DK0878565T3 - Fremgangsmåde og indretning til kontinuerlig bejdsning - Google Patents

Fremgangsmåde og indretning til kontinuerlig bejdsning

Info

Publication number
DK0878565T3
DK0878565T3 DK98201092T DK98201092T DK0878565T3 DK 0878565 T3 DK0878565 T3 DK 0878565T3 DK 98201092 T DK98201092 T DK 98201092T DK 98201092 T DK98201092 T DK 98201092T DK 0878565 T3 DK0878565 T3 DK 0878565T3
Authority
DK
Denmark
Prior art keywords
anode
substrate
face
width
magnetic circuit
Prior art date
Application number
DK98201092T
Other languages
English (en)
Inventor
Brande Pierre Vanden
Alain Weymeersch
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Application granted granted Critical
Publication of DK0878565T3 publication Critical patent/DK0878565T3/da

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32752Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761Continuous moving
    • H01J37/3277Continuous moving of continuous material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Weting (AREA)
  • Thin Magnetic Films (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
DK98201092T 1997-04-10 1998-04-02 Fremgangsmåde og indretning til kontinuerlig bejdsning DK0878565T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9700329A BE1011098A3 (fr) 1997-04-10 1997-04-10 Procede et dispositif de decapage.

Publications (1)

Publication Number Publication Date
DK0878565T3 true DK0878565T3 (da) 2003-01-06

Family

ID=3890458

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98201092T DK0878565T3 (da) 1997-04-10 1998-04-02 Fremgangsmåde og indretning til kontinuerlig bejdsning

Country Status (8)

Country Link
US (1) US6066241A (da)
EP (1) EP0878565B1 (da)
AT (1) ATE223520T1 (da)
BE (1) BE1011098A3 (da)
DE (1) DE69807571T2 (da)
DK (1) DK0878565T3 (da)
ES (1) ES2183284T3 (da)
PT (1) PT878565E (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10252178A1 (de) * 2002-11-09 2004-05-27 Sms Demag Ag Verfahren und Vorrichtung zum Entzundern und/oder Reinigen eines Metallstrangs
EP1783814A1 (fr) * 2005-11-07 2007-05-09 ARCELOR France Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique
US20090145747A1 (en) * 2005-11-07 2009-06-11 Acrelormittal France Method and installation for the vacuum colouring of a metal strip by means of magnetron sputtering
EP1783815A1 (fr) * 2005-11-07 2007-05-09 ARCELOR France Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique
JP5828770B2 (ja) * 2012-01-24 2015-12-09 株式会社神戸製鋼所 真空成膜装置
FR3088346B1 (fr) * 2018-11-14 2025-12-05 Safran Aircraft Engines Procede de decapage d’une piece de turbomachine

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175125A (ja) * 1983-03-24 1984-10-03 Toshiba Corp ドライエツチング装置
FR2592520B1 (fr) * 1985-12-27 1988-12-09 Atelier Electro Thermie Const Dispositif de creation d'un champ magnetique glissant, en particulier pour gravure ionique rapide sous champ magnetique
US4896813A (en) * 1989-04-03 1990-01-30 Toyo Kohan Co., Ltd. Method and apparatus for cold rolling clad sheet
US5079481A (en) * 1990-08-02 1992-01-07 Texas Instruments Incorporated Plasma-assisted processing magneton with magnetic field adjustment
US5082542A (en) * 1990-08-02 1992-01-21 Texas Instruments Incorporated Distributed-array magnetron-plasma processing module and method
KR100297358B1 (ko) * 1991-07-23 2001-11-30 히가시 데쓰로 플라즈마에칭장치
JPH0768620B2 (ja) * 1991-09-30 1995-07-26 中外炉工業株式会社 金属ストリップの表面清浄化装置
US5262030A (en) * 1992-01-15 1993-11-16 Alum Rock Technology Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates
US5399253A (en) * 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device

Also Published As

Publication number Publication date
EP0878565A1 (fr) 1998-11-18
EP0878565B1 (fr) 2002-09-04
BE1011098A3 (fr) 1999-04-06
ATE223520T1 (de) 2002-09-15
DE69807571T2 (de) 2003-04-17
PT878565E (pt) 2002-12-31
ES2183284T3 (es) 2003-03-16
US6066241A (en) 2000-05-23
DE69807571D1 (de) 2002-10-10

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