EP0142765A2 - Méthode pour la fabrication d'un dispositif d'affichage et dispositif d'affichage fabriqué selon cette méthode - Google Patents

Méthode pour la fabrication d'un dispositif d'affichage et dispositif d'affichage fabriqué selon cette méthode Download PDF

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Publication number
EP0142765A2
EP0142765A2 EP84113299A EP84113299A EP0142765A2 EP 0142765 A2 EP0142765 A2 EP 0142765A2 EP 84113299 A EP84113299 A EP 84113299A EP 84113299 A EP84113299 A EP 84113299A EP 0142765 A2 EP0142765 A2 EP 0142765A2
Authority
EP
European Patent Office
Prior art keywords
mask
area
layer
plates
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84113299A
Other languages
German (de)
English (en)
Other versions
EP0142765A3 (fr
Inventor
Manfred Dr. Kobale
Günter Dipl.-Ing. Trausch
Rolf Dr. Wengert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0142765A2 publication Critical patent/EP0142765A2/fr
Publication of EP0142765A3 publication Critical patent/EP0142765A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • H01J17/498—Display panels, e.g. with crossed electrodes, e.g. making use of direct current with a gas discharge space and a post acceleration space for electrons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display

Definitions

  • the invention relates to a manufacturing method according to the preamble of claim 1.
  • Such a manufacturing technology can be found in DE-OS 29 31 077.
  • the cited laid-open specification describes a flat screen in which a gas discharge supplies electrons which are drawn through selected holes in a control matrix into a plasma-free space, where they absorb energies of a few kV and finally hit a luminescent screen.
  • the control metric is formed by individually controllable row and column conductors, which are located on both sides of an insulator pole plate and are preferably produced as follows: First, the plate is vapor-coated with an adhesion-promoting, 20 nm thick aluminum oxide layer and then with a 300 nm thick copper conductive layer. This metallization then receives a photoresist mask that only leaves the desired electrode pattern exposed. The bare copper areas are galvanically reinforced, first with 3um copper to improve the conductivity and then with 1um nickel as corrosion and sputter protection. Then remove the varnish and etch away the exposed titanium / copper surfaces.
  • the invention has for its object to modify a method of the type mentioned so that a perfect glass solder seal is achieved in a relatively simple manner without annoying heat stresses. This problem is solved by a production technology with the features of claim 1.
  • the proposed solution is based on the observation that the shortcomings described can also be attributed to the fact that the final layer is under-etched during (wet-chemical) removal of the layers underneath and thus spaces are created which cannot be completely filled by the printed glass solder paste. If, as provided in accordance with the invention, the conductors remain unreinforced in the glass soldering zone, all causes of leakage and crack formation are eliminated.
  • the unreinforced electrode sections also have a very exact structure, because they are produced photolithographically - with a photoresist as an etching reserve. It means that every conductor also has a defined resistance in its critical implementation section.
  • This series resistance is not particularly high - the vacuum-applied, ie vapor-deposited or sputtered-on layers contribute to the conductivity of the electrode relatively more than the less dense and more contaminated galvanic layers - and does not significantly burden the control circuit. If necessary, the feedthrough resistance could also be reduced further without additional effort, for example by broadening the adhesive and conductive layer in its unreinforced section.
  • the galvanic amplification should only be interrupted for a short distance within the frame - about a third of the frame width.
  • Such a geometry is sufficient for break-free sealing soldering and also ensures that the oxidation-sensitive electrode parts are covered by the frame and thus the already low series resistances cannot deteriorate in an uncontrolled manner.
  • a vapor-deposited adhesive layer between 20nm and 40nm thick and preferably made of Ti
  • a vapor-deposited Cu conductive layer with a thickness between 400nm and 900nm
  • an electroplated Cu layer between 1um and 2um thick
  • a Ni final layer between 3um and 5 ⁇ m as well as soft glass plates with a thermal expansion coefficient between 80 x 10 -7 ° k -1 and 100 x 10 -7o K -1 can be used.
  • a vacuum envelope with a trough-like back part 1 and a front plate 2.
  • the interior of the envelope is divided into a rear gas discharge space 5 and a front post-acceleration space 6 by a control structure consisting of a control disk 3 and a support plate 4.
  • the distance between the carrier plate and the front plate is defined by a spacer frame 7.
  • the trough-like back part 1 is provided with a series of strip-shaped, mutually parallel cathodes 8, which are each guided through the trough bottom.
  • the control disk 3 carries on the back cathode-parallel row conductors 9 and at the front column conductors 10. These conductors form a control matrix with individually controllable elements in which the matrix conductors and the plate are broken (openings 11).
  • the carrier plate 4 is coated on its rear side with strip conductors 12 parallel to the line conductors and on its front side with a continuous electrode 13. This electrode plate is also perforated (channels 14) in a pattern that is congruent with the hole pattern on the control disk.
  • the front plate 2 is coated on the back with a full-area post-acceleration anode 15 and phosphor points 16, which are each located in front of one of the channels 15. All plates and the back are over glass solder frame 17 hermetically sealed together.
  • the carrier plate which consists of a 0.7 mm thick, photo-etchable glass, is processed using a modified process. The main difference is that the plate first gets its openings and is coated in it. How to proceed most rationally is described in DE-OS 31 18335.
  • solder paste When all plates are finished, they are printed with a glass solder paste at the designated places.
  • the solder mass covers all unreinforced conductor sections and is designed so that the final glass Solder a width of 9mm. Then dry the solder, put the cell parts together in the correct position and carry out the soldering at around 425 ° C.
  • the invention is not limited to the illustrated embodiment. So it does not matter how the electrons are generated; accordingly, the longitudinal plasma could also be replaced by a transverse discharge or a hot cathode.
  • Other (active and passive) display types can also be considered, provided that Ni-reinforced MB electrodes and a glass soldering technique make sense.
  • the electrodes could also be patterned differently than in a line matrix, form more or less levels and / or be differently designed under their final layer. For example, adhesive layers made of Cr or glass, conductive layers made of Ag and exclusively galvanic coatings made of Ni are possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
EP84113299A 1983-11-15 1984-11-05 Méthode pour la fabrication d'un dispositif d'affichage et dispositif d'affichage fabriqué selon cette méthode Withdrawn EP0142765A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3341397 1983-11-15
DE19833341397 DE3341397A1 (de) 1983-11-15 1983-11-15 Verfahren zur herstellung einer anzeigevorrichtung und danach hergestellte anzeigevorrichtung

Publications (2)

Publication Number Publication Date
EP0142765A2 true EP0142765A2 (fr) 1985-05-29
EP0142765A3 EP0142765A3 (fr) 1986-02-12

Family

ID=6214442

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84113299A Withdrawn EP0142765A3 (fr) 1983-11-15 1984-11-05 Méthode pour la fabrication d'un dispositif d'affichage et dispositif d'affichage fabriqué selon cette méthode

Country Status (4)

Country Link
US (1) US4613399A (fr)
EP (1) EP0142765A3 (fr)
JP (1) JPS60119056A (fr)
DE (1) DE3341397A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0199077A1 (fr) * 1985-03-25 1986-10-29 Siemens Aktiengesellschaft Procédé de fabrication d'une plaque de commande pour installation dans un dispositif indicateur imperméable aux gaz
DE3535185A1 (de) * 1985-10-02 1987-04-09 Siemens Ag Lochplatten zur elektronensteuerung, insbesondere fuer plasma-kathoden-display
DE3710190A1 (de) * 1987-03-27 1988-10-13 Licentia Gmbh Verfahren zum aufbringen eines loetfaehigen leiterbahnenmusters
DE3710189C2 (de) * 1987-03-27 1995-08-31 Licentia Gmbh Verfahren zum Aufbringen einer lötfähigen Leitschicht und deren Verwendung zum Herstellen einer Lötverbindung zwischen dieser Leitschicht und einem metallischen Leiterbändchen
US5238435A (en) * 1987-06-10 1993-08-24 U.S. Philips Corporation Liquid crystal display device and method of manufacturing such a display device
JPH03127435A (ja) * 1989-10-12 1991-05-30 Nec Corp 薄膜トランジスタ制御型蛍光表示パネル
DE69125650T2 (de) * 1990-06-05 1997-09-04 Matsushita Electric Ind Co Ltd Flache Anzeigevorrichtung und Verfahren zur Herstellung derselben
JPH0521007A (ja) * 1991-07-15 1993-01-29 Nissha Printing Co Ltd 蛍光表示管の製造方法
GB2258756A (en) * 1991-08-02 1993-02-17 Eric James Sjoberg Sealing and making connection to electron tube devices.
US5428263A (en) * 1992-01-07 1995-06-27 Mitsubishi Denki Kabushiki Kaisha Discharge cathode device with stress relieving layer and method for manufacturing the same
US5686790A (en) * 1993-06-22 1997-11-11 Candescent Technologies Corporation Flat panel device with ceramic backplate
EP0716438A1 (fr) * 1994-12-06 1996-06-12 International Business Machines Corporation Dispositif d'emission de champ et procédé pour sa fabrication
WO1997029506A1 (fr) * 1996-02-09 1997-08-14 Philips Electronics N.V. Dispositif d'affichage du type en couche mince
KR100219273B1 (ko) * 1996-11-30 1999-09-01 구자홍 플라즈마 디스플레이 제조방법
RU2169409C2 (ru) * 1999-08-02 2001-06-20 Научно-исследовательский институт "Волга" Многоцветный катодолюминесцентный экран матричного типа и способ его изготовления

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100456A (en) * 1976-02-06 1978-07-11 Nippon Electric Kagoshima, Ltd. Luminescent display panel comprising a sealing mass for eliminating slow leaks along leads
DE2615721C2 (de) * 1976-04-09 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Anzeigevorrichtung mit einem Gasentladungsraum als Quelle für Elektronen und einem Nachbeschleunigungsraum zur Nachbeschleunigung dieser Elektronen
DE2802976C2 (de) * 1978-01-24 1980-02-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren und Vorrichtung zur Herstellung von Durchbrüchen (Löchern) in Glasplatten, vorzugsweise mit feinsten Strukturen
DE2931077A1 (de) * 1979-07-31 1981-02-05 Siemens Ag Steuerplatte fuer eine gasentladungsanzeigevorrichtung
US4339482A (en) * 1980-08-29 1982-07-13 Lucitron, Inc. Flat-panel display and method of manufacture
US4404060A (en) * 1981-05-08 1983-09-13 Siemens Aktiengesellschaft Method for producing insulating ring zones by galvanic and etch technologies at orifice areas of through-holes in a plate

Also Published As

Publication number Publication date
DE3341397A1 (de) 1985-05-23
JPS60119056A (ja) 1985-06-26
EP0142765A3 (fr) 1986-02-12
US4613399A (en) 1986-09-23

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Inventor name: WENGERT, ROLF, DR.

Inventor name: TRAUSCH, GUENTER, DIPL.-ING.

Inventor name: KOBALE, MANFRED, DR.