DK0584143T3 - Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse - Google Patents

Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse

Info

Publication number
DK0584143T3
DK0584143T3 DK92909860.6T DK92909860T DK0584143T3 DK 0584143 T3 DK0584143 T3 DK 0584143T3 DK 92909860 T DK92909860 T DK 92909860T DK 0584143 T3 DK0584143 T3 DK 0584143T3
Authority
DK
Denmark
Prior art keywords
areas
pct
mold space
reduced thickness
reduced
Prior art date
Application number
DK92909860.6T
Other languages
Danish (da)
English (en)
Inventor
Renee-Lucia Barak
Yahya Haghiri-Tehrani
Helmut Baader
Original Assignee
Gao Ges F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25903497&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0584143(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE4115208A external-priority patent/DE4115208C2/de
Priority claimed from DE4142392A external-priority patent/DE4142392C2/de
Application filed by Gao Ges F filed Critical Gao Ges F
Application granted granted Critical
Publication of DK0584143T3 publication Critical patent/DK0584143T3/da

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008Inserting articles into the mould
    • B29C45/14016Intermittently feeding endless articles, e.g. transfer films, to the mould
    • B29C45/14024Intermittently feeding endless articles, e.g. transfer films, to the mould and punching or cutting a portion from the endless articles during mould closing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07724Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C2045/569Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/006Memory cards, chip cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DK92909860.6T 1991-05-10 1992-05-07 Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse DK0584143T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4115208A DE4115208C2 (de) 1991-05-10 1991-05-10 Verfahren und Vorrichtung zum Herstellen von Kunststoff-Formstücken mit bereichsweise reduzierter Wandstärke
DE4142392A DE4142392C2 (de) 1991-12-20 1991-12-20 Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke

Publications (1)

Publication Number Publication Date
DK0584143T3 true DK0584143T3 (da) 1996-02-12

Family

ID=25903497

Family Applications (1)

Application Number Title Priority Date Filing Date
DK92909860.6T DK0584143T3 (da) 1991-05-10 1992-05-07 Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse

Country Status (10)

Country Link
US (1) US5681356A (fr)
EP (1) EP0584143B2 (fr)
JP (1) JP3290986B2 (fr)
AT (1) ATE133105T1 (fr)
DE (1) DE59205116D1 (fr)
DK (1) DK0584143T3 (fr)
ES (1) ES2082470T5 (fr)
GR (1) GR3018955T3 (fr)
HK (1) HK1007705A1 (fr)
WO (1) WO1992020506A1 (fr)

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DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
ES2102317B1 (es) * 1994-09-19 1998-04-16 Nacional Moneda Timbre Tarjeta inteligente de uso en telefonia y similar.
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US5975584A (en) * 1996-08-30 1999-11-02 Adaptech S.A. Carrier card with value chip
KR20000049028A (ko) * 1996-10-09 2000-07-25 피에이브이 카드 게엠베하 칩카드 제조방법과 칩카드제조용 접속장치
US5823071A (en) * 1996-10-31 1998-10-20 Borg-Warner Automotive, Inc. Integrated transmission control system
DE19703122C1 (de) * 1997-01-29 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung von Datenträgern
DE19736082C1 (de) 1997-08-20 1999-01-14 Orga Kartensysteme Gmbh Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens
FR2778002B1 (fr) * 1998-04-22 2000-06-30 Gemplus Card Int Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede
ATE424589T1 (de) * 1999-08-12 2009-03-15 Ovd Kinegram Ag Datenträger
JP4606553B2 (ja) * 2000-08-11 2011-01-05 大日本印刷株式会社 カード状基材の製造用金型およびカード状基材の製造方法
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
US6588099B2 (en) * 2001-01-22 2003-07-08 Sankyo Kasei Kabushiki Kaisha Process for manufacturing molded circuit board
US20060187805A1 (en) * 2001-02-22 2006-08-24 Lars Lind Method for production of an optical disc with a detachable module
EP1249330A1 (fr) * 2001-04-12 2002-10-16 Dynamit Nobel Kunststoff GmbH Procédé de fabrication d'une pièce en matière plastique et pièce
WO2003052680A1 (fr) 2001-12-18 2003-06-26 Digimarc Id System, Llc Elements de securite a images multiples pour documents d'identification, et procedes de realisation
FR2834103B1 (fr) * 2001-12-20 2004-04-02 Gemplus Card Int Carte a puce a module de surface etendue
AU2002364255A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
AU2002364746A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
US7207494B2 (en) 2001-12-24 2007-04-24 Digimarc Corporation Laser etched security features for identification documents and methods of making same
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
AU2002361855A1 (en) * 2001-12-24 2003-07-15 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
WO2003088144A2 (fr) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Techniques de traitement d'images pour imprimer des cartes et des documents d'identification
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US7804982B2 (en) 2002-11-26 2010-09-28 L-1 Secure Credentialing, Inc. Systems and methods for managing and detecting fraud in image databases used with identification documents
ATE491190T1 (de) 2003-04-16 2010-12-15 L 1 Secure Credentialing Inc Dreidimensionale datenspeicherung
US7744002B2 (en) 2004-03-11 2010-06-29 L-1 Secure Credentialing, Inc. Tamper evident adhesive and identification document including same
DE102007062459B4 (de) 2007-12-22 2022-10-27 Leuze Electronic Gmbh + Co. Kg Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile
WO2012057102A1 (fr) * 2010-10-29 2012-05-03 コニカミノルタオプト株式会社 Matrice de formage, micropuce fabriquée à l'aude d'une matrice et appareil de fabrication d'une micropuce
NO348516B1 (no) * 2013-04-30 2025-02-24 Sinvent As En fremgangsmåte for fremstilling av et lab-på-brikke-system og et lab-på-brikke-system
GB2542711B (en) * 2015-09-25 2019-04-10 Gr8 Eng Ltd Injection moulding method
DE102015119235B4 (de) * 2015-11-09 2019-01-10 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
CN109564634B (zh) 2016-07-27 2026-04-14 安全创造有限责任公司 用于交易卡的经包覆模制的电子部件及其制造方法
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
NZ762589A (en) 2017-09-07 2022-05-27 Composecure Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
DE102021210271A1 (de) * 2021-09-16 2023-03-16 Magna Exteriors Gmbh Verfahren zum Herstellen von Kunststoffbauteilen

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Also Published As

Publication number Publication date
US5681356A (en) 1997-10-28
JP3290986B2 (ja) 2002-06-10
WO1992020506A1 (fr) 1992-11-26
ES2082470T5 (es) 2003-12-16
HK1007705A1 (en) 1999-04-23
ES2082470T3 (es) 1996-03-16
ATE133105T1 (de) 1996-02-15
EP0584143B1 (fr) 1996-01-17
EP0584143B2 (fr) 2003-04-16
DE59205116D1 (de) 1996-02-29
EP0584143A1 (fr) 1994-03-02
GR3018955T3 (en) 1996-05-31
JPH06507126A (ja) 1994-08-11

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