DE19882425T1 - Werkzeug zum chemisch-mechanischen Ebnen mit einer linear arbeitenden Polierrolle - Google Patents

Werkzeug zum chemisch-mechanischen Ebnen mit einer linear arbeitenden Polierrolle

Info

Publication number
DE19882425T1
DE19882425T1 DE19882425T DE19882425T DE19882425T1 DE 19882425 T1 DE19882425 T1 DE 19882425T1 DE 19882425 T DE19882425 T DE 19882425T DE 19882425 T DE19882425 T DE 19882425T DE 19882425 T1 DE19882425 T1 DE 19882425T1
Authority
DE
Germany
Prior art keywords
tool
chemical
polishing roller
linear polishing
mechanical leveling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19882425T
Other languages
English (en)
Inventor
Thomas N Tucker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE19882425T1 publication Critical patent/DE19882425T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE19882425T 1997-05-29 1998-05-21 Werkzeug zum chemisch-mechanischen Ebnen mit einer linear arbeitenden Polierrolle Withdrawn DE19882425T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/865,606 US5967881A (en) 1997-05-29 1997-05-29 Chemical mechanical planarization tool having a linear polishing roller
PCT/US1998/010562 WO1998053952A1 (en) 1997-05-29 1998-05-21 Chemical mechanical planarization tool having a linear polishing roller

Publications (1)

Publication Number Publication Date
DE19882425T1 true DE19882425T1 (de) 2000-05-11

Family

ID=25345868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882425T Withdrawn DE19882425T1 (de) 1997-05-29 1998-05-21 Werkzeug zum chemisch-mechanischen Ebnen mit einer linear arbeitenden Polierrolle

Country Status (6)

Country Link
US (1) US5967881A (de)
JP (1) JP2000512919A (de)
KR (1) KR20010013142A (de)
DE (1) DE19882425T1 (de)
GB (1) GB2340777A (de)
WO (1) WO1998053952A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3019026B2 (ja) * 1997-05-30 2000-03-13 日本電気株式会社 球状鏡面加工方法および装置
US6221774B1 (en) * 1998-04-10 2001-04-24 Silicon Genesis Corporation Method for surface treatment of substrates
WO1999053528A2 (en) * 1998-04-10 1999-10-21 Silicon Genesis Corporation Surface treatment process and system
US6193588B1 (en) * 1998-09-02 2001-02-27 Micron Technology, Inc. Method and apparatus for planarizing and cleaning microelectronic substrates
US6235635B1 (en) * 1998-11-19 2001-05-22 Chartered Semiconductor Manufacturing Ltd. Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning
US6309279B1 (en) 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
JP2001168072A (ja) * 1999-12-06 2001-06-22 Mitsubishi Electric Corp 半導体基板ウエハの研磨方法及び研磨装置
US6620029B2 (en) 2002-01-30 2003-09-16 International Business Machines Corporation Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces
USD477458S1 (en) 2002-02-22 2003-07-22 Tracey Goldwitz Umbrella assembly
USD498046S1 (en) 2002-02-04 2004-11-09 Tracy Forlini Goldwitz Umbrella assembly
USD498917S1 (en) 2002-02-22 2004-11-30 Tracy Forlini Goldwitz Umbrella assembly
USD493278S1 (en) 2003-05-19 2004-07-27 Tracy Forlini Goldwitz Umbrella assembly
JP2009285774A (ja) * 2008-05-29 2009-12-10 Showa Denko Kk 表面加工方法及び装置
US8535118B2 (en) * 2011-09-20 2013-09-17 International Business Machines Corporation Multi-spindle chemical mechanical planarization tool
KR101347029B1 (ko) * 2012-03-21 2014-01-07 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
KR101362243B1 (ko) * 2012-03-21 2014-02-13 주식회사 케이엔제이 반도체 패키지 슬리밍장치
KR101347027B1 (ko) * 2012-03-21 2014-01-07 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
KR101327527B1 (ko) * 2012-03-21 2013-11-08 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
KR101347028B1 (ko) * 2012-03-21 2014-01-07 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
KR101347026B1 (ko) * 2012-03-21 2014-01-07 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
KR101347030B1 (ko) * 2012-03-22 2014-01-07 주식회사 케이엔제이 반도체 패키지 슬리밍장치 및 방법
JP6658617B2 (ja) * 2017-02-28 2020-03-04 Ｊｆｅスチール株式会社 スラリー塗布方法および塗布装置
JP7530237B2 (ja) * 2020-08-17 2024-08-07 キオクシア株式会社 研磨装置および研磨方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB261227A (en) * 1926-02-13 1926-11-18 Charles Albert Dellamonica Improvements relating to grinding or polishing rollers for glass and the like
US3583110A (en) * 1968-09-26 1971-06-08 Owens Illinois Inc Method of polishing
JPS57194866A (en) * 1981-05-21 1982-11-30 Shin Etsu Chem Co Ltd Lapping device
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
DE3644854A1 (de) * 1985-07-31 1987-07-30 Speedfam Corp Werkstueckhalter
JPS6362673A (ja) * 1986-09-01 1988-03-18 Speedfam Co Ltd 定寸機構付き平面研磨装置
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
EP0302516B1 (de) * 1987-08-06 1993-12-15 Mitsubishi Rayon Co., Ltd. Optischer Gegenstand, hergestellt aus thermoplastischem amorphem Polyesterharz
US5083401A (en) * 1988-08-08 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Method of polishing
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
US5036625A (en) * 1988-12-07 1991-08-06 Anatoly Gosis Lapping plate for a lapping and polishing machine
JP2525892B2 (ja) * 1989-04-06 1996-08-21 ロデール・ニッタ 株式会社 ポリッシング方法およびポリッシング装置
US5203067A (en) * 1991-05-22 1993-04-20 Defazio August Reuse of plastic
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
US5245790A (en) * 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
US5245796A (en) * 1992-04-02 1993-09-21 At&T Bell Laboratories Slurry polisher using ultrasonic agitation
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
EP0589433B1 (de) * 1992-09-24 1999-07-28 Ebara Corporation Poliergerät
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
JPH07211677A (ja) * 1993-11-30 1995-08-11 M Setetsuku Kk 基板のスクラビング方法とその装置
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JP3566417B2 (ja) * 1994-10-31 2004-09-15 株式会社荏原製作所 ポリッシング装置
US5769696A (en) * 1995-02-10 1998-06-23 Advanced Micro Devices, Inc. Chemical-mechanical polishing of thin materials using non-baked carrier film
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
KR100227924B1 (ko) * 1995-07-28 1999-11-01 가이데 히사오 반도체 웨이퍼 제조방법, 그 방법에 사용되는 연삭방법 및 이에 사용되는 장치
KR100189970B1 (ko) * 1995-08-07 1999-06-01 윤종용 웨이퍼 연마장치
JP3447869B2 (ja) * 1995-09-20 2003-09-16 株式会社荏原製作所 洗浄方法及び装置
US5575706A (en) * 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
KR100202659B1 (ko) * 1996-07-09 1999-06-15 구본준 반도체웨이퍼의 기계화학적 연마장치

Also Published As

Publication number Publication date
GB9928177D0 (en) 2000-01-26
WO1998053952A1 (en) 1998-12-03
JP2000512919A (ja) 2000-10-03
US5967881A (en) 1999-10-19
GB2340777A (en) 2000-03-01
KR20010013142A (ko) 2001-02-26

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee