DK0760986T3 - Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden - Google Patents

Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Info

Publication number
DK0760986T3
DK0760986T3 DK95920907T DK95920907T DK0760986T3 DK 0760986 T3 DK0760986 T3 DK 0760986T3 DK 95920907 T DK95920907 T DK 95920907T DK 95920907 T DK95920907 T DK 95920907T DK 0760986 T3 DK0760986 T3 DK 0760986T3
Authority
DK
Denmark
Prior art keywords
pct
module
electronic circuit
electronic module
sec
Prior art date
Application number
DK95920907T
Other languages
Danish (da)
English (en)
Inventor
Ake Gustafson
Original Assignee
Ake Gustafson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ake Gustafson filed Critical Ake Gustafson
Application granted granted Critical
Publication of DK0760986T3 publication Critical patent/DK0760986T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Textile Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Bipolar Transistors (AREA)
DK95920907T 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden DK0760986T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94810312 1994-05-27
PCT/EP1995/002038 WO1995033246A1 (fr) 1994-05-27 1995-05-29 Procede de realisation d'un module electronique et module electronique obtenu selon ce procede

Publications (1)

Publication Number Publication Date
DK0760986T3 true DK0760986T3 (da) 1999-05-25

Family

ID=8218261

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95920907T DK0760986T3 (da) 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Country Status (11)

Country Link
US (1) US5879502A (de)
EP (1) EP0760986B1 (de)
JP (1) JP3866282B2 (de)
AT (1) ATE170307T1 (de)
AU (1) AU684174B2 (de)
BR (1) BR9507775A (de)
CA (1) CA2190294C (de)
DE (1) DE69504336T2 (de)
DK (1) DK0760986T3 (de)
ES (1) ES2122620T3 (de)
WO (1) WO1995033246A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001211A (en) * 1995-07-18 1999-12-14 Oki Electric Industry Co., Ltd. Method of producing a tag device with IC capacitively coupled to antenna
US6059917A (en) * 1995-12-08 2000-05-09 Texas Instruments Incorporated Control of parallelism during semiconductor die attach
FR2744819B1 (fr) * 1996-02-09 1998-08-21 Solaic Sa Carte a circuit integre sans contact, procede et outillage pour la fabrication d'une telle carte
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
US6038133A (en) 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
DK1068589T3 (da) 1998-04-02 2002-02-25 Swisscom Mobile Ag Fremgangsmåde ved indlæsning af data på et chipkort og indretning tilpasset hertil
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
DE19843425A1 (de) * 1998-09-22 2000-03-23 Kunz Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
ATE464620T1 (de) * 1999-01-04 2010-04-15 Ident Technology Gmbh X Verbundmaterialeinheiten mit transponder
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
DE19931189A1 (de) * 1999-07-07 2001-01-25 Meritor Automotive Gmbh Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge
US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
JP2002109491A (ja) * 2000-09-29 2002-04-12 Sony Corp Ｉｃカード及びその製造方法
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
FR2819935B1 (fr) * 2001-01-19 2003-04-25 Ela Medical Sa Procede de fabrication de circuits electroniques hybrides pour dispositifs medicaux implantables actifs
US6357664B1 (en) 2001-05-24 2002-03-19 Identicard Systems Incorporated Identification card utilizing an integrated circuit
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
EP1456810B1 (de) 2001-12-18 2011-05-11 L-1 Secure Credentialing, Inc. Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung
ATE552120T1 (de) 2001-12-24 2012-04-15 L 1 Secure Credentialing Inc Verdeckte variableninformationen auf id- dokumenten und verfahren zu ihrer herstellung
WO2003056499A2 (en) * 2001-12-24 2003-07-10 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
CA2470600C (en) 2001-12-24 2009-12-22 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
AU2002364036A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Laser etched security features for identification documents and methods of making same
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US6702185B1 (en) 2002-11-13 2004-03-09 Identicard Systems, Incorporated Identification device having an integrated circuit
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
AU2003298731A1 (en) 2002-11-26 2004-06-18 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
US7225991B2 (en) 2003-04-16 2007-06-05 Digimarc Corporation Three dimensional data storage
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
JP2006298144A (ja) * 2005-04-20 2006-11-02 Nippon Sheet Glass Co Ltd パネルおよびパネルの製造方法
EP2084654B1 (de) 2006-05-17 2012-10-17 Landqart Flexibler schichtaufbau mit integriertem schaltkreis
EP1970951A3 (de) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
EP2372756A1 (de) * 2007-03-13 2011-10-05 Semiconductor Energy Laboratory Co, Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
JP5268395B2 (ja) * 2007-03-26 2013-08-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1976000A3 (de) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Herstellungsverfahren für Halbleitervorrichtung
EP2066161A4 (de) * 2007-06-19 2010-11-17 Murata Manufacturing Co Methode zur herstellung eines substrates mit eingebetteter komponente und substrat mit eingebetteter komponente
JP2009205669A (ja) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
WO2009142310A1 (en) * 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2009142309A1 (en) * 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2010041045A (ja) * 2008-07-09 2010-02-18 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
KR102026604B1 (ko) 2008-07-10 2019-10-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
WO2010032611A1 (en) * 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2010035627A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101677076B1 (ko) * 2009-06-05 2016-11-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 디바이스 및 그 제조 방법
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
CN102460722B (zh) * 2009-06-05 2015-04-01 株式会社半导体能源研究所 光电转换装置及其制造方法
TWI517268B (zh) 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
FR2977944B1 (fr) * 2011-07-15 2014-02-28 Senstronic Dispositif electronique et son procede de fabrication
FR3012682B1 (fr) * 2013-10-28 2016-01-01 Tagsys Procede de fabrication d'une etiquette de radio-identification
FR3038426B1 (fr) * 2015-06-30 2018-09-14 Idemia France Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant
UA127393C2 (uk) * 2016-12-16 2023-08-09 Кт & Г Корпорейшон Система генерування аерозолю та мундштук, що вставляється у внутрішній простір системи генерування аерозолю
US12274294B2 (en) 2017-03-30 2025-04-15 Kt&G Corporation Aerosol generating apparatus and cradle capable of receiving same
US12102131B2 (en) 2017-04-11 2024-10-01 Kt&G Corporation Aerosol generating device and method for providing adaptive feedback through puff recognition
DE102024107861A1 (de) * 2024-03-19 2025-09-25 Giesecke+Devrient ePayments GmbH Verfahren zum herstellen eines trägerkörpers, portabler datenträger und herstellungsvorrichtung für selbige

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955974A (en) * 1957-06-10 1960-10-11 Int Resistance Co Metal to plastic laminated article and the method of making the same
US3600263A (en) * 1969-08-13 1971-08-17 Universal Oil Prod Co Metal clad laminates
US3940534A (en) * 1973-11-07 1976-02-24 G. T. Schjeldahl Company Electrical laminate
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
EP0128822B1 (de) * 1983-06-09 1987-09-09 Flonic S.A. Verfahren zur Herstellung von Speicherkarten und hierdurch hergestellte Karten
JPS60227406A (ja) * 1984-04-25 1985-11-12 Nippon Lsi Kaade Kk 電子または電気回路の接続装置
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
WO1990012668A1 (en) * 1989-04-27 1990-11-01 Amoco Corporation Apparatus and method for fabricating printed circuit boards
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
AU655455B2 (en) * 1991-02-25 1994-12-22 Assa Abloy Ab Method for fixing a winding to an electronic circuit
HK1007815A1 (en) * 1993-03-18 1999-04-23 Nagraid S.A. Method for producing a card with at least one electronic component, and card thereby obtained

Also Published As

Publication number Publication date
DE69504336T2 (de) 1999-01-21
JPH10501475A (ja) 1998-02-10
WO1995033246A1 (fr) 1995-12-07
CA2190294A1 (fr) 1995-12-07
EP0760986B1 (de) 1998-08-26
AU684174B2 (en) 1997-12-04
BR9507775A (pt) 1997-08-19
AU2617095A (en) 1995-12-21
ATE170307T1 (de) 1998-09-15
EP0760986A1 (de) 1997-03-12
CA2190294C (fr) 2005-07-12
ES2122620T3 (es) 1998-12-16
US5879502A (en) 1999-03-09
DE69504336D1 (de) 1998-10-01
JP3866282B2 (ja) 2007-01-10

Similar Documents

Publication Publication Date Title
DK0760986T3 (da) Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden
DK0742926T3 (da) Databærer med et elektronisk modul og fremgangsmåde til fremstilling af denne
MY109784A (en) Card comprising at least one electronic element and method of manufacture of such a card.
DK1216453T3 (da) Fremgangsmåde ved fremstilling af et chipkort og chipkort tilvejebragt ifølge fremgangsmåden
ES2184243T3 (es) Procedimiento de fabricacion de tarjeta con antena bobinada.
EP0706152A3 (de) Chip-Karte und Verfahren zu deren Herstellung
ATE229204T1 (de) Verfahren zur herstellung von kontaktlosen karten
DE60036103D1 (de) Verfahren zur herstellung einer kontaktlosen hybriden chipkarte mit einem antennenträger aus fasermaterial
ATE213349T1 (de) Elektronisches modul für karten und herstellung eines solchen moduls
FR2769389B1 (fr) Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
IE841284L (en) Metallisable substrates for printed circuits
FR2580416B1 (fr) Procede et dispositif pour fabriquer une carte d'identification electronique
FR2617666B1 (fr) Carte a microcircuits electroniques et son procede de fabrication
DE69214463D1 (de) Verfahren zur herstellung von plastiklaminaten mit metallschichten insbesondere für gedruckte schaltungen
AU3845495A (en) Board with at least one built-in electronic element
TW371786B (en) Ultrahigh frequency electronic component and method of manufacturing the same
ATE287560T1 (de) Minichipkarte sowie verfahren zu ihrer herstellung
TW358943B (en) Non-contact IC card, the manufacturing method and the device
ATE140582T1 (de) Vorrichtung mit einem kunststoffträger zur aufnahme und halterung eines elektronischen moduls
AU1652700A (en) Method for embedding an ic component into a foamed layer of a chip card
DE69914902D1 (de) Verfahren zur herstellung einer ic-karte und eine solche hergestellte karte
AU2507997A (en) Electronic card for electromagnectic data exchange and a process for manufacturing such a card
NO841047L (no) Plateholder, spesielt for rf-moensterkort, samt fremgangsmaate til fremstilling av denne
ATE389920T1 (de) Folienbatterie mit integriertem bauelement zur verwendung in einer chipkarte
FR2816107B1 (fr) Module de circuit integre sur film et son procede de fabrication