DK0878565T3 - Fremgangsmåde og indretning til kontinuerlig bejdsning - Google Patents

Fremgangsmåde og indretning til kontinuerlig bejdsning

Info

Publication number
DK0878565T3
DK0878565T3 DK98201092T DK98201092T DK0878565T3 DK 0878565 T3 DK0878565 T3 DK 0878565T3 DK 98201092 T DK98201092 T DK 98201092T DK 98201092 T DK98201092 T DK 98201092T DK 0878565 T3 DK0878565 T3 DK 0878565T3
Authority
DK
Denmark
Prior art keywords
anode
substrate
face
width
magnetic circuit
Prior art date
Application number
DK98201092T
Other languages
English (en)
Inventor
Brande Pierre Vanden
Alain Weymeersch
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Application granted granted Critical
Publication of DK0878565T3 publication Critical patent/DK0878565T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • ing And Chemical Polishing (AREA)
  • Thin Magnetic Films (AREA)
DK98201092T 1997-04-10 1998-04-02 Fremgangsmåde og indretning til kontinuerlig bejdsning DK0878565T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9700329A BE1011098A3 (fr) 1997-04-10 1997-04-10 Procede et dispositif de decapage.

Publications (1)

Publication Number Publication Date
DK0878565T3 true DK0878565T3 (da) 2003-01-06

Family

ID=3890458

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98201092T DK0878565T3 (da) 1997-04-10 1998-04-02 Fremgangsmåde og indretning til kontinuerlig bejdsning

Country Status (8)

Country Link
US (1) US6066241A (da)
EP (1) EP0878565B1 (da)
AT (1) ATE223520T1 (da)
BE (1) BE1011098A3 (da)
DE (1) DE69807571T2 (da)
DK (1) DK0878565T3 (da)
ES (1) ES2183284T3 (da)
PT (1) PT878565E (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10252178A1 (de) * 2002-11-09 2004-05-27 Sms Demag Ag Verfahren und Vorrichtung zum Entzundern und/oder Reinigen eines Metallstrangs
EP1783814A1 (fr) * 2005-11-07 2007-05-09 ARCELOR France Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique
EP1783815A1 (fr) * 2005-11-07 2007-05-09 ARCELOR France Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique
US20090145747A1 (en) * 2005-11-07 2009-06-11 Acrelormittal France Method and installation for the vacuum colouring of a metal strip by means of magnetron sputtering
JP5828770B2 (ja) * 2012-01-24 2015-12-09 株式会社神戸製鋼所 真空成膜装置
FR3088346B1 (fr) * 2018-11-14 2025-12-05 Safran Aircraft Engines Procede de decapage d’une piece de turbomachine

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175125A (ja) * 1983-03-24 1984-10-03 Toshiba Corp ドライエツチング装置
FR2592520B1 (fr) * 1985-12-27 1988-12-09 Atelier Electro Thermie Const Dispositif de creation d'un champ magnetique glissant, en particulier pour gravure ionique rapide sous champ magnetique
US4896813A (en) * 1989-04-03 1990-01-30 Toyo Kohan Co., Ltd. Method and apparatus for cold rolling clad sheet
US5082542A (en) * 1990-08-02 1992-01-21 Texas Instruments Incorporated Distributed-array magnetron-plasma processing module and method
US5079481A (en) * 1990-08-02 1992-01-07 Texas Instruments Incorporated Plasma-assisted processing magneton with magnetic field adjustment
KR100297358B1 (ko) * 1991-07-23 2001-11-30 히가시 데쓰로 플라즈마에칭장치
JPH0768620B2 (ja) * 1991-09-30 1995-07-26 中外炉工業株式会社 金属ストリップの表面清浄化装置
US5262030A (en) * 1992-01-15 1993-11-16 Alum Rock Technology Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates
US5399253A (en) * 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device

Also Published As

Publication number Publication date
PT878565E (pt) 2002-12-31
DE69807571D1 (de) 2002-10-10
ES2183284T3 (es) 2003-03-16
ATE223520T1 (de) 2002-09-15
US6066241A (en) 2000-05-23
EP0878565A1 (fr) 1998-11-18
EP0878565B1 (fr) 2002-09-04
BE1011098A3 (fr) 1999-04-06
DE69807571T2 (de) 2003-04-17

Similar Documents

Publication Publication Date Title
DK0590746T3 (da) Proteaser til inhibering og fjernelse af biofilm
IL132165A (en) Article, method, and apparatus for electrochemical fabrication
ATE217036T1 (de) Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut
AU3050095A (en) Method of inhibiting corrosion in aqueous systems
TW348370B (en) Control apparatus comprising at least two housing parts
EP0831516A3 (en) Device and method for processing a plasma to alter the surface of a substrate using neutrals
KR950007032A (ko) 반도체장치의 절연층 형성방법 및 그 형성장치
TW326574B (en) Semiconductor apparatus and process thereof
ES2183284T3 (es) Procedimiento y dispositivo de decapado.
BR0115005B1 (pt) elemento de resfriamento.
ATE292842T1 (de) Verfahren und vorrichtung zur oberflächenbehandlung von substraten
ATE355730T1 (de) Vorrichtung zum transport von flexiblem flachmaterial, insbesondere leiterplatten
ATE300630T1 (de) Säurebehandlung von rostfreiem stahl
ES2151633T3 (es) Procedimiento y dispositivo para el decapado de un substrato metalico.
DK0908535T3 (da) Fremgangsmåde til at dekapere et substrat og anlæg til at udføre fremgangsmåden
DE59802800D1 (de) Vorrichtung zum elektrolytischen behandeln von plattenförmigem behandlungsgut und verfahren zum elektrischen abschirmen von randbereichen des behandlungsgutes bei der electrolytischen behandlung
DE69815943D1 (de) Verfahren zum Durchlaufglühen von Metallsubstraten
FR2764110B1 (fr) Dispositif et procede de gravure par ions
DE59303918D1 (de) Gehäuse zum Einbau von elektrischen oder elektronischen Bauteilen bzw. Baugruppen
CA2076741A1 (en) Pulse cathodic protection system
DE59303802D1 (de) Gehäuse zum Einbau von elektrischen oder elektronischen Bauteilen bzw. Baugruppen
AU662896B2 (en) Method and device for the surface treatment of a metallic product in a reactive solution, in particular for the pickling or galvanizing of hot-rolled sheets
IT1278136B1 (it) Associazione costituita dsa lattoferrina (o suoi analoghi) e deferossamina metalsulfonato (o altri chelanti ioni metallici) per
KR970008374A (ko) 플라즈마에칭장치 및 플라즈마에칭방법
DE69906705D1 (de) Verfahren zur konservierung von versilberten objekten und vorrichtung dafür