898C2 - Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet - Google Patents

Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Info

Publication number: SE519898C2
Authority: SE; Sweden
Prior art keywords: electrolyte; cathode; copper; state; component
Prior art date: 2001-09-10

Application number

SE0102994A

Other languages

English (en)

Swedish (sv)

Other versions

SE0102994D0 (sv

SE0102994L (sv

Inventor

Goeran Frennesson

Gust Bierings

Bjarni Bjarnason

Jenny Sjoeberg

Original Assignee

Obducat Ab

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-09-10

Filing date

2001-09-10

Publication date

2003-04-22

2001-09-10 Application filed by Obducat Ab filed Critical Obducat Ab

2001-09-10 Priority to SE0102994A priority Critical patent/SE519898C2/sv

2001-09-10 Publication of SE0102994D0 publication Critical patent/SE0102994D0/xx

2002-09-09 Priority to US10/487,745 priority patent/US7767074B2/en

2002-09-09 Priority to DE60226984T priority patent/DE60226984D1/de

2002-09-09 Priority to AT02798066T priority patent/ATE397843T1/de

2002-09-09 Priority to EP02798066A priority patent/EP1425948B1/de

2002-09-09 Priority to CNA028176588A priority patent/CN1554215A/zh

2002-09-09 Priority to PCT/SE2002/001602 priority patent/WO2003024172A2/en

2002-09-09 Priority to AU2002334517A priority patent/AU2002334517A1/en

2002-09-09 Priority to JP2003528080A priority patent/JP4216718B2/ja

2003-03-11 Publication of SE0102994L publication Critical patent/SE0102994L/

2003-04-22 Publication of SE519898C2 publication Critical patent/SE519898C2/sv

Links

239000010949 copper Substances 0.000 title claims abstract description 206
229910052802 copper Inorganic materials 0.000 title claims abstract description 203
239000003792 electrolyte Substances 0.000 title claims abstract description 201
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 200
238000000034 method Methods 0.000 title claims description 28
238000005530 etching Methods 0.000 claims abstract description 93
150000002500 ions Chemical class 0.000 claims abstract description 45
230000003647 oxidation Effects 0.000 claims abstract description 38
238000007254 oxidation reaction Methods 0.000 claims abstract description 38
229910052751 metal Inorganic materials 0.000 claims abstract description 31
239000002184 metal Substances 0.000 claims abstract description 31
230000009467 reduction Effects 0.000 claims abstract description 31
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 28
229910001431 copper ion Inorganic materials 0.000 claims abstract description 28
-1 fluoride ions Chemical class 0.000 claims description 16
230000008929 regeneration Effects 0.000 claims description 14
238000011069 regeneration method Methods 0.000 claims description 14
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 7
230000001172 regenerating effect Effects 0.000 claims description 7
239000003795 chemical substances by application Substances 0.000 claims description 6
229910052742 iron Inorganic materials 0.000 claims description 5
229910052748 manganese Inorganic materials 0.000 claims description 5
230000008569 process Effects 0.000 claims description 5
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
229910052684 Cerium Inorganic materials 0.000 claims description 3
238000012546 transfer Methods 0.000 claims description 3
239000002243 precursor Substances 0.000 claims description 2
239000007800 oxidant agent Substances 0.000 claims 1
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 27
239000004020 conductor Substances 0.000 description 20
238000001556 precipitation Methods 0.000 description 17
238000003486 chemical etching Methods 0.000 description 16
230000000694 effects Effects 0.000 description 15
230000010287 polarization Effects 0.000 description 15
239000012212 insulator Substances 0.000 description 14
229910000831 Steel Inorganic materials 0.000 description 11
238000006243 chemical reaction Methods 0.000 description 11
239000010959 steel Substances 0.000 description 11
239000011248 coating agent Substances 0.000 description 9
238000000576 coating method Methods 0.000 description 9
238000006479 redox reaction Methods 0.000 description 9
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
150000001875 compounds Chemical class 0.000 description 8
239000000126 substance Substances 0.000 description 8
230000008901 benefit Effects 0.000 description 7
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 7
239000007788 liquid Substances 0.000 description 7
239000004696 Poly ether ether ketone Substances 0.000 description 6
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
239000002253 acid Substances 0.000 description 6
239000011572 manganese Substances 0.000 description 6
229920002530 polyetherether ketone Polymers 0.000 description 6
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 5
239000012777 electrically insulating material Substances 0.000 description 5
239000000203 mixture Substances 0.000 description 5
238000010924 continuous production Methods 0.000 description 4
150000001879 copper Chemical class 0.000 description 4
230000007423 decrease Effects 0.000 description 4
229920006332 epoxy adhesive Polymers 0.000 description 4
239000001257 hydrogen Substances 0.000 description 4
229910052739 hydrogen Inorganic materials 0.000 description 4
239000002244 precipitate Substances 0.000 description 4
150000003839 salts Chemical class 0.000 description 4
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
239000000470 constituent Substances 0.000 description 3
230000004907 flux Effects 0.000 description 3
239000003292 glue Substances 0.000 description 3
239000004033 plastic Substances 0.000 description 3
229920000728 polyester Polymers 0.000 description 3
239000011780 sodium chloride Substances 0.000 description 3
239000007787 solid Substances 0.000 description 3
229910021653 sulphate ion Inorganic materials 0.000 description 3
ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 2
239000004593 Epoxy Substances 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
229910052804 chromium Inorganic materials 0.000 description 2
239000011651 chromium Substances 0.000 description 2
229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
210000002837 heart atrium Anatomy 0.000 description 2
BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 2
229910000359 iron(II) sulfate Inorganic materials 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000000463 material Substances 0.000 description 2
238000005259 measurement Methods 0.000 description 2
229910001172 neodymium magnet Inorganic materials 0.000 description 2
230000001590 oxidative effect Effects 0.000 description 2
238000007789 sealing Methods 0.000 description 2
239000011734 sodium Substances 0.000 description 2
CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
238000010408 sweeping Methods 0.000 description 2
XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
230000007704 transition Effects 0.000 description 2
LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical group NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
241000272525 Anas platyrhynchos Species 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
229910004882 Na2S2O8 Inorganic materials 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
239000004809 Teflon Substances 0.000 description 1
229920006362 Teflon® Polymers 0.000 description 1
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
238000009825 accumulation Methods 0.000 description 1
230000009471 action Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
230000000712 assembly Effects 0.000 description 1
238000000429 assembly Methods 0.000 description 1
238000010923 batch production Methods 0.000 description 1
229910001423 beryllium ion Inorganic materials 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
230000008859 change Effects 0.000 description 1
229910000423 chromium oxide Inorganic materials 0.000 description 1
239000002131 composite material Substances 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
229920006334 epoxy coating Polymers 0.000 description 1
229920006335 epoxy glue Polymers 0.000 description 1
230000003203 everyday effect Effects 0.000 description 1
239000004744 fabric Substances 0.000 description 1
239000007789 gas Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
230000036541 health Effects 0.000 description 1
230000020169 heat generation Effects 0.000 description 1
IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
238000009413 insulation Methods 0.000 description 1
WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
230000005012 migration Effects 0.000 description 1
238000013508 migration Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
239000000615 nonconductor Substances 0.000 description 1
210000004197 pelvis Anatomy 0.000 description 1
230000035699 permeability Effects 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
230000001376 precipitating effect Effects 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000012492 regenerant Substances 0.000 description 1
230000000717 retained effect Effects 0.000 description 1
238000005070 sampling Methods 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
239000007921 spray Substances 0.000 description 1
235000011149 sulphuric acid Nutrition 0.000 description 1
238000004448 titration Methods 0.000 description 1
238000005406 washing Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
ing And Chemical Polishing (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Electrolytic Production Of Metals (AREA)
Chemical And Physical Treatments For Wood And The Like (AREA)
Catalysts (AREA)

SE0102994A 2001-09-10 2001-09-10 Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet SE519898C2 (sv)

Priority Applications (9)

Application Number	Priority Date	Filing Date	Title
SE0102994A SE519898C2 (sv)	2001-09-10	2001-09-10	Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet
JP2003528080A JP4216718B2 (ja)	2001-09-10	2002-09-09	基板への銅エッチング方法、デバイスおよびこれに用いる電解液
EP02798066A EP1425948B1 (de)	2001-09-10	2002-09-09	Verfahren zum ätzen von kupfer auf karten
DE60226984T DE60226984D1 (de)	2001-09-10	2002-09-09	Verfahren zum ätzen von kupfer auf karten
AT02798066T ATE397843T1 (de)	2001-09-10	2002-09-09	Verfahren zum ätzen von kupfer auf karten
US10/487,745 US7767074B2 (en)	2001-09-10	2002-09-09	Method of etching copper on cards
CNA028176588A CN1554215A (zh)	2001-09-10	2002-09-09	腐蚀卡上的铜的方法
PCT/SE2002/001602 WO2003024172A2 (en)	2001-09-10	2002-09-09	A method of etching copper on cards
AU2002334517A AU2002334517A1 (en)	2001-09-10	2002-09-09	A method of etching copper on cards

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SE0102994A SE519898C2 (sv)	2001-09-10	2001-09-10	Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Publications (3)

Publication Number	Publication Date
SE0102994D0 SE0102994D0 (sv)	2001-09-10
SE0102994L SE0102994L (sv)	2003-03-11
SE519898C2 true SE519898C2 (sv)	2003-04-22

Family

ID=20285274

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE0102994A SE519898C2 (sv)	2001-09-10	2001-09-10	Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet

Country Status (9)

Country	Link
US (1)	US7767074B2 (de)
EP (1)	EP1425948B1 (de)
JP (1)	JP4216718B2 (de)
CN (1)	CN1554215A (de)
AT (1)	ATE397843T1 (de)
AU (1)	AU2002334517A1 (de)
DE (1)	DE60226984D1 (de)
SE (1)	SE519898C2 (de)
WO (1)	WO2003024172A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102005011298A1 (de) *	2005-03-04	2006-09-07	Gebr. Schmid Gmbh & Co.	Vorrichtung und Verfahren zum Ätzen von Substraten
FR2937054B1 (fr)	2008-10-13	2010-12-10	Commissariat Energie Atomique	Procede et dispositif de decontamination d'une surface metallique.
PL2508267T3 (pl) *	2011-04-04	2014-11-28	J Wagner Ag	Odwracalna dysza do materiałów powłokowych do pistoletu natryskowego do powlekania obrabianego przedmiotu materiałem powłokowym
KR102179814B1 (ko) *	2013-11-08	2020-11-17	엘지전자 주식회사	가전기기용 외장 패널 및 그 제조방법
WO2019066584A1 (ko) *	2017-09-28	2019-04-04	주식회사 어썸리드	전해연마용 전극 프레임 및 이를 포함하는 전해연마 장치
IT201700110569A1 (it) *	2017-10-03	2019-04-03	Univ Degli Studi Di Palermo	Apparato e metodo per il recupero di rame a partire da scarti di dispositivi elettrici ed elettronici

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1362159A (en) *	1917-04-04	1920-12-14	Jackson S Weeks	Composition for electrolytes for electrical etching
NL268373A (de) *	1960-08-23
JPS5313177B2 (de) *	1973-06-20	1978-05-08
DE2850542C2 (de) *	1978-11-22	1982-07-01	Kernforschungsanlage Jülich GmbH, 5170 Jülich	Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
DE3020012C2 (de) *	1980-05-24	1983-03-03	Daimler-Benz Ag, 7000 Stuttgart	Verfahren zum Freilegen der Siliciumkristalle an der Oberfläche eines Körpers aus einer Aluminiumlegierung mit hohem Siliciumgehalt
US4973380A (en) *	1983-10-06	1990-11-27	Olin Corporation	Process for etching copper base materials
US5035778A (en) *	1989-05-12	1991-07-30	International Business Machines Corporation	Regeneration of spent ferric chloride etchants
US5302240A (en) *	1991-01-22	1994-04-12	Kabushiki Kaisha Toshiba	Method of manufacturing semiconductor device
US5196053A (en) *	1991-11-27	1993-03-23	Mcgean-Rohco, Inc.	Complexing agent for displacement tin plating
US5284554A (en)	1992-01-09	1994-02-08	International Business Machines Corporation	Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
AU4141697A (en)	1996-09-06	1998-03-26	Obducat Ab	Method for anisotropic etching of structures in conducting materials
US6143158A (en) *	1997-04-25	2000-11-07	Fuji Photo Film Co., Ltd.	Method for producing an aluminum support for a lithographic printing plate
EP0889680A3 (de)	1997-07-01	2000-07-05	Deutsche Thomson-Brandt Gmbh	Verfahren zur Entfernung und/oder Aufbringung von leitendem Material
JP4431203B2 (ja)	1998-08-10	2010-03-10	義和小林	塩化第二鉄エッチング液の管理装置
US6638686B2 (en) *	1999-12-09	2003-10-28	Fuji Photo Film Co., Ltd.	Planographic printing plate

2001
- 2001-09-10 SE SE0102994A patent/SE519898C2/sv not_active IP Right Cessation
2002
- 2002-09-09 WO PCT/SE2002/001602 patent/WO2003024172A2/en not_active Ceased
- 2002-09-09 AT AT02798066T patent/ATE397843T1/de not_active IP Right Cessation
- 2002-09-09 US US10/487,745 patent/US7767074B2/en not_active Expired - Fee Related
- 2002-09-09 JP JP2003528080A patent/JP4216718B2/ja not_active Expired - Fee Related
- 2002-09-09 EP EP02798066A patent/EP1425948B1/de not_active Expired - Lifetime
- 2002-09-09 AU AU2002334517A patent/AU2002334517A1/en not_active Abandoned
- 2002-09-09 DE DE60226984T patent/DE60226984D1/de not_active Expired - Lifetime
- 2002-09-09 CN CNA028176588A patent/CN1554215A/zh active Pending

Also Published As

Publication number	Publication date
WO2003024172A3 (en)	2003-06-05
US7767074B2 (en)	2010-08-03
DE60226984D1 (de)	2008-07-17
JP2005502785A (ja)	2005-01-27
ATE397843T1 (de)	2008-06-15
SE0102994D0 (sv)	2001-09-10
SE0102994L (sv)	2003-03-11
WO2003024172A8 (en)	2004-05-06
WO2003024172A2 (en)	2003-03-20
JP4216718B2 (ja)	2009-01-28
CN1554215A (zh)	2004-12-08
US20050082257A1 (en)	2005-04-21
EP1425948A2 (de)	2004-06-09
AU2002334517A1 (en)	2003-03-24
EP1425948B1 (de)	2008-06-04

Legal Events

Date	Code	Title	Description
2012-07-03	NUG	Patent has lapsed

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