DK1578881T3 - Klæbemiddel med carboxylbenzotriazol til forbedret vedhæftning til metalsubstrater - Google Patents

Klæbemiddel med carboxylbenzotriazol til forbedret vedhæftning til metalsubstrater

Info

Publication number: DK1578881T3
Authority: DK; Denmark
Prior art keywords: adhesive; improved adhesion; carboxylbenzotriazole; metal substrates; elements
Prior art date: 2003-01-02

Application number

DK03814857T

Other languages

English (en)

Inventor

Tadashi Takano

Original Assignee

Nat Starch Chem Invest

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-01-02

Filing date

2003-12-12

Publication date

2008-01-02

2003-12-12 Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest

2008-01-02 Application granted granted Critical

2008-01-02 Publication of DK1578881T3 publication Critical patent/DK1578881T3/da

Links

239000002184 metal Substances 0.000 title abstract 3
229910052751 metal Inorganic materials 0.000 title abstract 3
239000000758 substrate Substances 0.000 title abstract 3
KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 title abstract 2
239000000853 adhesive Substances 0.000 title abstract 2
230000001070 adhesive effect Effects 0.000 title abstract 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
229910052802 copper Inorganic materials 0.000 abstract 2
239000010949 copper Substances 0.000 abstract 2
229920005989 resin Polymers 0.000 abstract 2
239000011347 resin Substances 0.000 abstract 2
239000003822 epoxy resin Substances 0.000 abstract 1
239000003999 initiator Substances 0.000 abstract 1
239000000203 mixture Substances 0.000 abstract 1
229920000647 polyepoxide Polymers 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Adhesives Or Adhesive Processes (AREA)
Die Bonding (AREA)
Epoxy Resins (AREA)

DK03814857T 2003-01-02 2003-12-12 Klæbemiddel med carboxylbenzotriazol til forbedret vedhæftning til metalsubstrater DK1578881T3 (da)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US10/336,067 US6822047B2 (en)	2003-01-02	2003-01-02	Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
PCT/US2003/040323 WO2004061039A1 (en)	2003-01-02	2003-12-12	Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates

Publications (1)

Publication Number	Publication Date
DK1578881T3 true DK1578881T3 (da)	2008-01-02

Family

ID=32680916

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK03814857T DK1578881T3 (da)	2003-01-02	2003-12-12	Klæbemiddel med carboxylbenzotriazol til forbedret vedhæftning til metalsubstrater

Country Status (10)

Country	Link
US (1)	US6822047B2 (da)
EP (1)	EP1578881B1 (da)
JP (1)	JP2006512455A (da)
KR (1)	KR101088350B1 (da)
CN (1)	CN1294222C (da)
AT (1)	ATE372368T1 (da)
AU (1)	AU2003301044A1 (da)
DE (1)	DE60316186T2 (da)
DK (1)	DK1578881T3 (da)
WO (1)	WO2004061039A1 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20080292801A1 (en) *	2007-05-23	2008-11-27	National Starch And Chemical Investment Holding Corporation	Corrosion-Preventive Adhesive Compositions
JP5500787B2 (ja) *	2008-06-03	2014-05-21	リンテック株式会社	接着剤組成物、接着シートおよび半導体装置の製造方法
CN103210130A (zh)	2010-11-16	2013-07-17	株式会社Adeka	聚合物的长期稳定化方法以及无纺布、弹性体组合物的制造方法
AT523588B1 (de) *	2020-03-03	2024-05-15	Miba Gleitlager Austria Gmbh	Gleitlack
CN111995867B (zh) *	2020-07-28	2021-10-12	江南大学	第三代半导体器件封装用热固性树脂组合物及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61166541A (ja) *	1985-01-19	1986-07-28	Fuotopori Ouka Kk	光重合性組成物
US4680249A (en) *	1986-05-28	1987-07-14	E. I. Du Pont De Nemours And Company	Photopolymerizable composition containing carboxy benzotriazole
JP2540921B2 (ja) *	1988-11-15	1996-10-09	東亞合成株式会社	硬化性組成物
JPH1124263A (ja) *	1997-07-04	1999-01-29	Hitachi Chem Co Ltd	感光性樹脂組成物
JPH1192740A (ja) *	1997-09-24	1999-04-06	Hitachi Chem Co Ltd	樹脂ペースト組成物および半導体装置
CN1243141A (zh) *	1998-07-02	2000-02-02	国家淀粉及化学投资控股公司	使用可再加工粘合剂制造电子元件的方法
US6207786B1 (en)	1998-11-10	2001-03-27	Edison Polymer Innovation Corporation	Ternary systems of benzoxazine, epoxy, and phenolic resins
US6750301B1 (en) *	2000-07-07	2004-06-15	National Starch And Chemical Investment Holding Corporation	Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
KR100383515B1 (ko) *	2000-09-01	2003-05-12	삼성전자주식회사	수용성 접착력 강화제 폴리머 및 그의 제조방법
CN1216516C (zh) *	2000-09-21	2005-08-24	麦克德米德有限公司	改善高分子材料与金属表面粘附性的方法

2003
- 2003-01-02 US US10/336,067 patent/US6822047B2/en not_active Expired - Lifetime
- 2003-12-12 DE DE60316186T patent/DE60316186T2/de not_active Expired - Lifetime
- 2003-12-12 AT AT03814857T patent/ATE372368T1/de not_active IP Right Cessation
- 2003-12-12 EP EP03814857A patent/EP1578881B1/en not_active Expired - Lifetime
- 2003-12-12 KR KR1020047013651A patent/KR101088350B1/ko not_active Expired - Fee Related
- 2003-12-12 AU AU2003301044A patent/AU2003301044A1/en not_active Abandoned
- 2003-12-12 JP JP2004565554A patent/JP2006512455A/ja active Pending
- 2003-12-12 DK DK03814857T patent/DK1578881T3/da active
- 2003-12-12 WO PCT/US2003/040323 patent/WO2004061039A1/en not_active Ceased
- 2003-12-12 CN CNB2003801003064A patent/CN1294222C/zh not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE60316186T2 (de)	2008-02-21
JP2006512455A (ja)	2006-04-13
HK1082956A1 (en)	2006-06-23
US20040132955A1 (en)	2004-07-08
ATE372368T1 (de)	2007-09-15
WO2004061039A1 (en)	2004-07-22
DE60316186D1 (de)	2007-10-18
CN1294222C (zh)	2007-01-10
AU2003301044A1 (en)	2004-07-29
KR20050084777A (ko)	2005-08-29
EP1578881A1 (en)	2005-09-28
EP1578881B1 (en)	2007-09-05
US6822047B2 (en)	2004-11-23
CN1692151A (zh)	2005-11-02
KR101088350B1 (ko)	2011-11-30

Publication	Publication Date	Title
TW200704743A (en)	2007-02-01	Low stress conductive adhesive
EP0969065A3 (en)	2000-02-23	Die attach adhesives for use in microelectronic
WO2009044732A1 (ja)	2009-04-09	接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
AU2003295705A1 (en)	2004-06-18	B-stageable die attach adhesives
MY134364A (en)	2007-12-31	Adhesive tape
WO2008014466A3 (en)	2008-03-13	Dual cure adhesive formulations
AU2002246042A1 (en)	2002-07-30	Adhesive composition
BR0213751B1 (pt)	2012-09-04	composição adesiva curável.
ATE324409T1 (de)	2006-05-15	Härterzusammensetzung für epoxidharze
TW200641084A (en)	2006-12-01	Pressure-sensitive adhesive tape and pressure-sensitive adhesive composition
ATE380853T1 (de)	2007-12-15	Metallsalzmodifikatoren für haftmittel
AU2003244100A1 (en)	2004-01-06	Acrylic resin composition, organosiloxane resin composition and laminates made by using them
ATE396241T1 (de)	2008-06-15	2-k-montageklebstoff mit hoher anfangshaftung
DK1448741T3 (da)	2007-09-10	Fremgangsmåde til limning af træmaterialer
DE50305549D1 (de)	2006-12-14	Dentale Polymerfolie
TW200613501A (en)	2006-05-01	Method to improve high temperature cohesive strength with adhesive having multi-phase system
TW201129669A (en)	2011-09-01	Adhesive sheet and production method of electronic parts
WO2008096530A1 (ja)	2008-08-14	接着性樹脂組成物および接着方法
TW200708584A (en)	2007-03-01	Die attach adhesives with improved stress performance
AU2003301044A1 (en)	2004-07-29	Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
MY152852A (en)	2014-11-28	Liquid epoxy resin composition and adhesive using same
EP1675927B8 (en)	2010-05-19	Composition and method relating to a hot melt adhesive
DE50200628D1 (de)	2004-08-19	Haftvermittler für metall-polymer-verbunde
MY126671A (en)	2006-10-31	Curable compositions containing thiazole functionality
MY128523A (en)	2007-02-28	Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates