DK2910604T3 - Højdielektrisk film - Google Patents

Højdielektrisk film Download PDF

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Publication number
DK2910604T3
DK2910604T3 DK13848067.8T DK13848067T DK2910604T3 DK 2910604 T3 DK2910604 T3 DK 2910604T3 DK 13848067 T DK13848067 T DK 13848067T DK 2910604 T3 DK2910604 T3 DK 2910604T3
Authority
DK
Denmark
Prior art keywords
electrical film
film
electrical
Prior art date
Application number
DK13848067.8T
Other languages
English (en)
Inventor
Mayuko Tatemichi
Miharu Ota
Kouji Yokotani
Nobuyuki Komatsu
Hisako Nakamura
Fumiko SHIGENAI
Takeshi Hazama
Masakazu Kinoshita
Meiten Koh
Takuji Ishikawa
Takashi Iguchi
Kazunobu Uchida
Tomoyuki Fukatani
Takahiro Kitahara
Tetsuhiro Kodani
Original Assignee
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Ind Ltd filed Critical Daikin Ind Ltd
Application granted granted Critical
Publication of DK2910604T3 publication Critical patent/DK2910604T3/da

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
    • G02B26/005—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid based on electrowetting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G02B3/14—Fluid-filled or evacuated lenses of variable focal length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laminated Bodies (AREA)
DK13848067.8T 2012-10-16 2013-10-16 Højdielektrisk film DK2910604T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012228973 2012-10-16
JP2013007606 2013-01-18
PCT/JP2013/078073 WO2014061700A1 (ja) 2012-10-16 2013-10-16 高誘電性フィルム

Publications (1)

Publication Number Publication Date
DK2910604T3 true DK2910604T3 (da) 2022-05-16

Family

ID=50488261

Family Applications (1)

Application Number Title Priority Date Filing Date
DK13848067.8T DK2910604T3 (da) 2012-10-16 2013-10-16 Højdielektrisk film

Country Status (6)

Country Link
US (1) US20150368413A1 (da)
EP (1) EP2910604B1 (da)
JP (2) JP5516817B1 (da)
CN (1) CN104704046A (da)
DK (1) DK2910604T3 (da)
WO (1) WO2014061700A1 (da)

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US20150025608A1 (en) 2013-07-22 2015-01-22 Cardiac Pacemakers, Inc. Lubricious, biocompatible hydrophilic thermoset coating using interpenetrating hydrogel networks
JP6327334B2 (ja) * 2014-02-26 2018-05-23 ダイキン工業株式会社 バイモルフ型圧電フィルム
US10745531B2 (en) * 2015-07-17 2020-08-18 Daikin Industries, Ltd. Film
DE112016003327B4 (de) * 2015-07-23 2022-08-18 Sumitomo Bakelite Co., Ltd. Substrat für Leistungsmodul, Leiterplatte für Leistungsmodul und Leistungsmodul
CN107847737B (zh) * 2015-07-25 2021-03-02 心脏起搏器股份公司 具有生物稳定的pvdf基材料的医用电引线
WO2017126374A1 (ja) * 2016-01-18 2017-07-27 シャープ株式会社 電極基板およびその製造方法並びに電子機器
EP3428219A4 (en) * 2016-02-29 2020-02-19 Toppan Printing Co., Ltd. FLUORINE-BASED RESIN FILM, LAMINATE AND METHOD FOR PRODUCING A FLUORINE-BASED RESIN FILM
KR102041660B1 (ko) * 2016-08-12 2019-11-06 주식회사 엘지화학 햅틱 디스플레이 필름용 분산액, 햅틱 디스플레이 필름 및 이의 제조방법
EP3327067A1 (en) * 2016-11-23 2018-05-30 Fundación BCMaterials - Basque Center for Materials, Application and Nanostructures Method for manufacturing a film made of polyvinylidene fluoride and film made of polyvinylidene fluoride in beta phase
JP6760404B2 (ja) * 2017-01-31 2020-09-23 ダイキン工業株式会社 フッ素樹脂フィルム
CN111295413A (zh) * 2017-11-08 2020-06-16 大金工业株式会社 膜
JP7321145B2 (ja) * 2018-03-30 2023-08-04 ダイキン工業株式会社 成形体
KR102430668B1 (ko) * 2018-03-30 2022-08-09 고쿠리츠다이가쿠호진 히로시마다이가쿠 성형체
JP6899588B2 (ja) * 2018-11-20 2021-07-07 国立研究開発法人産業技術総合研究所 液体操作装置
CN109910403B (zh) * 2019-04-12 2021-01-29 中国电子科技集团公司第三十八研究所 一种微波复合介质板的制备方法及制得的微波复合介质板
EP4152091B1 (en) * 2020-05-29 2026-04-08 Huawei Technologies Co., Ltd. Liquid aperture, electronic device, and driving method and driving apparatus for liquid aperture
US20240067783A1 (en) * 2020-09-30 2024-02-29 Junkosha Inc. Fluororesin Film
CN116490548A (zh) * 2020-09-30 2023-07-25 株式会社润工社 一种氟树脂膜
KR102946083B1 (ko) * 2020-12-18 2026-04-01 삼성전기주식회사 적층형 전자 부품 및 그 제조방법
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KR20140026604A (ko) * 2011-06-15 2014-03-05 가부시끼가이샤 구레하 폴리불화비닐리덴 수지 필름, 다층 필름, 및 태양 전지 모듈용 백 시트, 및 필름의 제조 방법

Also Published As

Publication number Publication date
JP5804100B2 (ja) 2015-11-04
JP2014156599A (ja) 2014-08-28
EP2910604A1 (en) 2015-08-26
EP2910604B1 (en) 2022-04-13
JP2014156581A (ja) 2014-08-28
WO2014061700A1 (ja) 2014-04-24
US20150368413A1 (en) 2015-12-24
EP2910604A4 (en) 2016-06-15
CN104704046A (zh) 2015-06-10
JP5516817B1 (ja) 2014-06-11

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