CS257114B1 - Carrier for bulk cleaning, especially silicon wafers in an acoustic environment - Google Patents

Abstract

The solution relates to a carrier for mass cleaning, in particular of silicon wafers in an acoustic environment. The essence of the solution is that the carrier consists of two rotating faces, which are provided with pins. On the edges of the rotating faces are attached combs, of which at least one is attached removably.

Description

BACKGROUND OF THE INVENTION The present invention relates to a carrier for mass cleaning of silicon wafers, in particular, in an acoustic environment.

Silicon wafer cleaning is currently carried out on mechanical cleaners that use brush cleaning. The brushes rotate and scrub the surface of the silicon thatch, while a jet of cleaning fluid jets on the cleaned surface of the silicon thatch, thus removing surface contaminants. Brushing and a jet of liquid under pressure use higher pressures that cause mechanical damage to the silicon wafers. It is also known to purify in a liquid acoustic environment where a silicon wafer carrier is used, but under static conditions, which results in uneven cleaning.

These drawbacks are alleviated and the technical problem is solved by a carrier for mass cleaning of silicon wafers, in particular, in an acoustic environment, which consists of two rotating faces which are provided with pins. Ridges are attached to the edges of the rotary faces, at least one of which is detachable. It is also essential that the pins are mounted centrally or eccentrically on the rotating cells. The distance between the individual protuberances of the ridge is greater than the thickness of the silicon thatch. The diameter of the circle formed by the projections is smaller than the diameter of thatch. The diameter of the recess circle is heavier than that of thatch.

An advantage of a bulk silicon wafer carrier in an acoustic environment is that due to the planetary movement of the silicon wafer, these are subjected to ultrasonic vibration so that each point on the surface of the silicon thatch is exposed to maximum acoustic vibration, resulting in higher purification quality. cleaning time, as opposed to other cleaning agents of this kind, and also to prevent the accumulation of mechanical impurities at the point where the plate touches the composition.

A carrier for mass cleaning of silicon wafers in an acoustic environment is exemplified in the accompanying drawing, in which Fig. 1 shows the device in axonoinetric view and Fig. 2 shows the device stored in an ultrasonic cleaning vessel.

The carrier for mass cleaning of silicon wafers, in acoustic environment, consists of two rotating faces 3, which are provided with pins 7. The rims 7 are mounted centrally or eccentrically on the rotating faces. At the edges of the rotary faces 3 are mounted ridges 4 of which at least one is disassembled. The distance between the individual ridges 2 of the comb 4 is greater than the thickness of the silicon thatch

1. The diameter of the circle formed by the protrusions 2 is smaller than the diameter of the silicon thatch 1. The diameter of the recesses 11 is larger than the diameter of the silicon thatch 1. The carrier pins 7 are housed in the ultrasonic tub guide 3. The gear 7 and the other the gear 9 is located in the ultrasonic bath 6. The gear 9 is mounted on the output shaft of the electric motor 10.

The function of the bulk silicon carrier in the acoustic environment is as follows: The ridge 4, which is fixed at the edges of the rotary faces 3, is folded out and silicon seals 1 are placed between the protrusions 2 of the ridges 4 and the carrier is closed. After starting the electric motor 10, the carrier is rotated in the ultrasonic bath 6. The silicon that are loosely embedded in the toothed racks 4 roll as the carrier rotates, positioning it against the racks 4, and rotate from the acoustic shadow produced by the racks 4 as a result of which the silicon boards 1 are evenly exposed to ultrasonic vibrations.

Claims (6)

SUBJECT A carrier for mass cleaning, in particular of silicon wafers, in an acoustic environment, characterized in that it consists of two rotary faces (3) provided with pins (7), with ridges (4) attached to the edges of the rotary faces (3), of which at least one is disassembled. 2. A carrier for mass cleaning, in particular of silicon wafers, in acoustic environments according to claim 1, characterized in that the pins (7) are mounted centrally on the rotating faces (3). A support for mass cleaning of silicon wafers in acoustic environment according to claim 1, characterized in that the pins (7) are mounted eccentrically in the rotating faces (3). VYNALEZU 4. A carrier for mass cleaning of silicon wafers in acoustic environment according to claim 1, characterized in that the distance between the individual projections (2) of the ridge (4) is greater than the thickness of the silicon thatch (1). 5. A carrier for mass cleaning, in particular of silicon wafers, in acoustic environment according to claim 1, characterized in that the diameter of the circle formed by the projections (2) is smaller than the diameter of the silicon thatch (1). 6. A carrier for mass cleaning of silicon wafers in acoustic environment according to claim 1, characterized in that the diameter of the recess circle (11) is larger than that of the silicon thatch (1).