DK0569801T3 - Flerlags-printplade - Google Patents

Flerlags-printplade

Info

Publication number
DK0569801T3
DK0569801T3 DK93107094.0T DK93107094T DK0569801T3 DK 0569801 T3 DK0569801 T3 DK 0569801T3 DK 93107094 T DK93107094 T DK 93107094T DK 0569801 T3 DK0569801 T3 DK 0569801T3
Authority
DK
Denmark
Prior art keywords
circuit board
implemented
screen
space
printed circuit
Prior art date
Application number
DK93107094.0T
Other languages
English (en)
Inventor
Georg Koch
Dinorah Steiner
Rolf Dipl-Ing Sterwitz
Hans Schlitter
Adam Dipl-Ing Lennert
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19924215553 external-priority patent/DE4215553A1/de
Priority claimed from DE19924224925 external-priority patent/DE4224925A1/de
Priority claimed from DE19934313389 external-priority patent/DE4313389A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK0569801T3 publication Critical patent/DK0569801T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
DK93107094.0T 1992-05-12 1993-04-30 Flerlags-printplade DK0569801T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19924215553 DE4215553A1 (de) 1992-05-12 1992-05-12 SMD-Baugruppe
DE19924224925 DE4224925A1 (de) 1992-07-28 1992-07-28 Mehrlagen-Leiterplatte
DE19934313389 DE4313389A1 (de) 1993-04-23 1993-04-23 Mehrlagen-Leiterplatte

Publications (1)

Publication Number Publication Date
DK0569801T3 true DK0569801T3 (da) 1998-02-23

Family

ID=27203729

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93107094.0T DK0569801T3 (da) 1992-05-12 1993-04-30 Flerlags-printplade

Country Status (6)

Country Link
EP (1) EP0569801B1 (da)
JP (1) JPH0661651A (da)
AT (1) ATE155310T1 (da)
DE (1) DE59306859D1 (da)
DK (1) DK0569801T3 (da)
ES (1) ES2105000T3 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
KR100754065B1 (ko) 2003-11-05 2007-08-31 삼성전기주식회사 매립된 저항을 갖는 인쇄회로기판 제조 방법
DE102006033222B4 (de) * 2006-07-18 2014-04-30 Epcos Ag Modul mit flachem Aufbau und Verfahren zur Bestückung
US9786354B2 (en) 2013-07-10 2017-10-10 Samsung Electronics Co., Ltd. Memory module
EP3800361A1 (de) 2019-10-02 2021-04-07 Siemens Aktiengesellschaft Verankerungseinheit, verfahren zum befestigen einer anlage mit einer verankerungseinheit und anlageneinheit mit verankerungseinheit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870746A (en) * 1988-11-07 1989-10-03 Litton Systems, Inc. Method of making a multilayer printed circuit board having screened-on resistors

Also Published As

Publication number Publication date
ES2105000T3 (es) 1997-10-16
DE59306859D1 (de) 1997-08-14
ATE155310T1 (de) 1997-07-15
JPH0661651A (ja) 1994-03-04
EP0569801A1 (de) 1993-11-18
EP0569801B1 (de) 1997-07-09

Similar Documents

Publication Publication Date Title
EP1165311A4 (en) CERAMIC MULTILAYER BOARD WITH EMBEDDED RESISTORS
KR930003869A (ko) 인쇄회로 기판을 이용한 전자조리기의 가열 장치
GB9218672D0 (en) Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
MY128039A (en) Printed circuit boards and method of producing the same
EP1267596A3 (en) Printed circuit board and its manufacturing method
DE69936892D1 (de) Mehrschichtige Leiterplatte mit gefüllten Kontaktlöchern
DE69312049D1 (de) Kupferkaschiertes Laminat und Leiterplatte
DE69829908D1 (de) Mikroelektronische mehrschichtige Leiterplatte mit trimmbaren Kondensatoren
EP0452812A3 (en) Resistive laminate for printed circuit boards
DE60013505D1 (de) Bestücken von Leiterplatten mit elektronischen Bauteilen
DE69531633D1 (de) Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte
DE59306859D1 (de) Mehrlagen Leiterplatte
DE69406390D1 (de) Laminat und mehrschichtige leiterplatte
DE59105820D1 (de) Herstellung von mehrschichtigen Leiterplatten mit erhöhter Leiterbahnendichte.
KR960028723A (ko) 프린트 회로기판
ATE123372T1 (de) Zwei- oder mehrlagige leiterplatte.
GB9809281D0 (en) Printed circuit and printed wiring boards and methods of manufacture
SE9600085D0 (sv) Skärmning av elektroniska komponenter som plastinbakats direkt på kretskort
KR950001266B1 (ko) 알루미늄 회로기판의 제조방법 및 그 회로기판
Lawrence et al. Polymer thick film: Acomplementary' technology
KR910007302Y1 (ko) 전자부품 내장구조
JPS59119794A (ja) 混成厚膜集積回路
JPH02129762U (da)
ES8702105A1 (es) Procedimiento para la fabricacion de conexiones impresas conmas de cuatro niveles conductores
JP2006332325A (ja) プリント配線板