DK0760986T3 - Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden - Google Patents

Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Info

Publication number
DK0760986T3
DK0760986T3 DK95920907T DK95920907T DK0760986T3 DK 0760986 T3 DK0760986 T3 DK 0760986T3 DK 95920907 T DK95920907 T DK 95920907T DK 95920907 T DK95920907 T DK 95920907T DK 0760986 T3 DK0760986 T3 DK 0760986T3
Authority
DK
Denmark
Prior art keywords
pct
module
electronic circuit
electronic module
sec
Prior art date
Application number
DK95920907T
Other languages
Danish (da)
English (en)
Inventor
Ake Gustafson
Original Assignee
Ake Gustafson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ake Gustafson filed Critical Ake Gustafson
Application granted granted Critical
Publication of DK0760986T3 publication Critical patent/DK0760986T3/da

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109Embedding of laminae within face of additional laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Textile Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Bipolar Transistors (AREA)
DK95920907T 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden DK0760986T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94810312 1994-05-27
PCT/EP1995/002038 WO1995033246A1 (fr) 1994-05-27 1995-05-29 Procede de realisation d'un module electronique et module electronique obtenu selon ce procede

Publications (1)

Publication Number Publication Date
DK0760986T3 true DK0760986T3 (da) 1999-05-25

Family

ID=8218261

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95920907T DK0760986T3 (da) 1994-05-27 1995-05-29 Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden

Country Status (11)

Country Link
US (1) US5879502A (de)
EP (1) EP0760986B1 (de)
JP (1) JP3866282B2 (de)
AT (1) ATE170307T1 (de)
AU (1) AU684174B2 (de)
BR (1) BR9507775A (de)
CA (1) CA2190294C (de)
DE (1) DE69504336T2 (de)
DK (1) DK0760986T3 (de)
ES (1) ES2122620T3 (de)
WO (1) WO1995033246A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001211A (en) * 1995-07-18 1999-12-14 Oki Electric Industry Co., Ltd. Method of producing a tag device with IC capacitively coupled to antenna
US6059917A (en) * 1995-12-08 2000-05-09 Texas Instruments Incorporated Control of parallelism during semiconductor die attach
FR2744819B1 (fr) * 1996-02-09 1998-08-21 Solaic Sa Carte a circuit integre sans contact, procede et outillage pour la fabrication d'une telle carte
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
EP1068589B1 (de) 1998-04-02 2001-11-14 Swisscom Mobile AG Verfahren zum laden von daten auf chipkarten und entsprechend angepasste vorrichtungen
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
DE19843425A1 (de) * 1998-09-22 2000-03-23 Kunz Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
EP1018702B1 (de) * 1999-01-04 2010-04-14 X-ident technology GmbH Verbundmaterialeinheiten mit transponder
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
DE19931189A1 (de) * 1999-07-07 2001-01-25 Meritor Automotive Gmbh Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge
US6304232B1 (en) 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
JP2002109491A (ja) * 2000-09-29 2002-04-12 Sony Corp Icカード及びその製造方法
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
FR2819935B1 (fr) * 2001-01-19 2003-04-25 Ela Medical Sa Procede de fabrication de circuits electroniques hybrides pour dispositifs medicaux implantables actifs
US6357664B1 (en) 2001-05-24 2002-03-19 Identicard Systems Incorporated Identification card utilizing an integrated circuit
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
WO2003052680A1 (en) 2001-12-18 2003-06-26 Digimarc Id System, Llc Multiple image security features for identification documents and methods of making same
AU2002364746A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
US7207494B2 (en) 2001-12-24 2007-04-24 Digimarc Corporation Laser etched security features for identification documents and methods of making same
AU2002364255A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
AU2002361855A1 (en) * 2001-12-24 2003-07-15 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
US6702185B1 (en) 2002-11-13 2004-03-09 Identicard Systems, Incorporated Identification device having an integrated circuit
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
US7804982B2 (en) 2002-11-26 2010-09-28 L-1 Secure Credentialing, Inc. Systems and methods for managing and detecting fraud in image databases used with identification documents
US7712673B2 (en) 2002-12-18 2010-05-11 L-L Secure Credentialing, Inc. Identification document with three dimensional image of bearer
ATE491190T1 (de) 2003-04-16 2010-12-15 L 1 Secure Credentialing Inc Dreidimensionale datenspeicherung
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
JP2006298144A (ja) * 2005-04-20 2006-11-02 Nippon Sheet Glass Co Ltd パネルおよびパネルの製造方法
KR20090017606A (ko) 2006-05-17 2009-02-18 랜드쿼트 집적 회로를 구비한 유연층 구조
EP1970951A3 (de) 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
EP1970952A3 (de) 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Herstellungsverfahren dafür
EP1976001A3 (de) * 2007-03-26 2012-08-22 Semiconductor Energy Laboratory Co., Ltd. Herstellungsverfahren für Halbleitervorrichtung
EP1976000A3 (de) * 2007-03-26 2009-05-13 Semiconductor Energy Laboratory Co., Ltd. Herstellungsverfahren für Halbleitervorrichtung
KR20090010963A (ko) * 2007-06-19 2009-01-30 가부시키가이샤 무라타 세이사쿠쇼 부품 내장 기판의 제조 방법 및 부품 내장 기판
JP2009205669A (ja) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
WO2009142310A1 (en) * 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN102037556B (zh) * 2008-05-23 2016-02-10 株式会社半导体能源研究所 半导体器件
JP2010041045A (ja) * 2008-07-09 2010-02-18 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
KR101802137B1 (ko) 2008-07-10 2017-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
CN102160179B (zh) * 2008-09-19 2014-05-14 株式会社半导体能源研究所 半导体装置及其制造方法
WO2010035627A1 (en) 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
WO2010140539A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
WO2010140495A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
TWI517268B (zh) 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
FR2977944B1 (fr) * 2011-07-15 2014-02-28 Senstronic Dispositif electronique et son procede de fabrication
FR3012682B1 (fr) * 2013-10-28 2016-01-01 Tagsys Procede de fabrication d'une etiquette de radio-identification
FR3038426B1 (fr) * 2015-06-30 2018-09-14 Idemia France Procede d'application d'une couche adhesive sur un substrat, et dispositif d'application correspondant
RU2749137C2 (ru) * 2016-12-16 2021-06-04 Кей Ти Энд Джи Корпорейшн Устройство и способ генерирования аэрозоля
RU2737855C1 (ru) 2017-03-30 2020-12-03 Кей Ти Энд Джи Корпорейшн Устройство генерирования аэрозоля и держатель с возможностью размещения этого устройства
US12295420B2 (en) 2017-04-11 2025-05-13 Kt&G Corporation Aerosol generation system of preheating heater
DE102024107861A1 (de) * 2024-03-19 2025-09-25 Giesecke+Devrient ePayments GmbH Verfahren zum herstellen eines trägerkörpers, portabler datenträger und herstellungsvorrichtung für selbige

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955974A (en) * 1957-06-10 1960-10-11 Int Resistance Co Metal to plastic laminated article and the method of making the same
US3600263A (en) * 1969-08-13 1971-08-17 Universal Oil Prod Co Metal clad laminates
US3940534A (en) * 1973-11-07 1976-02-24 G. T. Schjeldahl Company Electrical laminate
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
JPS60227406A (ja) * 1984-04-25 1985-11-12 Nippon Lsi Kaade Kk 電子または電気回路の接続装置
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
EP0424505A1 (de) * 1989-04-27 1991-05-02 Amoco Corporation Vorrichtung und verfahren zur herstellung gedruckter schaltungsplatten
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Icカードの製造方法
US5572410A (en) * 1991-02-25 1996-11-05 Gustafson; Ake Integrated circuit device having a winding connected to an integrated circuit solely by a wire
DE69401634T3 (de) * 1993-03-18 2002-06-13 Nagrald S.A., La Chaux-De-Fonds Verfahren zur herstellung einer karte, die mindestens einen elektronischen baustein enthält,und nach einem solchen verfahren hergestellte karte

Also Published As

Publication number Publication date
EP0760986A1 (de) 1997-03-12
EP0760986B1 (de) 1998-08-26
WO1995033246A1 (fr) 1995-12-07
ATE170307T1 (de) 1998-09-15
ES2122620T3 (es) 1998-12-16
BR9507775A (pt) 1997-08-19
DE69504336D1 (de) 1998-10-01
JP3866282B2 (ja) 2007-01-10
CA2190294A1 (fr) 1995-12-07
AU2617095A (en) 1995-12-21
AU684174B2 (en) 1997-12-04
JPH10501475A (ja) 1998-02-10
US5879502A (en) 1999-03-09
CA2190294C (fr) 2005-07-12
DE69504336T2 (de) 1999-01-21

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