DK1342311T3 - Elektrostatisk anordning til at gribe en elektronisk komponentwafer - Google Patents

Elektrostatisk anordning til at gribe en elektronisk komponentwafer

Info

Publication number
DK1342311T3
DK1342311T3 DK01270946T DK01270946T DK1342311T3 DK 1342311 T3 DK1342311 T3 DK 1342311T3 DK 01270946 T DK01270946 T DK 01270946T DK 01270946 T DK01270946 T DK 01270946T DK 1342311 T3 DK1342311 T3 DK 1342311T3
Authority
DK
Denmark
Prior art keywords
wafer
gripping
support
electronic component
planar
Prior art date
Application number
DK01270946T
Other languages
Danish (da)
English (en)
Inventor
David Ferreres
Original Assignee
Semco Engineering Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Engineering Sa filed Critical Semco Engineering Sa
Application granted granted Critical
Publication of DK1342311T3 publication Critical patent/DK1342311T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Elimination Of Static Electricity (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DK01270946T 2000-12-12 2001-12-12 Elektrostatisk anordning til at gribe en elektronisk komponentwafer DK1342311T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0016154A FR2818050B1 (fr) 2000-12-12 2000-12-12 Dispositif de prehension electrostatique d'une tranche de composant electronique

Publications (1)

Publication Number Publication Date
DK1342311T3 true DK1342311T3 (da) 2004-10-18

Family

ID=8857544

Family Applications (1)

Application Number Title Priority Date Filing Date
DK01270946T DK1342311T3 (da) 2000-12-12 2001-12-12 Elektrostatisk anordning til at gribe en elektronisk komponentwafer

Country Status (11)

Country Link
US (1) US7133273B2 (de)
EP (1) EP1342311B1 (de)
JP (1) JP4155823B2 (de)
KR (1) KR100589796B1 (de)
AT (1) ATE269601T1 (de)
AU (1) AU2002217253A1 (de)
DE (1) DE60103930T2 (de)
DK (1) DK1342311T3 (de)
ES (1) ES2220668T3 (de)
FR (1) FR2818050B1 (de)
WO (1) WO2002049200A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE526745C2 (sv) * 2003-04-17 2005-11-01 Nobel Biocare Ab Fixtur för förankring i käkben
TWD133946S1 (zh) * 2008-07-21 2010-03-21 Ａｓｍ吉尼泰克韓國股份有限公司 用於半導體沉積器械之基底轉換器
KR101515184B1 (ko) 2010-06-11 2015-04-24 가부시키가이샤 리코 정보 저장 장치, 탈착 장치, 현상제 용기 및 화상 형성 장치
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
FR2980994B1 (fr) 2011-10-07 2015-11-27 Semco Engineering Prehenseur multi-plaquettes.
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
JP6011965B2 (ja) * 2012-09-19 2016-10-25 パナソニックＩｐマネジメント株式会社 プラズマダイシング方法及びプラズマダイシング装置
CN104526698B (zh) * 2014-12-04 2016-06-01 北京七星华创电子股份有限公司 一种高强度的机械手臂、控制方法以及机械手装置
JP7036905B2 (ja) * 2018-04-26 2022-03-15 京セラ株式会社 フォーカスリング搬送部材およびこれを備えるプラズマ処理装置
KR102242812B1 (ko) * 2018-05-17 2021-04-22 세메스 주식회사 반송 유닛 및 이를 갖는 기판 처리 장치
US11121019B2 (en) 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck
EP3614422A1 (de) 2018-08-22 2020-02-26 Meyer Burger AG Elektrostatische haltevorrichtung
US11437257B2 (en) * 2019-05-08 2022-09-06 Samsung Electronics Co., Ltd. Robot hand, wafer transfer robot, and wafer transfer apparatus
US11696821B2 (en) 2021-03-31 2023-07-11 Toyota Motor Engineering & Manufacturing North America, Inc. Asymmetric electrode insulation for artificial muscles

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443215A (en) * 1973-11-07 1976-07-21 Mullard Ltd Electrostatically clamping a semiconductor wafer during device manufacture
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JPH01303079A (ja) * 1988-05-30 1989-12-06 Abisare:Kk フレキシブル差込み端子を有する静電吸着板
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
DE19523229A1 (de) * 1995-06-27 1997-01-02 Riad Dipl Ing Salim Mikrogreifer für die Mikromontage
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
DE19715083A1 (de) * 1997-04-11 1997-08-28 Univ Ilmenau Tech Mechanischer Greifer, insbesondere zum Greifen kleiner Objekte
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
JPH11157953A (ja) 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
US6174011B1 (en) * 1999-04-14 2001-01-16 Arthur Keigler Method of and apparatus for handling thin and flat workpieces and the like

Also Published As

Publication number Publication date
EP1342311A1 (de) 2003-09-10
FR2818050A1 (fr) 2002-06-14
KR20030064812A (ko) 2003-08-02
ES2220668T3 (es) 2004-12-16
ATE269601T1 (de) 2004-07-15
FR2818050B1 (fr) 2006-08-11
US7133273B2 (en) 2006-11-07
DE60103930D1 (de) 2004-07-22
DE60103930T2 (de) 2005-06-23
JP4155823B2 (ja) 2008-09-24
EP1342311B1 (de) 2004-06-16
WO2002049200A1 (fr) 2002-06-20
JP2004516660A (ja) 2004-06-03
US20040070914A1 (en) 2004-04-15
KR100589796B1 (ko) 2006-06-14
AU2002217253A1 (en) 2002-06-24

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