DK0931327T3 - Passivt netværk i form af en chip - Google Patents

Passivt netværk i form af en chip

Info

Publication number
DK0931327T3
DK0931327T3 DK97909192T DK97909192T DK0931327T3 DK 0931327 T3 DK0931327 T3 DK 0931327T3 DK 97909192 T DK97909192 T DK 97909192T DK 97909192 T DK97909192 T DK 97909192T DK 0931327 T3 DK0931327 T3 DK 0931327T3
Authority
DK
Denmark
Prior art keywords
chip
passive network
capacitors
led out
chip wafer
Prior art date
Application number
DK97909192T
Other languages
English (en)
Inventor
Klaus-Dieter Aichholzer
Gerald Kainz
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Application granted granted Critical
Publication of DK0931327T3 publication Critical patent/DK0931327T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
DK97909192T 1996-09-27 1997-09-25 Passivt netværk i form af en chip DK0931327T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19639947A DE19639947A1 (de) 1996-09-27 1996-09-27 Passives Netzwerk in Chip-Bauform
PCT/DE1997/002184 WO1998013841A1 (de) 1996-09-27 1997-09-25 Passives netzwerk in chip-bauform

Publications (1)

Publication Number Publication Date
DK0931327T3 true DK0931327T3 (da) 2002-06-10

Family

ID=7807198

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97909192T DK0931327T3 (da) 1996-09-27 1997-09-25 Passivt netværk i form af en chip

Country Status (10)

Country Link
US (1) US6246300B1 (da)
EP (1) EP0931327B1 (da)
KR (1) KR20000048663A (da)
CN (1) CN1132204C (da)
AT (1) ATE214839T1 (da)
DE (2) DE19639947A1 (da)
DK (1) DK0931327T3 (da)
ES (1) ES2174223T3 (da)
PT (1) PT931327E (da)
WO (1) WO1998013841A1 (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19758345A1 (de) * 1997-12-22 1999-06-24 Inst Halbleiterphysik Gmbh Digital abstimmbare, elektronische Kapazität
AU5276899A (en) * 1998-09-03 2000-03-27 Yingui Zhou Method and apparatus of spot scan image
US6476695B1 (en) * 1999-05-26 2002-11-05 Sharp Kabushiki Kaisha High frequency module
DE10064447C2 (de) 2000-12-22 2003-01-02 Epcos Ag Elektrisches Vielschichtbauelement und Entstörschaltung mit dem Bauelement
DE10224566A1 (de) * 2002-06-03 2003-12-18 Epcos Ag Elektrisches Vielschichtbauelement
DE10224565A1 (de) * 2002-06-03 2003-12-18 Epcos Ag Elektrisches Vielschichtbauelement und Schaltungsanordnung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0169053B1 (en) * 1984-07-16 1990-10-10 Nippondenso Co., Ltd. High frequency filter for electric instruments
US5307309A (en) * 1988-05-31 1994-04-26 Micron Technology, Inc. Memory module having on-chip surge capacitors
JPH0693589B2 (ja) * 1989-03-23 1994-11-16 株式会社村田製作所 Ｌｃフィルター
EP0423821B1 (en) 1989-10-20 1995-12-20 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
MY105486A (en) 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
JPH0453219A (ja) * 1990-06-20 1992-02-20 Murata Mfg Co Ltd 表面実装型電子部品
DE4135007C2 (de) 1990-10-25 1994-12-22 Cts Corp SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung
US5495387A (en) * 1991-08-09 1996-02-27 Murata Manufacturing Co., Ltd. RC array
WO1993019527A1 (fr) 1992-03-19 1993-09-30 Tdk Corporation Coupleur hybride
DE4410753C2 (de) * 1993-03-29 2003-02-20 Murata Manufacturing Co Kondensator-Array
JPH06283384A (ja) * 1993-03-30 1994-10-07 Taiyo Yuden Co Ltd チップ型コンデンサアレイ
JPH06283385A (ja) * 1993-03-30 1994-10-07 Taiyo Yuden Co Ltd チップ型コンデンサアレイ
US5388024A (en) * 1993-08-02 1995-02-07 Avx Corporation Trapezoid chip capacitor
JPH07169649A (ja) 1993-12-16 1995-07-04 Tdk Corp 積層貫通型コンデンサアレイ

Also Published As

Publication number Publication date
ATE214839T1 (de) 2002-04-15
PT931327E (pt) 2002-09-30
WO1998013841A1 (de) 1998-04-02
EP0931327A1 (de) 1999-07-28
CN1132204C (zh) 2003-12-24
KR20000048663A (ko) 2000-07-25
CN1231758A (zh) 1999-10-13
DE19639947A1 (de) 1998-04-16
DE59706696D1 (de) 2002-04-25
US6246300B1 (en) 2001-06-12
EP0931327B1 (de) 2002-03-20
ES2174223T3 (es) 2002-11-01

Similar Documents

Publication Publication Date Title
DE59008471D1 (de) Leistungshalbleitermodul.
EP0682368A3 (en) Metallization for polymer dielectric multichip modules.
DE19983535T1 (de) RJ Kontakt/Filter-Module
DE69638295D1 (de) Halbleiterleistungsmodul
DE69733603D1 (de) NMOS, negative Ladungspumpe
DE69943196D1 (de) Halbleiter-Leistungs-Modul
DE69415252D1 (de) Hochleistungs-Halbleiter-Schaltmodul
DE69920323D1 (de) Netzwerkschnittstellenmodul
DE59709052D1 (de) Multichipmodul
FI990846L (fi) Tilaajaidentiteettimoduulin hallinta
DE59508681D1 (de) Leistungshalbleitermodul
DE69907590D1 (de) Halbleitermodul
DE59611438D1 (de) Leistungs-Halbleitermodul mit Anschlussstiften
DE59706696D1 (de) Passives netzwerk in chip-bauform
DE59009880D1 (de) Telekommunikations-Endgerät.
DE69828487D1 (de) Überspannungsableiter ohne Chips
DE69811600D1 (de) Halbleiterlasermodul
IT9047587A1 (it) Componente semiconduttore di potenza, cellulare.
DE69120595D1 (de) Kompakter, elektronengepumpter Halbleiterlaser
DE59611447D1 (de) Leistungs-Halbleitermodul
DE69802854D1 (de) Halbleiterlaser-Modul
EE200000787A (et) Moodul mobiilterminalidele
DE59204034D1 (de) Baugruppe aus mehreren, in parallelen Ebenen angeordneten Montageplatten.
NL1009352A1 (nl) Halfgeleiderscomponent.
DE3584821D1 (de) Schaltungsanordnung fuer fernsprechnetze.