DK364586D0 - Epoxyharpiksmateriale og dets anvendelse - Google Patents

Epoxyharpiksmateriale og dets anvendelse

Info

Publication number: DK364586D0
Authority: DK; Denmark
Prior art keywords: epoxy resin; bisphenol; preparation; acid; resin material
Prior art date: 1985-07-31

Application number

DK364586A

Other languages

English (en)

Other versions

DK364586A (da

Inventor

Diane Sexton

Original Assignee

Dow Chemical Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-07-31

Filing date

1986-07-31

Publication date

1986-07-31

1986-07-31 Application filed by Dow Chemical Co filed Critical Dow Chemical Co

1986-07-31 Publication of DK364586D0 publication Critical patent/DK364586D0/da

1987-02-01 Publication of DK364586A publication Critical patent/DK364586A/da

Links

239000003822 epoxy resin Substances 0.000 title abstract 4
229920000647 polyepoxide Polymers 0.000 title abstract 4
239000000463 material Substances 0.000 title 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 5
239000000203 mixture Substances 0.000 abstract 3
239000002253 acid Substances 0.000 abstract 2
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 2
229930185605 Bisphenol Natural products 0.000 abstract 1
125000000217 alkyl group Chemical group 0.000 abstract 1
150000008064 anhydrides Chemical class 0.000 abstract 1
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
150000002148 esters Chemical class 0.000 abstract 1
150000002460 imidazoles Chemical class 0.000 abstract 1
239000003960 organic solvent Substances 0.000 abstract 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
239000004848 polyfunctional curative Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
- C08G14/08—Ureas; Thioureas
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Epoxy Resins (AREA)
Laminated Bodies (AREA)
Reinforced Plastic Materials (AREA)
Compositions Of Macromolecular Compounds (AREA)
Materials For Medical Uses (AREA)
Macromonomer-Based Addition Polymer (AREA)
Organic Insulating Materials (AREA)
Insulating Bodies (AREA)
Graft Or Block Polymers (AREA)
Measurement Of Force In General (AREA)
Catalysts (AREA)

DK364586A 1985-07-31 1986-07-31 Epoxyharpiksmateriale og dets anvendelse DK364586A (da)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB858519290A GB8519290D0 (en)	1985-07-31	1985-07-31	Resin composition

Publications (2)

Publication Number	Publication Date
DK364586D0 true DK364586D0 (da)	1986-07-31
DK364586A DK364586A (da)	1987-02-01

Family

ID=10583118

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK364586A DK364586A (da)	1985-07-31	1986-07-31	Epoxyharpiksmateriale og dets anvendelse

Country Status (17)

Country	Link
US (2)	US4713137A (da)
EP (1)	EP0211382B1 (da)
JP (1)	JPH0772225B2 (da)
KR (1)	KR900001944B1 (da)
CN (1)	CN1017248B (da)
AT (1)	ATE106435T1 (da)
AU (1)	AU593826B2 (da)
BR (1)	BR8603615A (da)
CA (1)	CA1292824C (da)
DE (1)	DE3689869T2 (da)
DK (1)	DK364586A (da)
ES (1)	ES2001053A6 (da)
FI (1)	FI89807C (da)
GB (1)	GB8519290D0 (da)
IN (1)	IN167874B (da)
MY (1)	MY102533A (da)
NO (1)	NO171414C (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1257434A (en) *	1985-08-26	1989-07-11	Gary W. Bogan	Encapsulating compositions
ATE72450T1 (de) *	1986-12-15	1992-02-15	Siemens Nixdorf Inf Syst	Verfahren zur herstellung von prepregs und deren verwendung.
US4732962A (en) *	1987-02-18	1988-03-22	General Motors Corporation	High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4868059A (en) *	1987-11-16	1989-09-19	The Dow Chemical Company	Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
KR0136590B1 (en) *	1988-10-24	1998-04-25	Mitsubishi Rayon Co	Epoxy resin composition
US5179139A (en) *	1988-10-24	1993-01-12	Mitsubishi Rayon Co., Ltd.	Dihydroxybiphenyl-advanced epoxy resin blends
US5043184A (en) *	1989-02-06	1991-08-27	Somar Corporation	Method of forming electrically conducting layer
EP0384939B1 (de) *	1989-03-03	1994-06-22	Siemens Aktiengesellschaft	Epoxidharz-Formmassen
US5166289A (en) *	1990-12-19	1992-11-24	Exxon Chemical Patents Inc.	Thermoset coating composition having improved hardness
DE4110219A1 (de) *	1991-03-28	1992-10-01	Huels Troisdorf	Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
EP0507271A3 (en) *	1991-04-03	1993-04-21	The Dow Chemical Company	Epoxy resin compositions for use in electrical laminates
US5478607A (en) *	1991-05-17	1995-12-26	Hitachi Telecon Technologies Ltd.	Method for use of preflux, printed wiring board, and method for production thereof
US5364925A (en) *	1992-01-27	1994-11-15	The Dow Chemical Company	Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
AU4953496A (en) *	1995-03-14	1996-10-02	Nissan Chemical Industries Ltd.	Heat-resistant epoxy resin composition
US6207595B1 (en) *	1998-03-02	2001-03-27	International Business Machines Corporation	Laminate and method of manufacture thereof
JPH11279376A (ja) *	1998-03-27	1999-10-12	Hitachi Chem Co Ltd	印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
ATE277103T1 (de) *	2002-01-28	2004-10-15	Abb Research Ltd	Vergussmasse auf der basis duroplastischer epoxidharze
US7094843B2 (en) *	2002-08-19	2006-08-22	3M Innovative Properties Company	Epoxy compositions having improved shelf life and articles containing the same
US6855738B2 (en)	2003-06-06	2005-02-15	Dow Global Technologies Inc.	Nanoporous laminates
US7078816B2 (en) *	2004-03-31	2006-07-18	Endicott Interconnect Technologies, Inc.	Circuitized substrate
US7270845B2 (en) *	2004-03-31	2007-09-18	Endicott Interconnect Technologies, Inc.	Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) *	2004-03-31	2006-12-05	Endicott Interconnect Technologies, Inc.	Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US8530053B2 (en) *	2004-10-27	2013-09-10	Nagase Chemtex Corporation	Heat-resistant composite material
WO2008153542A1 (en) *	2007-06-15	2008-12-18	Dow Global Technologies, Inc.	Process for preparing composites using epoxy resin compositions
US8455573B2 (en) *	2010-12-20	2013-06-04	E I Du Pont De Nemours And Company	Curable composition comprising imidazolium monocarboxylate salt
CA2973167C (en)	2015-02-27	2023-09-05	Huntsman Advanced Materials Licensing (Switzerland) Gmbh	A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3314912A (en) *	1963-01-23	1967-04-18	Hooker Chemical Corp	Epoxy resin compositions containing triorgano phosphate diluents
CH506581A (de) *	1968-01-25	1971-04-30	Hoechst Ag	Verfahren zur Herstellung von Epoxidharzschaumstoffen
DE1770400A1 (de) *	1968-05-13	1972-04-06	Hoechst Ag	Verfahren zur Herstellung von Epoxidharzschaumstoffen
US3577370A (en) *	1968-08-05	1971-05-04	Armour Ind Chem Co	Modifier for phenolic resins
US3842037A (en) *	1972-06-08	1974-10-15	Shell Oil Co	Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4046733A (en) *	1975-12-30	1977-09-06	Westinghouse Electric Corporation	Sulfonic acid composition for forming thermoparticulating coating
GB2038348A (en) *	1978-12-12	1980-07-23	Desai Polymer Dev	Phenolic materials
US4331582A (en) *	1980-01-14	1982-05-25	Hitco	Epoxy latent catalyst
US4366295A (en) *	1981-06-01	1982-12-28	The Dow Chemical Company	Stable precatalyzed epoxy resin compositions
US4433014A (en) *	1982-06-21	1984-02-21	Desoto, Inc.	Pigmented, corrosion resistant, thermosetting coating compositions
US4393181A (en) *	1982-06-30	1983-07-12	Shell Oil Company	Polyfunctional phenolic-melamine epoxy resin curing agents
US4438254A (en) *	1983-02-28	1984-03-20	The Dow Chemical Company	Process for producing epoxy resins
CA1240028A (en) *	1983-10-25	1988-08-02	Harvey A. Dillon	Hearing aid amplification method and apparatus
CA1276358C (en) *	1984-01-31	1990-11-13	Dieter H. Klein	Epoxy resin for preparing electric laminates
US4528359A (en) *	1984-05-16	1985-07-09	The Dow Chemical Company	Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
US4668718A (en) *	1984-10-05	1987-05-26	Ciba-Geigy Corporation	Self-extinguishing, track-resistant epoxy resin moulding composition and use thereof
US4604317A (en) *	1984-10-05	1986-08-05	The Dow Chemical Company	Curable compositions containing a polyepoxide and a halogenated bisphenol

1985
- 1985-07-31 GB GB858519290A patent/GB8519290D0/en active Pending
1986
- 1986-07-29 AT AT86110466T patent/ATE106435T1/de not_active IP Right Cessation
- 1986-07-29 EP EP86110466A patent/EP0211382B1/en not_active Expired - Lifetime
- 1986-07-29 DE DE3689869T patent/DE3689869T2/de not_active Expired - Fee Related
- 1986-07-30 ES ES8600735A patent/ES2001053A6/es not_active Expired
- 1986-07-30 NO NO863074A patent/NO171414C/no unknown
- 1986-07-30 CA CA000514920A patent/CA1292824C/en not_active Expired - Fee Related
- 1986-07-30 BR BR8603615A patent/BR8603615A/pt unknown
- 1986-07-30 JP JP61177895A patent/JPH0772225B2/ja not_active Expired - Lifetime
- 1986-07-30 IN IN610/MAS/86A patent/IN167874B/en unknown
- 1986-07-30 KR KR1019860006241A patent/KR900001944B1/ko not_active Expired
- 1986-07-30 US US06/892,022 patent/US4713137A/en not_active Expired - Fee Related
- 1986-07-31 AU AU60748/86A patent/AU593826B2/en not_active Ceased
- 1986-07-31 CN CN86105670A patent/CN1017248B/zh not_active Expired
- 1986-07-31 DK DK364586A patent/DK364586A/da not_active Application Discontinuation
- 1986-07-31 FI FI863136A patent/FI89807C/fi not_active IP Right Cessation
1987
- 1987-09-03 MY MYPI87001533A patent/MY102533A/en unknown
1989
- 1989-08-24 US US07/398,337 patent/US4959400A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DK364586A (da)	1987-02-01
AU593826B2 (en)	1990-02-22
EP0211382A3 (en)	1988-08-24
FI89807C (fi)	1993-11-25
US4713137A (en)	1987-12-15
CN1017248B (zh)	1992-07-01
ES2001053A6 (es)	1988-04-16
EP0211382B1 (en)	1994-06-01
CA1292824C (en)	1991-12-03
FI863136L (fi)	1987-02-01
FI89807B (fi)	1993-08-13
DE3689869T2 (de)	1994-11-17
KR870001245A (ko)	1987-03-12
MY102533A (en)	1992-07-31
ATE106435T1 (de)	1994-06-15
AU6074886A (en)	1987-02-05
KR900001944B1 (ko)	1990-03-26
DE3689869D1 (de)	1994-07-07
IN167874B (da)	1991-01-05
JPS6270415A (ja)	1987-03-31
FI863136A0 (fi)	1986-07-31
EP0211382A2 (en)	1987-02-25
CN86105670A (zh)	1987-03-25
JPH0772225B2 (ja)	1995-08-02
BR8603615A (pt)	1987-03-10
GB8519290D0 (en)	1985-09-04
NO171414B (no)	1992-11-30
NO863074L (no)	1987-02-02
US4959400A (en)	1990-09-25
NO171414C (no)	1993-03-10
NO863074D0 (no)	1986-07-30

Legal Events

Date	Code	Title	Description
1996-03-25	AHB	Application shelved due to non-payment

Publication	Publication Date	Title
DK364586A (da)	1987-02-01	Epoxyharpiksmateriale og dets anvendelse
GB1291187A (en)	1972-10-04	Epoxide resin mixtures
KR860001167A (ko)	1986-02-24	무용제 폴리이미드-변태 에폭시 조성물
ES8608020A1 (es)	1986-04-16	Procedimiento de fabricar estratificados para usos electri- cos
NO150362C (no)	1984-10-03	Herdbare blandinger bestaaende av en polyepoksyforbindelse med gjennomsnittlig mer enn en epoksygruppe i molekylet og en herder, samt eventuelt vanlige modifiseringsmidler
GB1009806A (en)	1965-11-10	Improvements in or relating to curing agents for epoxy resins
GB2087875B (en)	1985-01-30	Curing agents
DE3563749D1 (en)	1988-08-18	Heat-curable epoxy resin compositions
JPS55108443A (en)	1980-08-20	Theromsetting resin composition
DE3171987D1 (en)	1985-10-03	Rapidly curing epoxide compositions
JPS5440831A (en)	1979-03-31	Resin composition for matte powder coating
SE9100543D0 (sv)	1991-02-25	Rheological additive for coating compositions
JPS57190018A (en)	1982-11-22	Epoxy resin composition
GB1033697A (en)	1966-06-22	Curing process for epoxy resins
JPS5647433A (en)	1981-04-30	Thermosetting resin composition
JPS5638318A (en)	1981-04-13	Heat-resistant resin composition
JPS5531805A (en)	1980-03-06	Epoxy resin composition
JPS56143214A (en)	1981-11-07	Epoxy resin composition
JPS54129097A (en)	1979-10-06	Resin composition
GB1252965A (da)	1971-11-10
JPS55129411A (en)	1980-10-07	Preparation of plasticized modified phenolic resin
GB1203884A (en)	1970-09-03	Latent curing agent
JPS57209283A (en)	1982-12-22	Preparation of decarboxylative condensation product of alicyclic 1,2-dicarboxylic acid or its anhydride
GB1293444A (en)	1972-10-18	Mixture of n-diglycidyl compounds