DK2584065T3 - Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved - Google Patents

Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved

Info

Publication number
DK2584065T3
DK2584065T3 DK13151235.2T DK13151235T DK2584065T3 DK 2584065 T3 DK2584065 T3 DK 2584065T3 DK 13151235 T DK13151235 T DK 13151235T DK 2584065 T3 DK2584065 T3 DK 2584065T3
Authority
DK
Denmark
Prior art keywords
plastic article
surface metallization
making
article made
making plastic
Prior art date
Application number
DK13151235.2T
Other languages
English (en)
Inventor
Qing Gong
Liang Zhou
Weifeng Miao
Xiong Zhang
Original Assignee
Byd Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44166750&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK2584065(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from CN2009102612162A external-priority patent/CN101747650B/zh
Priority claimed from CN2009102389579A external-priority patent/CN102071423B/zh
Application filed by Byd Co Ltd filed Critical Byd Co Ltd
Application granted granted Critical
Publication of DK2584065T3 publication Critical patent/DK2584065T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/76—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
    • B01J23/80—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36 with zinc, cadmium or mercury
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/349—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of flames, plasmas or lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/182—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/02—Impregnation, coating or precipitation
    • B01J37/0201—Impregnation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
DK13151235.2T 2009-12-17 2010-04-22 Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved DK2584065T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2009102612162A CN101747650B (zh) 2009-12-17 2009-12-17 塑料组合物及其应用以及塑料表面选择性金属化的方法
CN2009102389579A CN102071423B (zh) 2009-12-30 2009-12-30 一种塑料制品的制备方法及一种塑料制品
EP10827682.5A EP2379772B1 (en) 2009-12-17 2010-04-22 Surface metallizing method, method for preparing plastic article and plastic article made therefrom

Publications (1)

Publication Number Publication Date
DK2584065T3 true DK2584065T3 (da) 2014-07-14

Family

ID=44166750

Family Applications (2)

Application Number Title Priority Date Filing Date
DK13151235.2T DK2584065T3 (da) 2009-12-17 2010-04-22 Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved
DK13151236.0T DK2584066T3 (da) 2009-12-17 2010-04-22 Overflademetalliseringsmetode, metode til fremstilling af plastgenstande og plastgenstand fremstillet heraf

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK13151236.0T DK2584066T3 (da) 2009-12-17 2010-04-22 Overflademetalliseringsmetode, metode til fremstilling af plastgenstande og plastgenstand fremstillet heraf

Country Status (6)

Country Link
US (2) US20110281135A1 (da)
EP (4) EP2584065B1 (da)
JP (1) JP6082595B2 (da)
KR (7) KR101313151B1 (da)
DK (2) DK2584065T3 (da)
WO (1) WO2011072506A1 (da)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
EP2581469B1 (en) * 2011-10-10 2015-04-15 Enthone, Inc. Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates
CN103184440B (zh) * 2011-12-27 2015-12-02 比亚迪股份有限公司 一种表面选择性金属化的制品及其制备方法
WO2013113810A2 (en) * 2012-02-01 2013-08-08 Atotech Deutschland Gmbh Electroless nickel plating bath
JP5756444B2 (ja) * 2012-02-06 2015-07-29 富士フイルム株式会社 積層体およびその製造方法、並びに、下地層形成用組成物
CN103286908B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103287009B (zh) * 2012-02-24 2015-03-25 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
CN103286995B (zh) * 2012-02-24 2015-06-24 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
CN103286909B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103286996B (zh) 2012-02-24 2015-03-25 比亚迪股份有限公司 一种铝合金树脂复合体的制备方法及其制备的铝合金树脂复合体
CN103286910B (zh) 2012-02-24 2015-09-30 比亚迪股份有限公司 一种金属树脂一体化成型方法和一种金属树脂复合体
CN103297565B (zh) 2012-02-24 2015-07-22 比亚迪股份有限公司 一种手机壳体及其制备方法
WO2013178057A1 (en) 2012-05-28 2013-12-05 Shenzhen Byd Auto R&D Company Limited Metal composite and method of preparing the same, metal-resin composite and method of preparing the same
CN104583330B (zh) * 2012-09-14 2016-09-21 三菱工程塑料株式会社 热塑性树脂组合物、树脂成型品和带镀层的树脂成型品的制造方法
CN103773143B (zh) 2012-10-26 2017-02-22 比亚迪股份有限公司 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品
CN103866269A (zh) * 2012-12-11 2014-06-18 中国科学院微电子研究所 原子层沉积制备Te-N共掺的氧化锌薄膜的方法
CN104098138B (zh) * 2013-04-02 2016-04-13 比亚迪股份有限公司 金属化合物和聚合物制品及制备方法以及油墨组合物和表面选择性金属化方法
KR101610346B1 (ko) * 2013-04-26 2016-04-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR101574736B1 (ko) * 2013-04-26 2015-12-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
TW201445006A (zh) * 2013-05-23 2014-12-01 Byd Co Ltd 聚合物製品表面選擇性金屬化方法及其製備的聚合物製品
KR101493358B1 (ko) * 2013-07-16 2015-02-13 한국생산기술연구원 무전해 구리도금액을 이용한 구리 도금층 형성방법
EP2840165A1 (en) * 2013-08-19 2015-02-25 Total Marketing Services Method for depositing metal on a substrate, in particular for metallization of solar cells and modules
CN106519801B (zh) 2013-09-17 2019-10-11 比亚迪股份有限公司 油墨组合物以及表面选择性金属化方法
JP6469657B2 (ja) * 2013-09-26 2019-02-13 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基材表面を金属化するための新規の密着性促進体
EP2991080A4 (en) * 2013-09-27 2016-10-19 Lg Chemical Ltd COMPOSITION FOR FORMING A CONDUCTIVE STRUCTURE, METHOD FOR FORMING A CONDUCTIVE STRUCTURE THEREFOR AND RESIN STRUCTURE WITH CONDUCTIVE STRUCTURE
KR101633846B1 (ko) 2013-11-25 2016-06-27 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
KR101717753B1 (ko) 2013-11-29 2017-03-17 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR101631701B1 (ko) * 2013-12-30 2016-06-24 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
CN104746066B (zh) 2013-12-31 2017-07-04 比亚迪股份有限公司 一种金属与塑料的结合材料及其制备方法及制备的结合材料
EP3108033B1 (en) * 2014-01-27 2019-10-16 BYD Company Limited Method for metalizing polymer substrate
WO2015160209A1 (ko) 2014-04-16 2015-10-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
US9380700B2 (en) 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9631279B2 (en) 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces
KR101698159B1 (ko) * 2014-08-04 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
WO2016021898A1 (ko) * 2014-08-04 2016-02-11 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2016034000A1 (en) * 2014-09-04 2016-03-10 Byd Company Limited Polymer composition, ink composition and method for selectively metallizing insulating substrate
KR101737566B1 (ko) * 2014-09-11 2017-05-18 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2016043541A1 (ko) * 2014-09-17 2016-03-24 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
KR101698160B1 (ko) 2014-09-17 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
WO2016043540A1 (ko) * 2014-09-17 2016-03-24 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 가지는 수지 구조체
WO2016043542A1 (ko) * 2014-09-17 2016-03-24 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
KR101698524B1 (ko) 2014-09-17 2017-01-20 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
KR101722744B1 (ko) 2014-10-23 2017-04-03 주식회사 엘지화학 전자기파 조사에 의한 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
CN110167670B (zh) * 2016-12-27 2022-04-26 三井金属矿业株式会社 废气净化催化剂用铜铁矿型氧化物和使用该铜铁矿型氧化物的废气净化催化剂
WO2018123862A1 (ja) * 2016-12-27 2018-07-05 国立大学法人秋田大学 排気ガス浄化触媒
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
KR102104389B1 (ko) * 2017-09-22 2020-04-24 경북대학교 산학협력단 전기증착을 이용한 구리 델라포사이트 광전극의 제조방법 및 이에 따라 제조된 광전극을 이용한 수소의 제조방법
KR102096299B1 (ko) 2017-12-08 2020-04-03 한국생산기술연구원 광소결을 이용한 무전해 도금 방법
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
DE102018124344A1 (de) * 2018-10-02 2020-04-02 Chemische Fabrik Budenheim Kg Leitfähige Textilien
CN111500043B (zh) * 2020-04-13 2022-03-29 金发科技股份有限公司 一种聚碳酸酯合金材料及其制备方法和应用
KR102396093B1 (ko) 2020-08-13 2022-05-11 (주)바이오스마트 빛의 흡광부와 빛의 반사부에 의해 형성된 무늬모양을 포함한 플라스틱 판넬
PL437512A1 (pl) 2021-03-31 2022-10-03 Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki I Fotoniki Podłoże ceramiczne dla układów mikrofalowych i terahercowych oraz sposób wytwarzania tego podłoża
CN113818013A (zh) * 2021-09-23 2021-12-21 镇江锦兴表面工程技术有限公司 一种用于石英光纤的表面处理工艺
CN114892230B (zh) * 2022-05-25 2024-11-26 上海瑞尔实业有限公司 一种塑料表面电镀工艺

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3799802A (en) * 1966-06-28 1974-03-26 F Schneble Plated through hole printed circuit boards
US3804740A (en) * 1972-02-01 1974-04-16 Nora Int Co Electrodes having a delafossite surface
US3846460A (en) * 1973-04-25 1974-11-05 Cities Service Co Method of manufacturing copper oxalate
US3959523A (en) * 1973-12-14 1976-05-25 Macdermid Incorporated Additive printed circuit boards and method of manufacture
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
JPS5279772A (en) * 1975-12-26 1977-07-05 Mitsubishi Electric Corp Production of semiconductor device
US4087586A (en) * 1975-12-29 1978-05-02 Nathan Feldstein Electroless metal deposition and article
US4159414A (en) * 1978-04-25 1979-06-26 Massachusetts Institute Of Technology Method for forming electrically conductive paths
FR2544341A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants et articles obtenus
US4550140A (en) * 1984-03-20 1985-10-29 Union Carbide Corporation Circuit board substrates prepared from poly(aryl ethers)s
US5246817A (en) * 1985-08-02 1993-09-21 Shipley Company, Inc. Method for manufacture of multilayer circuit board
JPH02285076A (ja) * 1989-04-26 1990-11-22 Hitachi Chem Co Ltd 無電解めっき用半導体光触媒のパターン形成法
JPH02305969A (ja) * 1989-05-18 1990-12-19 Mitsubishi Electric Corp 無電解めつきの前処理方法
US5198096A (en) * 1990-11-28 1993-03-30 General Electric Company Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5153023A (en) * 1990-12-03 1992-10-06 Xerox Corporation Process for catalysis of electroless metal plating on plastic
US5281447A (en) * 1991-10-25 1994-01-25 International Business Machines Corporation Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes
CN1103649A (zh) * 1993-04-22 1995-06-14 苏马吕株式会社 通过照射激光束而改变颜色的树脂组合物
BE1008038A5 (fr) * 1994-01-31 1996-01-03 Lucien Diego Laude Procede de metallisation de matieres plastiques, et produits ainsi obtenus.
DE4417245A1 (de) * 1994-04-23 1995-10-26 Lpkf Cad Cam Systeme Gmbh Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
US5702584A (en) * 1996-07-01 1997-12-30 Ford Motor Company Enhanced plating adhesion through the use of metallized fillers in plastic substrate
DE19731346C2 (de) * 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
DE19852776A1 (de) * 1998-11-16 2000-05-18 Fraunhofer Ges Forschung Verfahren zur Metallisierung von Kunststoffen
US6277319B2 (en) * 1999-02-19 2001-08-21 Green Tokai Co., Ltd. Method for trimming shaped plastic workpieces
US6706785B1 (en) * 2000-02-18 2004-03-16 Rona/Emi Industries, Inc. Methods and compositions related to laser sensitive pigments for laser marking of plastics
JP2001271171A (ja) * 2000-03-27 2001-10-02 Daishin Kagaku Kk 無電解めっき処理法、および前処理剤
US6444489B1 (en) * 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
FR2822167B1 (fr) * 2001-03-15 2004-07-16 Nexans Procede de metallisation d'une piece substrat
DE10132092A1 (de) * 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
RU2192715C1 (ru) * 2001-07-13 2002-11-10 Институт физики им. Л.В.Киренского СО РАН Способ лазерной металлизации диэлектрической подложки
GB0212632D0 (en) * 2002-05-31 2002-07-10 Shipley Co Llc Laser-activated dielectric material and method for using the same in an electroless deposition process
US20060083939A1 (en) * 2004-10-20 2006-04-20 Dunbar Meredith L Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
JP2007027312A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp 配線基板の製造方法および配線基板
DE102006017630A1 (de) * 2006-04-12 2007-10-18 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer Leiterbahnstruktur sowie eine derart hergestellte Leiterbahnstruktur
GB2444037A (en) * 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
US8309640B2 (en) * 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
TWI388122B (zh) * 2009-04-20 2013-03-01 Unimicron Technology Corp 形成複合材料電路板結構的方法
TWI392425B (zh) * 2009-08-25 2013-04-01 欣興電子股份有限公司 內埋式線路板及其製造方法
US9435035B2 (en) * 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) * 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品

Also Published As

Publication number Publication date
KR20130064824A (ko) 2013-06-18
EP2379772B1 (en) 2015-07-29
KR20140129382A (ko) 2014-11-06
EP2584064A2 (en) 2013-04-24
EP2584064B1 (en) 2015-07-29
KR20140044408A (ko) 2014-04-14
KR101313151B1 (ko) 2013-09-30
EP2584065A3 (en) 2013-05-01
EP2584065B1 (en) 2014-04-16
EP2584064A3 (en) 2013-05-01
EP2379772A1 (en) 2011-10-26
EP2584065A2 (en) 2013-04-24
US20160068963A1 (en) 2016-03-10
JP2012524169A (ja) 2012-10-11
EP2584066A3 (en) 2013-05-01
KR101607045B1 (ko) 2016-03-28
JP6082595B2 (ja) 2017-02-15
EP2379772A4 (en) 2012-07-25
DK2584066T3 (da) 2014-07-14
KR20110112860A (ko) 2011-10-13
KR20140129381A (ko) 2014-11-06
KR20130064823A (ko) 2013-06-18
KR101615846B1 (ko) 2016-04-26
KR101623664B1 (ko) 2016-05-23
WO2011072506A1 (en) 2011-06-23
KR20130064822A (ko) 2013-06-18
US20110281135A1 (en) 2011-11-17
EP2584066B1 (en) 2014-04-16
EP2584066A2 (en) 2013-04-24

Similar Documents

Publication Publication Date Title
DK2584065T3 (da) Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved
DK2363513T3 (da) Metalliserede plastgenstande og fremgangsmåde til fremstilling af samme
BR112012001172A2 (pt) artigo, e, método
BRPI1006537A2 (pt) método e artigo
EP2469581A4 (en) SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
BRPI1011877A2 (pt) artigos e métodos de fabricação de artigos
DK3091034T3 (da) Anti-CD40-antistoffer og anvendelser deraf
BR112012002118A2 (pt) bocal e metodos de produção do mesmo
BR112012001906A2 (pt) artigo abrasivo e método de formação
BRPI0906305A2 (pt) artigo absorvente e método de produção do mesmo
BRPI1011879A2 (pt) artigos e processos de manufatura de artigos
EP2425238A4 (en) A CONTROLLABLE INTEGRATED CIRCUIT AND METHOD THEREFOR
BR112013001592A2 (pt) artigo e método
BRPI1008453A2 (pt) microestruturas de relevo de superfície, dispositivos relacionados e método de fazer as mesmas
DK2279501T3 (da) Fremgangsmåde og system til styring af produktionen af genstande
PT2371019T (pt) Acumulador de lítio e método de produção do mesmo
BRPI0906886A2 (pt) Composto polimérico de moldagem em fusão e método de produção e utilização do mesmo
BR112013010847A2 (pt) artigo e método
BRPI1014291A2 (pt) método, material lignocelulósico, e, artigo
DK2285544T3 (da) Fremgangsmåde til at støbe plastikgenstande
BRPI0925037A2 (pt) Composição contendo piceatanol e método de produzir a composição contendo piceatanol.
DK2532764T3 (da) Trådmateriale, stålwire, og fremgangsmåder til fremstilling af disse produkter
BR112013016641A2 (pt) artigo e método
DK2417037T3 (da) Beholder, enhed og fremgangsmåde til fremstilling deraf
EP2361762A4 (en) METHOD FOR THE PRODUCTION OF A LAMINATED BODY AND LAMINATED BODY