ES2174223T3 - Red pasiva en forma de construccion de un chip. - Google Patents

Red pasiva en forma de construccion de un chip.

Info

Publication number
ES2174223T3
ES2174223T3 ES97909192T ES97909192T ES2174223T3 ES 2174223 T3 ES2174223 T3 ES 2174223T3 ES 97909192 T ES97909192 T ES 97909192T ES 97909192 T ES97909192 T ES 97909192T ES 2174223 T3 ES2174223 T3 ES 2174223T3
Authority
ES
Spain
Prior art keywords
chip
passive network
construction
series
discochip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97909192T
Other languages
English (en)
Inventor
Klaus-Dieter Aichholzer
Gerald Kainz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Application granted granted Critical
Publication of ES2174223T3 publication Critical patent/ES2174223T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

SE DESCRIBE UNA RED PASIVA, COMO POR EJEMPLO UNA SERIE-CC EN FORMA DE CHIP, EN LA QUE LOS CONDUCTORES INTERIORES DE UNA SERIE DE CONDENSADORES SE SACAN COMO CONEXIONES (1-4) EN UNA SUPERFICIE LATERAL LONGITUDINAL (L1) DEL DISCO-CHIP (10). UNOS ELECTRODOS DE MASA (0) COMUNES AL NUMERO DE CONDENSADORES SE LLEVAN, POR OTRA PARTE, A LAS DOS SUPERFICIES DEL LADO FRONTAL (S1, S2) DEL DISCOCHIP (10).
ES97909192T 1996-09-27 1997-09-25 Red pasiva en forma de construccion de un chip. Expired - Lifetime ES2174223T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19639947A DE19639947A1 (de) 1996-09-27 1996-09-27 Passives Netzwerk in Chip-Bauform

Publications (1)

Publication Number Publication Date
ES2174223T3 true ES2174223T3 (es) 2002-11-01

Family

ID=7807198

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97909192T Expired - Lifetime ES2174223T3 (es) 1996-09-27 1997-09-25 Red pasiva en forma de construccion de un chip.

Country Status (10)

Country Link
US (1) US6246300B1 (es)
EP (1) EP0931327B1 (es)
KR (1) KR20000048663A (es)
CN (1) CN1132204C (es)
AT (1) ATE214839T1 (es)
DE (2) DE19639947A1 (es)
DK (1) DK0931327T3 (es)
ES (1) ES2174223T3 (es)
PT (1) PT931327E (es)
WO (1) WO1998013841A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19758345A1 (de) * 1997-12-22 1999-06-24 Inst Halbleiterphysik Gmbh Digital abstimmbare, elektronische Kapazität
WO2000014704A1 (en) * 1998-09-03 2000-03-16 Yingui Zhou Method and apparatus of spot scan image
KR20010049422A (ko) * 1999-05-26 2001-06-15 마찌다 가쯔히꼬 고주파 모듈
DE10064447C2 (de) 2000-12-22 2003-01-02 Epcos Ag Elektrisches Vielschichtbauelement und Entstörschaltung mit dem Bauelement
DE10224565A1 (de) * 2002-06-03 2003-12-18 Epcos Ag Elektrisches Vielschichtbauelement und Schaltungsanordnung
DE10224566A1 (de) * 2002-06-03 2003-12-18 Epcos Ag Elektrisches Vielschichtbauelement

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3580070D1 (de) * 1984-07-16 1990-11-15 Nippon Denso Co Hf-filter fuer elektronische instrumente.
US5307309A (en) * 1988-05-31 1994-04-26 Micron Technology, Inc. Memory module having on-chip surge capacitors
JPH0693589B2 (ja) * 1989-03-23 1994-11-16 株式会社村田製作所 Ｌｃフィルター
DE69024313T2 (de) 1989-10-20 1996-06-13 Matsushita Electric Ind Co Ltd Oberflächenmontierbare Netzwerkvorrichtung
MY105486A (en) 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
JPH0453219A (ja) * 1990-06-20 1992-02-20 Murata Mfg Co Ltd 表面実装型電子部品
DE4135007C2 (de) 1990-10-25 1994-12-22 Cts Corp SMD-Bauelemente mit Maßnahmen gegen Lötbrückenbildung und Temperaturwechselbeanspruchung
US5495387A (en) * 1991-08-09 1996-02-27 Murata Manufacturing Co., Ltd. RC array
DE69321907T2 (de) * 1992-03-19 1999-04-22 Tdk Corp., Tokio/Tokyo Hybrider koppler
DE4410753C2 (de) * 1993-03-29 2003-02-20 Murata Manufacturing Co Kondensator-Array
JPH06283384A (ja) * 1993-03-30 1994-10-07 Taiyo Yuden Co Ltd チップ型コンデンサアレイ
JPH06283385A (ja) * 1993-03-30 1994-10-07 Taiyo Yuden Co Ltd チップ型コンデンサアレイ
US5388024A (en) * 1993-08-02 1995-02-07 Avx Corporation Trapezoid chip capacitor
JPH07169649A (ja) * 1993-12-16 1995-07-04 Tdk Corp 積層貫通型コンデンサアレイ

Also Published As

Publication number Publication date
KR20000048663A (ko) 2000-07-25
DE59706696D1 (de) 2002-04-25
DK0931327T3 (da) 2002-06-10
DE19639947A1 (de) 1998-04-16
US6246300B1 (en) 2001-06-12
EP0931327B1 (de) 2002-03-20
CN1132204C (zh) 2003-12-24
PT931327E (pt) 2002-09-30
CN1231758A (zh) 1999-10-13
EP0931327A1 (de) 1999-07-28
ATE214839T1 (de) 2002-04-15
WO1998013841A1 (de) 1998-04-02

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