EP0023357B1 - Plaque de commande pour un dispositif d'affichage à décharge dans un gaz et procédé de fabrication d'une telle plaque de commande - Google Patents

Plaque de commande pour un dispositif d'affichage à décharge dans un gaz et procédé de fabrication d'une telle plaque de commande Download PDF

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Publication number
EP0023357B1
EP0023357B1 EP80104435A EP80104435A EP0023357B1 EP 0023357 B1 EP0023357 B1 EP 0023357B1 EP 80104435 A EP80104435 A EP 80104435A EP 80104435 A EP80104435 A EP 80104435A EP 0023357 B1 EP0023357 B1 EP 0023357B1
Authority
EP
European Patent Office
Prior art keywords
carrier plate
control
plate
holes
conductor paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP80104435A
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German (de)
English (en)
Other versions
EP0023357A1 (fr
Inventor
Manfred Dr.Phil. Kobale
Burkhard Littwin
Rolf Dr. Rer. Nat. Wengert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT80104435T priority Critical patent/ATE6712T1/de
Publication of EP0023357A1 publication Critical patent/EP0023357A1/fr
Application granted granted Critical
Publication of EP0023357B1 publication Critical patent/EP0023357B1/fr
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • H01J17/498—Display panels, e.g. with crossed electrodes, e.g. making use of direct current with a gas discharge space and a post acceleration space for electrons

Definitions

  • the invention relates to a control plate for a gas discharge display device with a carrier plate made of electrically insulating material, which carries on one side as a row conductor and on the other side as a column conductor forming a matrix and each separately controllable metallic conductor tracks and together with these tracks in the intersection points of the matrix has continuous control holes, each of the holes forming a row being electrically connected to one another and the column conductors being very high-resistance or completely separated from the row conductors.
  • Such a control plate is used in a gas discharge display device for matrix control of the individual pixels.
  • the control hole is released at the respective intersection of row conductor and column conductor.
  • electrons are drawn from the plasma of the gas discharge space located behind the control plate into the acceleration space located in front of the control plate and accelerated towards the anode in this space.
  • a light spot is then formed on a phosphor layer located in front of the anode as an image of the controlled crossing point of the matrix.
  • Such a display device works on the principle of spatial separation of electron generation and electron acceleration (two-chamber principle) and is known, for example, from DE-OS 2 412 869 and DE-OS 2 615 721.
  • control plate The structure of a control plate is also described in these published documents. It consists of a carrier plate made of electrically insulating material, for example made of glass, with the conductor tracks (control electrode tracks) on both sides of the plate.
  • the matrix control plates are currently manufactured in such a way that the hole structures necessary for the passage of electrons are only etched into the glass after the conductor structures have been applied (on the front and back of the plate perpendicular to one another). For etching reasons, very thin glass plates must be assumed for very fine grid structures.
  • the present invention has for its object to avoid these disadvantages and to provide a control plate with good mechanical stability and electrically separated row and column conductors of high geometric resolution. To achieve this object, it is proposed according to the invention in a control plate of the type mentioned at the outset that the metallic conductor tracks extend into the control holes of the carrier plate in a defined manner.
  • the carrier plate is preferably made of glass or ceramic and has thicknesses between 0.3 and 2 mm.
  • a further improvement in the control properties is achieved in that the metallic conductor tracks of the column conductors fill almost the entire hole area of the associated control holes and that the metallic conductor tracks of the row conductors extend only slightly into the control holes assigned to them.
  • a line grid over masks is exposed on both sides of the plate, perpendicular to each other.
  • the line structure is either chosen exactly in the grid step to match the existing hole pattern and exposed so that during development each path runs across a row of holes and is completely free of photoresist, or a line pattern is used that is considerably finer than the line pattern. or column grid of the perforated surface. Diffuse light always gets into the holes during exposure and any positive photoresist located there is then also removed. However, this method remains - if there is varnish in the holes - limited to the use of positive working photoresist. When using photoresist foils, this limitation to "positive" is not necessary.
  • the use of the fine line pattern considerably reduces the adjustment effort required between the hole pattern and the conductor pattern.
  • the dimensioning of the conductor track grid ensures that neither two rows of holes are connected nor one row of holes remains without continuous contact. This applies equally to the front and back of the carrier plate.
  • the metallic surfaces freed from the development of photoresist on both sides e.g. B. galvanically reinforced with Cu and / or nickel, up to a thickness of some 11 m. The reinforcement also extends - in a weakened thickness - into the holes.
  • Conductor tracks are created which are still connected to each other by the thin metal layer covered with photoresist.
  • conductor tracks remain on both sides, which are electrically separated from one another and are in each case contacted through via the control holes.
  • the conductor tracks extending beyond the perforated surface of the carrier plate can be electrically contacted and controlled - front and rear of the plate separately.
  • the control plate according to the invention has the essential advantage that the subsequent introduction of control openings in thick, metallized plates made of electrically insulating material, for. B. is avoided by electron beam or laser drilling.
  • the metallization in the holes prevents charging effects in the holes and thus achieves a sufficient control effect.
  • the passage of charge carriers through the control holes is no longer restricted due to the elimination of the charge on the hole walls.
  • the control plate shown in Fig. 1 consists of a carrier plate 4 made of electrically insulating material, preferably of photo-shaped glass.
  • a carrier plate 4 made of electrically insulating material, preferably of photo-shaped glass.
  • the metallic conductor tracks 1, 2 extend into the control holes 3 of the carrier plate 4 so far that the respective rows of holes are electrically connected to one another and the column conductors 1 and the row conductors 2 are very high-resistance (R ⁇ 100 M ⁇ ) or are completely separated from one another.
  • the metallic conductor tracks 1, 2 of the column conductors 1 fill almost the entire hole area of the associated control holes 3, while the row conductors 2 extend only slightly into the control holes 3 assigned to them in the carrier plate 4. With this embodiment, even better control properties are achieved.
  • Fig. 3 shows an arrangement for the vapor deposition on both sides of a 1 mm thick carrier plate 4 (80 mm x 80 mm), each with an adhesive layer (20 nm A1 2 0 3 ) and a metal layer (300 nm Cu) at 170 ° C substrate temperature.
  • the maximum angle ⁇ of the vaporization beam 6 incident on the substrate is selected such that the distance 5 of the Cu layers vaporized into the holes 3 from both sides - one after the other or with two sources - is a minimum (place of greatest approximation) 0.1 mm .
  • the diameter of the circular holes 3 is 0.4 mm.
  • the substrate axis of rotation provided with the reference numeral 7 is perpendicular to the vapor-coated surface of the carrier plate 4. The distance of the evaporator source from the substrate is more than five times the substrate diameter; the deviation of ⁇ across the substrate area is therefore less than 9%.
  • a mask with a line pattern at 50 ⁇ m spacing serves as an exposure mask for both sides - offset by 90 °.
  • the adjustment on both sides of the line grid takes place optically through the holes 3 or the edges of the photo-shaped glass.
  • the exposed webs and the lacquer in the diffusely exposed holes 3 are removed in the developer bath.
  • the bare copper areas are galvanically reinforced with 3 ⁇ m copper and 1 I lm nickel as corrosion protection for the copper.
  • the positive varnish is then removed by exposing the entire area to both sides and developer bath.
  • the conductor separation is done by etching the exposed copper surfaces z. B. with FeC1 3 solution.
  • a final cleaning is carried out with ultrasound in acetone and / or in aqueous acidic and basic solutions as well as water baths.
  • negative or positive resist films can also be used.
  • Fig. 4 shows a control plate manufactured according to a modified method.
  • a copper metallization is applied to the ceramic support plate 4, which sits on the surface of both sides and continuously in the holes 3.
  • As a method for. B. vapor deposition at large angles x (see Fig. 3) and currentless deposition processes.
  • the layer thickness on the surfaces of both sides is approximately 300 nm.
  • the structure is generated in the manner described in connection with FIG. 3 with a line mask.
  • the exposure times are chosen so short that the plugs 8 are not exposed to light and after double-sided exposure and development of the carrier plate 4, the wall height occupied by the plug edges is at least 100 ⁇ m, while the perforated walls are freed of photoresist from both sides up to the plugs .
  • the conductor tracks are built up by galvanic amplification according to the exemplary embodiment according to FIG. 3. Subsequently, exposure is carried out very intensively on both sides and the remaining photoresist is developed from the conductor tracks and the plugs 8 from the holes 3.
  • both the conductor tracks are separated from one another and the non-reinforced metal rings in the holes 3, which have been freed from the plugs 8, are etched away, as a result of which the metallizations on the two sides are separated from one another.
  • the final cleaning takes place as in the exemplary embodiment described in FIG.
  • a support plate 4 provided with a metallization 11 on both sides through the holes 3 is sprayed with positive-working photoresist 10 from one side (column side) and then sprayed with negative photoresist 12 on the other side.
  • the layer thicknesses are 5 ⁇ m each.
  • the grid and dimensions of the carrier plate 4 correspond to the exemplary embodiment according to FIG. 3.
  • Two exposure masks are used. In the first exposure, the column side is exposed so that the individual rows of holes - and the interconnects connecting them - are exposed and at the same time the negative lacquer sprayed into the holes 3 from the row side is crosslinked at the opposite end of the holes 3. The line side is then exposed with the mask, so that the conductor tracks running in each case over the rows of holes and around the holes 3 are not exposed.
  • photoresist is only available as spacing lines for the conductor tracks and in holes 3, only negative paint rings remain at the "line end" of holes 3.
  • the exposed copper tracks via the holes 3 and the metallizations of the holes 3 connected with the column lines are galvanically reinforced.
  • the invention is not restricted to the exemplary embodiments shown.
  • photosensitive metal pastes which, for. B. can be applied over the entire area by screen printing.
  • the negative pressure applied it is possible to let the layer protrude more or less deeply into the holes.
  • the exposure, peeling and annealing processes can then be carried out in the usual way.

Landscapes

  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Physical Vapour Deposition (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Claims (4)

1. Plaque de commande pour un dispositif d'affichage à décharge dans un gaz, comportant une plaquesupport en matériau isolant du point de vue électrique qui porte d'un de ses côtés, en tant que conducteurs de ligne, et de son autre côté, en tant que conducteurs de colonne, des voies conductrices métalliques qui forment une matrice et peuvent respectivement être commandés séparément, et comporte, en association avec ces voies, des trous de commande tra- versans aux points de croisement de la matrice, les trous formant respectivement une rangée étant reliés les uns aux autres du point de vue électrique, et les conducteurs de colonne (1) étant isolés par une très forte résistance ohmique ou complètement des conducteurs de ligne (2), caractérisée par le fait que les voies conductrices métalliques (1,2) pénètrent de façon définie dans les trous de commande (3) de la plaque- support (4).
2. Plaque de commande suivant la revendication 1, caractérisée par le fait que les voies conductrices métalliques des conducteurs de colonne (1) remplissent presque toute la région de perçage des trous de commande associés (3), et que les voies conductrices métalliques des conducteurs de ligne (2) ne pénètrent que légèrement dans les trous de commande (3) qui leur sont associés.
3. Plaque de commande suivant la revendication 1 ou 2, caractérisée par le fait que la plaque- support (4) est constituée par du verre ou de la céramique et présente des épaisseurs comprises entre 0,3 et 2 mm.
4. Procédé pour fabriquer une plaque de commande suivant l'une des revendications 1 à 3, caractérisée par le fait que la plaque-support (4) munie de trous de commande (3) est métallisée des deux côtés sur toute sa surface, que les surfaces métalliques sont recouvertes d'une laque photosensible, que pour produire la structure des voies conductrices (1, 2), un réseau de droites est respectivement soumis à une exposition, par l'intermédiaire de masques, des deux côtés de la plaque-support (4), perpendiculaires l'un par rapport à l'autre, que les surfaces métalliques des deux côtés de la plaque-support (4) libérées de la laque photosensible lors du développement sont renforcées galvaniquement avec du cuivre et/ou du nickel jusqu'à une épaisseu: de quelques µ, et qu'enfin la laque photosensible restante est éliminée, et la couche métallique mince restante est éliminée par attaque chimique, de sorte que sur les deux côtés de la plaque-support (4) se trouvent les voies conductrices qui sont isolées électriquement les unes des autres et pénètrent au moins partiellement dans les trous de commande (3).
EP80104435A 1979-07-31 1980-07-28 Plaque de commande pour un dispositif d'affichage à décharge dans un gaz et procédé de fabrication d'une telle plaque de commande Expired EP0023357B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT80104435T ATE6712T1 (de) 1979-07-31 1980-07-28 Steuerplatte fuer eine gas entladungsanzeigevorrichtung und verfahren zum herstellen einer solchen steuerplatte.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2931077 1979-07-31
DE19792931077 DE2931077A1 (de) 1979-07-31 1979-07-31 Steuerplatte fuer eine gasentladungsanzeigevorrichtung

Publications (2)

Publication Number Publication Date
EP0023357A1 EP0023357A1 (fr) 1981-02-04
EP0023357B1 true EP0023357B1 (fr) 1984-03-14

Family

ID=6077274

Family Applications (1)

Application Number Title Priority Date Filing Date
EP80104435A Expired EP0023357B1 (fr) 1979-07-31 1980-07-28 Plaque de commande pour un dispositif d'affichage à décharge dans un gaz et procédé de fabrication d'une telle plaque de commande

Country Status (5)

Country Link
US (1) US4340838A (fr)
EP (1) EP0023357B1 (fr)
JP (1) JPS5624744A (fr)
AT (1) ATE6712T1 (fr)
DE (1) DE2931077A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3202447A1 (de) * 1982-01-26 1983-07-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zur galvanischen und aetztechnischen strukturierung von scheiben mit isolierenden ringzonen im muendungsbereich von bohrungen
DE3341397A1 (de) * 1983-11-15 1985-05-23 Siemens Ag Verfahren zur herstellung einer anzeigevorrichtung und danach hergestellte anzeigevorrichtung
DE3429082A1 (de) * 1984-08-07 1986-02-27 Siemens AG, 1000 Berlin und 8000 München Steuerscheibe fuer gasentladungsanzeige
DE3535185A1 (de) * 1985-10-02 1987-04-09 Siemens Ag Lochplatten zur elektronensteuerung, insbesondere fuer plasma-kathoden-display
DE3911346A1 (de) * 1989-04-07 1990-10-11 Nokia Unterhaltungselektronik Steuersystem fuer flache bildwiedergabevorrichtungen
CN1026943C (zh) * 1990-03-06 1994-12-07 杭州大学 平板彩色显示器
US5859508A (en) * 1991-02-25 1999-01-12 Pixtech, Inc. Electronic fluorescent display system with simplified multiple electrode structure and its processing
JP2670929B2 (ja) * 1991-12-06 1997-10-29 株式会社ノリタケカンパニーリミテド カラープラズマディスプレイパネル
US5438236A (en) * 1994-08-03 1995-08-01 Alliedsignal Inc. Gas discharge display having printed circuit board members and method of making same
EP0784860A4 (fr) * 1994-09-15 1998-11-18 Panocorp Display Systems Inc Systeme de visualisation fluorescent electronique a structure d'electrodes multiples simplifiee et procede de fabrication
JP2001523375A (ja) 1995-10-26 2001-11-20 ピックステック インコーポレイテッド 冷陰極電界放出極フラットスクリーンディスプレイ
KR100749614B1 (ko) * 2005-09-07 2007-08-14 삼성에스디아이 주식회사 마이크로 디스차아지형 플라즈마 표시 장치
KR100696815B1 (ko) * 2005-09-07 2007-03-19 삼성에스디아이 주식회사 마이크로 디스차아지형 플라즈마 표시 장치
KR101113853B1 (ko) * 2006-02-27 2012-02-29 삼성테크윈 주식회사 플라즈마 디스플레이 패널과, 디스플레이 패널용 전극 매립유전체 벽 제조 방법과, 상기 플라즈마 디스플레이 패널용전극 매립 유전체 벽 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS491064B1 (fr) * 1970-02-05 1974-01-11
US3634714A (en) * 1970-02-16 1972-01-11 G T Schijeldahl Co Electroluminescent display device with apertured electrodes
US3619700A (en) * 1970-07-08 1971-11-09 Burroughs Corp Gas cell display panel utilizing corrugated electrodes
DE2412869C3 (de) * 1974-03-18 1980-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anzeigevorrichtung mit einem Gasentladungsraum als Elektronenquelle, mit einem Elektronennachbeschleunigungsraum und mit einem Leuchtschirm und Verfahren zum Betrieb dieser Anzeigevorrichtung
JPH0127432B2 (fr) * 1975-01-24 1989-05-29 Hitachi Ltd
US3979635A (en) 1975-02-05 1976-09-07 Texas Instruments Incorporated Charged particle beam scanning device
DE2508393C2 (de) * 1975-02-26 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Gasentladungsanzeigevorrichtung und Verfahren zu ihrem Betrieb
DE2615721C2 (de) * 1976-04-09 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Anzeigevorrichtung mit einem Gasentladungsraum als Quelle für Elektronen und einem Nachbeschleunigungsraum zur Nachbeschleunigung dieser Elektronen
JPS5853462B2 (ja) 1976-09-20 1983-11-29 松下電器産業株式会社 画像表示装置
NL7711772A (nl) * 1977-10-27 1979-05-02 Philips Nv Kleurenbeeldbuis en werkwijze voor de vervaar- diging van een dergelijke kleurenbeeldbuis.

Also Published As

Publication number Publication date
DE2931077A1 (de) 1981-02-05
EP0023357A1 (fr) 1981-02-04
ATE6712T1 (de) 1984-03-15
JPS5624744A (en) 1981-03-09
US4340838A (en) 1982-07-20

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