DK0412893T3 - Fremgangsmåde til fremstilling af kortlegemer og kort med grafiske elementer samt således tilvejebragte kort - Google Patents

Fremgangsmåde til fremstilling af kortlegemer og kort med grafiske elementer samt således tilvejebragte kort

Info

Publication number
DK0412893T3
DK0412893T3 DK90402246.4T DK90402246T DK0412893T3 DK 0412893 T3 DK0412893 T3 DK 0412893T3 DK 90402246 T DK90402246 T DK 90402246T DK 0412893 T3 DK0412893 T3 DK 0412893T3
Authority
DK
Denmark
Prior art keywords
cards
graphic elements
card bodies
making card
making
Prior art date
Application number
DK90402246.4T
Other languages
English (en)
Inventor
Rene Rose
Original Assignee
Schlumberger Ind Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9384523&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0412893(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger Ind Sa filed Critical Schlumberger Ind Sa
Application granted granted Critical
Publication of DK0412893T3 publication Critical patent/DK0412893T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14106—Positioning or centering articles in the mould using electrostatic attraction or static electricity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14967—Injecting through an opening of the insert
    • B29C2045/14975—Injecting through an opening of the insert the injection nozzle penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DK90402246.4T 1989-08-07 1990-08-06 Fremgangsmåde til fremstilling af kortlegemer og kort med grafiske elementer samt således tilvejebragte kort DK0412893T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8910591A FR2650530B1 (fr) 1989-08-07 1989-08-07 Procede de realisation de corps de carte avec graphisme

Publications (1)

Publication Number Publication Date
DK0412893T3 true DK0412893T3 (da) 1994-02-07

Family

ID=9384523

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90402246.4T DK0412893T3 (da) 1989-08-07 1990-08-06 Fremgangsmåde til fremstilling af kortlegemer og kort med grafiske elementer samt således tilvejebragte kort

Country Status (7)

Country Link
US (1) US5164144A (da)
EP (1) EP0412893B1 (da)
JP (1) JPH03114898A (da)
DE (1) DE69004031T2 (da)
DK (1) DK0412893T3 (da)
ES (1) ES2047877T3 (da)
FR (1) FR2650530B1 (da)

Families Citing this family (38)

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US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
FR2704961A1 (fr) * 1993-05-04 1994-11-10 Schlumberger Ind Sa Procédé de fabrication de cartes à mémoire.
DE4403513A1 (de) * 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5993719A (en) * 1994-09-08 1999-11-30 Idemitsu Petrochemical Co., Ltd. Method of producing a laminated molding
JPH0890600A (ja) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ｉｃカード製造金型
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices
WO1996034730A1 (de) * 1995-05-02 1996-11-07 Hans Auer Verfahren zur herstellung von ein- oder beidseitig mit einem bedruckten etikett versehenen kunststoffkarten oder -scheiben
DE19519902C2 (de) * 1995-05-31 1998-03-19 Richard Herbst Verfahren zum Herstellen von Gegenständen aus Kunststoff sowie Halbzeug zur Verwendung bei diesem Verfahren
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
EP0767041A1 (de) * 1995-10-03 1997-04-09 HERBST, Richard Verfahren und Vorrichtung zum Spritzgiessen, von Kunststofferzeugnissen, insbesondere von Smart Cards
NL1001684C2 (nl) * 1995-11-17 1997-05-21 Ronald Barend Van Santbrink Werkwijze voor het vervaardigen van een chipkaart, chipkaart alsmede werkwijze voor het vervaardigen daarvan.
DE19637306C1 (de) * 1996-09-13 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
EP0913791A1 (en) * 1997-10-30 1999-05-06 Navitas Co., Limited Method for manufacturing card product and manufacturing apparatus therefor
DE19750344C2 (de) * 1997-11-13 2000-05-18 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen eines flachen Kartengrundkörpers für eine Chipkarte
US6128195A (en) * 1997-11-18 2000-10-03 Hestia Technologies, Inc. Transfer molded PCMCIA standard cards
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6241153B1 (en) 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
NL1009563C2 (nl) * 1998-07-06 2000-01-10 Fico Bv Mal, omhulinrichting en werkwijze voor het omhullen.
FR2809228B1 (fr) * 2000-05-22 2003-10-17 St Microelectronics Sa Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique
DE10148525B4 (de) * 2001-10-01 2017-06-01 Morpho Cards Gmbh Chipkarte sowie ein Verfahren zur Herstellung einer derartigen Chipkarte
DE50210779D1 (de) * 2001-10-18 2007-10-04 Trueb Ag Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger
DE10162450B4 (de) * 2001-12-19 2008-06-05 Giesecke & Devrient Gmbh Tragbarer Datenträger sowie Verfahren und Vorrichtung zur Herstellung
US7037455B2 (en) * 2001-12-21 2006-05-02 Mattel, Inc. Insert molding method
KR100484834B1 (ko) * 2002-11-28 2005-04-22 엘지전자 주식회사 세탁기의 디스플레이 패널용 사출금형
CA2601512A1 (en) * 2005-03-23 2006-09-28 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
JP4742877B2 (ja) * 2006-01-18 2011-08-10 住友電装株式会社 樹脂成形品の成形構造
US8215943B2 (en) * 2006-06-01 2012-07-10 Avery Dennison Corporation Heat-transfer label assembly and apparatus for applying heat-transfer labels
US7736568B2 (en) * 2006-09-19 2010-06-15 Mattel, Inc. Systems and methods of incorporating preformed items into a molded article
EP1923821B1 (en) * 2006-11-17 2012-03-28 Oberthur Technologies Method of fabricating an entity and corresponding device
DE102011006034A1 (de) * 2011-03-24 2012-09-27 Bayer Material Science Ag Verfahren zur Herstellung eines Verbundbauteils
DE102014100281A1 (de) * 2014-01-13 2015-07-16 FREMACH GmbH Verfahren zum Umspritzen einer Platine sowie Platine

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FR1234237A (fr) * 1959-05-13 1960-10-14 Perfectionnements à la fabrication d'objets divers par injection de matière plastique
FR1340878A (fr) * 1962-08-27 1963-10-25 Avisun Corp Procédé de fabrication d'articles moulés comportant des sujets décoratifs ou descriptifs et articles résultants
DE2045932A1 (en) * 1970-09-17 1972-03-23 Gdp Edizioni In Plastica Spa Atlas globes - from vacuum drawn plastic sheet lined with an inner transparent supporting layer
US3839129A (en) * 1970-09-25 1974-10-01 Pictorial Prod Inc Reflective foil and process
US3654062A (en) * 1970-09-28 1972-04-04 Standard Products Co Injection molded decorative plaques
JPS5483961A (en) * 1977-12-16 1979-07-04 Yoshida Kogyo Kk Method of making synthetic resin moldings having metallic and stereoscopic designs by insert molding of sensitive plate * and its products and insert parts for its manufacture
DE2853953A1 (de) * 1978-12-14 1980-07-03 Hoechst Ag Identifikationskarte
DE2853893A1 (de) * 1978-12-14 1980-06-26 Hoechst Ag Verfahren zur herstellung von identifikationskarten
US4896027A (en) * 1981-02-27 1990-01-23 Drexler Technology Corporation Portable detachable data record
EP0085673A4 (en) * 1981-08-17 1984-01-09 American Bank Note Co Identification card.
US4420174A (en) * 1981-12-14 1983-12-13 California Interface And Software Limited Partnership Identification card bearing latent image perceptible in the presence of background light
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
GB2185708B (en) * 1986-01-23 1989-10-25 Cerbo Ab Mould for injection moulding
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
FR2609821B1 (fr) * 1987-01-16 1989-03-31 Flonic Sa Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
CH672285A5 (da) * 1987-04-14 1989-11-15 Landis & Gyr Ag
US4879161A (en) * 1987-11-16 1989-11-07 Raymond Geri L Method for printing a double-sided display on transparent film
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede

Also Published As

Publication number Publication date
FR2650530A1 (fr) 1991-02-08
EP0412893A1 (fr) 1991-02-13
EP0412893B1 (fr) 1993-10-20
DE69004031D1 (de) 1993-11-25
FR2650530B1 (fr) 1991-11-29
ES2047877T3 (es) 1994-03-01
US5164144A (en) 1992-11-17
DE69004031T2 (de) 1994-03-31
JPH03114898A (ja) 1991-05-16

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