EP0023362A1 - Procédé pour la fabrication d'un alliage de cuivre électriquement conducteur - Google Patents
Procédé pour la fabrication d'un alliage de cuivre électriquement conducteur Download PDFInfo
- Publication number
- EP0023362A1 EP0023362A1 EP80104479A EP80104479A EP0023362A1 EP 0023362 A1 EP0023362 A1 EP 0023362A1 EP 80104479 A EP80104479 A EP 80104479A EP 80104479 A EP80104479 A EP 80104479A EP 0023362 A1 EP0023362 A1 EP 0023362A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper alloy
- copper
- weight
- alloy material
- zirconium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 48
- 239000000956 alloy Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000137 annealing Methods 0.000 claims abstract description 8
- 238000005482 strain hardening Methods 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052726 zirconium Inorganic materials 0.000 claims description 19
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 27
- 238000002844 melting Methods 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 239000000654 additive Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000004881 precipitation hardening Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- -1 and the rest Chemical compound 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003763 resistance to breakage Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Definitions
- the present invention relates to an electrically conductive copper alloy material having both electrical conductivity and mechanical strength, and a method for manufacturing the same.
- the primary object of the present invention is therefore to provide a copper alloy material which eliminates the problems of the conventional copper alloy member and which has an electrical conductivity, mechanical strength and suitability for mass production compatible with use an electric wires.
- the present invention provides an electrically conductive copper alloy material whose grain size number is not less than 7 as defined by JIS G 0551.
- the present invention further provides a method for manufacturing an electrically conductive copper alloy material which is characterized by making an ingot, hot-working it to a wire of suitable diameter, and, without subjecting it to the solution treatment, cold-working it so as to provide a grain size number of not less than 7 as defined by JIS G 0551.
- the most important point of the present invention is the finding of a copper alloy material having a suitable electrical conductivity and mechanical strength by obtaining a grain size number of not less than 7, preferably 8 - 9 as defined by JIS G 0551 by preferably repeatedly annealing and working the copper alloy material without the solution treatment which has heretofore required a precipitation hardening treatment.
- the suitability for mass production obtained by eliminating the step of the solution treatment is also industrially advantageous.
- the crystal grain size as defined by JIS G 0551 is calculated as follows.
- Making an ingot can be performed by general vacuum melting or atmospheric melting using a carbon melting pot.
- the base metal material preferably comprises a material containing little oxygen, such as a return material or oxygen free copper.
- Quenching in this case means fast cooling from a ' temperature of 1,200 - 1,250°C at which the additives are added to a casting temperature of 1,100 - 1,150°C within a period of only 1 - 2 minutes.
- This method which adopts a carbon melting pot, is especially advantageous for a chrome-copper alloy, a zirconium-copper alloy, a chrome-zirconium-copper alloy and so on.
- Chrome is preferably added in the form of a base alloy of chrome-copper alloy. This is because the addition of metallic chrome tends to cause segregation due to a difference in melting points and small solid solubility.
- Zirconium may be added only for deoxidation or for inclusion in the alloy.
- Zirconium to be included in the alloy is added separately from zirconium for deoxidation. That is, after sufficiently deoxidizing with zirconium, more zirconium to be included in the alloy may be added.
- the addition of Zr is in general preferably performed at a temperature higher than the melting point of the copper alloy.
- zirconium is added for deoxidation and more zirconium to be included in the alloy is added. This is because Zr is easily oxidized, and the addition of Zr is thus difficult before sufficiently deoxidizing the electrolytic copper.
- Special components such as silicon, germanium, magnesium, boron and so on are added after the deoxidation by zirconium as needed. This is because addition of these elements after sufficient deoxidation results in a better yield. Boron is added simultaneously with chrome as a base metal.
- the ingot making method of the Cr-Zr-Cu alloy may be summarized as follows:
- the features of the copper alloy melted by this method are found to be the same as those of a copper alloy obtained by a conventional vacuum melting method, and have the following advantages.
- the atmospheric melting method which uses a carbon melting pot is advantageous in that it does not require special equipment as in the vacuum melting method and the manufacturing cost may be made less.
- This atmospheric melting method may be advantageously applicable particularly to alloys such as 0.05-1.5% Cr-Cu, preferably 0.3-1.5% Cr-Cu, more preferably 0.3-0.9% Cr-Cu; 0.05-0.5% Zr-Cu, preferably J 0.1-0.5% Zr-Cu, more preferably 0.1-0.4% Zr-Cu; 0.3-1% Cr-Cu, 0.1-0.5% Zr-Cu; and Cu alloys containing further 0.005-0.1%, preferably 0.01-0.03% (all by weight) of silicon, germanium, boron or magnesium in addition to above ranges of Cr and Zr.
- alloys such as 0.05-1.5% Cr-Cu, preferably 0.3-1.5% Cr-Cu, more preferably 0.3-0.9% Cr-Cu; 0.05-0.5% Zr-Cu, preferably J 0.1-0.5% Zr-Cu, more preferably 0.1-0.4% Zr-Cu; 0.3-1% Cr-Cu, 0.1-0.5% Zr-Cu; and Cu alloys containing further 0.005-0.1%, preferably 0.01-0.03% (
- the copper alloy material is repeatedly annealed and cold-worked after hot-working in order to obtain optimum results.
- the alloy of the above composition was hot-worked at a temperature of 700 - 850°C by the atmospheric melting method using a carbon melting pot so as to obtain a wire of 7 - 10 mm in diameter. Then thus obtained wire was cold-worked after acid cleaning into a wire of 2 mm in diameter. After annealing it at a temperature of 500 - 650°C, it was further cold-worked into a wire of 0.26 mm in diameter.
- Table II The characteristics of a copper alloy of cold working finish, a copper alloy of annealing finish at a temperature of 550°C, a copper alloy obtained by a conventional precipitation hardening treatment and pure copper are shown in Table II.
- the evaluation method was as follows:
- the grain forms are, in an alloy of rolling finish, relatively elongated and, in an alloy of annealing finish, relatively circular.
- alloys with a grain size number of not less than 7 manufactured by repeated annealings and cold workings without requiring the solution treatment in accordance with the method of the present invention are shown in Table III. These alloys are an alloy (A) of 1% by weight of chrome and copper; an alloy (B) of 0.15% by weight of zirconium and copper; an alloy (C) of 0.7% by weight of chrome, 0.3% by weight of zirconium and copper; an alloy (D) of 1% by weight of chrome, 0.03% by weight of silicon and copper; an alloy (E) of 0.15% by weight of zirconium, 0.03% by weight of silicon and copper; and an alloy (F) of 0.7% by weight of chrome, 0.15% by weight of zirconium, 0.03% by weight of silicon and copper.
- Silicon, germanium, boron, magnesium and so on are effective for improving the mechanical strength and for suppressing the generation of coarse grains.
- the electrically conductive copper alloy of the present invention may be applied in wide range including cables for welders, elevator cables, jumpers for vehicles, crane cables, trolly hard copper twisted wires of cable rack wires for power stations and substations, lead wires and so on.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9606779A JPS5620136A (en) | 1979-07-30 | 1979-07-30 | Copper alloy member |
| JP96067/79 | 1979-07-30 | ||
| JP9988479A JPS5625940A (en) | 1979-08-07 | 1979-08-07 | Refinig method of copper alloy |
| JP99884/79 | 1979-08-07 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0023362A1 true EP0023362A1 (fr) | 1981-02-04 |
| EP0023362B1 EP0023362B1 (fr) | 1985-06-19 |
| EP0023362B2 EP0023362B2 (fr) | 1993-04-28 |
Family
ID=26437313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19800104479 Expired - Lifetime EP0023362B2 (fr) | 1979-07-30 | 1980-07-29 | Procédé pour la fabrication d'un alliage de cuivre électriquement conducteur |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0023362B2 (fr) |
| DE (1) | DE3070776D1 (fr) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0029888A1 (fr) * | 1979-11-19 | 1981-06-10 | International Business Machines Corporation | Procédé de fabrication d'un fil conducteur |
| US4640723A (en) * | 1982-12-23 | 1987-02-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Lead frame and method for manufacturing the same |
| GB2181742A (en) * | 1985-09-13 | 1987-04-29 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
| EP0299605A3 (en) * | 1987-05-26 | 1990-05-16 | Nippon Steel Corporation | Iron-copper-chromium alloy for high-strength lead frame or pin grid array and process for preparation thereof |
| EP0569036A3 (fr) * | 1992-05-08 | 1994-01-19 | Mitsubishi Materials Corp | |
| US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
| EP0702375A3 (fr) * | 1994-09-15 | 1996-09-11 | Siemens Ag | Fil conducteur aérien pour chemins de fer électriques à grande vitesse et procédé pour sa fabrication |
| US5705125A (en) * | 1992-05-08 | 1998-01-06 | Mitsubishi Materials Corporation | Wire for electric railways |
| US20170312101A1 (en) * | 2014-11-28 | 2017-11-02 | Lifetech Scientific (Shenzhen) Co., Ltd. | Lumen Stent and Preform Thereof, and Methods for Preparing Lumen Stent and Preform Thereof |
| CN111621666A (zh) * | 2020-06-22 | 2020-09-04 | 陕西斯瑞新材料股份有限公司 | 一种Cu-Cr系列合金板带的轧制方法 |
| CN112301251A (zh) * | 2020-09-25 | 2021-02-02 | 中铜华中铜业有限公司 | 一种时效强化型Cu-Cr-Zr合金板/带材及其制备方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB508330A (en) * | 1937-04-02 | 1939-06-29 | Philips Nv | Improvements in or relating to wire-shaped bodies of high tensile strength and smallspecific resistance |
| GB921795A (en) * | 1961-01-27 | 1963-03-27 | Mallory Metallurg Prod Ltd | Improvements in and relating to copper-base alloys |
| GB1030427A (en) * | 1962-12-26 | 1966-05-25 | Nippert Electric Products Comp | A method of producing a copper base alloy conductor |
| US3392016A (en) * | 1965-10-15 | 1968-07-09 | American Metal Climax Inc | Copper-zirconium alloy |
| GB1353430A (en) * | 1971-07-20 | 1974-05-15 | Gni I Pi Splavov I Obrabotki T | Copper-based alloys |
-
1980
- 1980-07-29 EP EP19800104479 patent/EP0023362B2/fr not_active Expired - Lifetime
- 1980-07-29 DE DE8080104479T patent/DE3070776D1/de not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB508330A (en) * | 1937-04-02 | 1939-06-29 | Philips Nv | Improvements in or relating to wire-shaped bodies of high tensile strength and smallspecific resistance |
| GB921795A (en) * | 1961-01-27 | 1963-03-27 | Mallory Metallurg Prod Ltd | Improvements in and relating to copper-base alloys |
| GB1030427A (en) * | 1962-12-26 | 1966-05-25 | Nippert Electric Products Comp | A method of producing a copper base alloy conductor |
| US3392016A (en) * | 1965-10-15 | 1968-07-09 | American Metal Climax Inc | Copper-zirconium alloy |
| GB1353430A (en) * | 1971-07-20 | 1974-05-15 | Gni I Pi Splavov I Obrabotki T | Copper-based alloys |
Non-Patent Citations (2)
| Title |
|---|
| FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, September 1974, Z. HENMI et al. "Effect of precipitates on recrystallization temperature in conductive materials", pages 173-193. * Page 179 * * |
| PATENTS ABSTRACTS OF JAPAN, Vol. 1, No. 45, 4th May 1977, page 1825 C 76; & J P-A-52 003 523; & JP-A-52 003 524. * |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0029888A1 (fr) * | 1979-11-19 | 1981-06-10 | International Business Machines Corporation | Procédé de fabrication d'un fil conducteur |
| US4640723A (en) * | 1982-12-23 | 1987-02-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Lead frame and method for manufacturing the same |
| GB2181742A (en) * | 1985-09-13 | 1987-04-29 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
| US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
| GB2181742B (en) * | 1985-09-13 | 1990-05-23 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
| EP0299605A3 (en) * | 1987-05-26 | 1990-05-16 | Nippon Steel Corporation | Iron-copper-chromium alloy for high-strength lead frame or pin grid array and process for preparation thereof |
| US5085712A (en) * | 1987-05-26 | 1992-02-04 | Nippon Steel Corporation | Iron/copper/chromium alloy material for high-strength lead frame or pin grid array |
| US5391243A (en) * | 1992-05-08 | 1995-02-21 | Mitsubishi Materials Corporation | Method for producing wire for electric railways |
| EP0569036A3 (fr) * | 1992-05-08 | 1994-01-19 | Mitsubishi Materials Corp | |
| US5705125A (en) * | 1992-05-08 | 1998-01-06 | Mitsubishi Materials Corporation | Wire for electric railways |
| US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
| US5601665A (en) * | 1992-11-04 | 1997-02-11 | Olin Corporation | Process for improving the bend formability of copper alloys |
| US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
| EP0702375A3 (fr) * | 1994-09-15 | 1996-09-11 | Siemens Ag | Fil conducteur aérien pour chemins de fer électriques à grande vitesse et procédé pour sa fabrication |
| US20170312101A1 (en) * | 2014-11-28 | 2017-11-02 | Lifetech Scientific (Shenzhen) Co., Ltd. | Lumen Stent and Preform Thereof, and Methods for Preparing Lumen Stent and Preform Thereof |
| CN111621666A (zh) * | 2020-06-22 | 2020-09-04 | 陕西斯瑞新材料股份有限公司 | 一种Cu-Cr系列合金板带的轧制方法 |
| CN111621666B (zh) * | 2020-06-22 | 2021-05-07 | 陕西斯瑞新材料股份有限公司 | 一种Cu-Cr系列合金板带的轧制方法 |
| CN112301251A (zh) * | 2020-09-25 | 2021-02-02 | 中铜华中铜业有限公司 | 一种时效强化型Cu-Cr-Zr合金板/带材及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0023362B1 (fr) | 1985-06-19 |
| DE3070776D1 (en) | 1985-07-25 |
| EP0023362B2 (fr) | 1993-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4755235A (en) | Electrically conductive precipitation hardened copper alloy and a method for manufacturing the same | |
| US8951370B2 (en) | Aluminum alloy wire material | |
| JP6858311B2 (ja) | アルミニウム合金材およびこれを用いた、導電部材、電池用部材、締結部品、バネ用部品、構造用部品、キャブタイヤケーブル | |
| EP0023362B1 (fr) | Procédé pour la fabrication d'un alliage de cuivre électriquement conducteur | |
| CN110923499B (zh) | 一种含Ce和B的钛青铜合金带材及其制备方法 | |
| JPH09104956A (ja) | 高強度高導電性銅基合金の製造法 | |
| US11293084B2 (en) | Sheet matertal of copper alloy and method for producing same | |
| EP0189637B1 (fr) | Alliage à base de cuivre et sa fabrication | |
| KR20130059412A (ko) | 전자 재료용 Cu-Co-Si 계 합금 | |
| JP2012193408A (ja) | 曲げ加工性に優れたCu−Ni−Si系合金 | |
| JP5950499B2 (ja) | 電気・電子部品用銅合金及びSnめっき付き銅合金材 | |
| JP5376396B2 (ja) | ワイヤーハーネス用電線導体 | |
| JP4130593B2 (ja) | 疲労及び中間温度特性に優れた高力高導電性銅合金 | |
| JPS6328971B2 (fr) | ||
| JP2018076588A (ja) | 銅合金板材およびその製造方法 | |
| JP6246454B2 (ja) | Cu−Ni−Si系合金及びその製造方法 | |
| JP4199320B2 (ja) | 支持体の製造方法 | |
| KR100256851B1 (ko) | 고강도선재 및 판재용 구리(CU)-니켈(Ni)-망간(Mn)-주석(Su)-실리콘(Si)합금과 그 제조방법 | |
| JPH09324230A (ja) | 高導電線材 | |
| KR100256852B1 (ko) | 고강도선재 및 판재용구리(Cu)-니켈(Ni)-망간(Mn)-주석(Sn)-알루미늄(Al)합금과 그 제조방법 | |
| JPH0696757B2 (ja) | 耐熱性および曲げ加工性が優れる高力、高導電性銅合金の製造方法 | |
| JPH06279894A (ja) | 強度および導電性に優れた銅合金 | |
| JPH08120368A (ja) | 伸び特性及び屈曲特性に優れた導電用高力銅合金、及びその製造方法 | |
| JP2500143B2 (ja) | 導電性および強度を兼備した銅合金部材 | |
| KR890001013B1 (ko) | 와이어 콘넥터(Wire Connector)의 동합금의 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19800729 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB NL |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: KABUSHIKI KAISHA TOSHIBA |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB NL |
|
| REF | Corresponds to: |
Ref document number: 3070776 Country of ref document: DE Date of ref document: 19850725 |
|
| ET | Fr: translation filed | ||
| PLBI | Opposition filed |
Free format text: ORIGINAL CODE: 0009260 |
|
| PLBI | Opposition filed |
Free format text: ORIGINAL CODE: 0009260 |
|
| 26 | Opposition filed |
Opponent name: SCHNEIDER, KLAUS, DIPL.-ING. Effective date: 19860214 |
|
| NLR1 | Nl: opposition has been filed with the epo |
Opponent name: SCHNEIDER, KLAUS, DIPL.-ING. |
|
| 26 | Opposition filed |
Opponent name: KABEL- UND METALLWERKE GUTEHOFFNUNGSHUETTE AKTIEN Effective date: 19860318 |
|
| NLR1 | Nl: opposition has been filed with the epo |
Opponent name: KABEL- UND METALLWERKE GUTEHOFFNUNGSHUETTE AG |
|
| PLAB | Opposition data, opponent's data or that of the opponent's representative modified |
Free format text: ORIGINAL CODE: 0009299OPPO |
|
| R26 | Opposition filed (corrected) |
Opponent name: SCHNEIDER, KLAUS, DIPL.-ING. * 860318 KABEL- UND M Effective date: 19860214 |
|
| PUAH | Patent maintained in amended form |
Free format text: ORIGINAL CODE: 0009272 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: PATENT MAINTAINED AS AMENDED |
|
| 27A | Patent maintained in amended form |
Effective date: 19930428 |
|
| AK | Designated contracting states |
Kind code of ref document: B2 Designated state(s): DE FR GB NL |
|
| NLR2 | Nl: decision of opposition | ||
| NLR3 | Nl: receipt of modified translations in the netherlands language after an opposition procedure | ||
| ET3 | Fr: translation filed ** decision concerning opposition | ||
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: 746 Effective date: 19990216 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19990709 Year of fee payment: 20 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19990728 Year of fee payment: 20 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 19990730 Year of fee payment: 20 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19990802 Year of fee payment: 20 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: D6 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20000728 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20000729 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: PE20 Effective date: 20000728 |
|
| NLV7 | Nl: ceased due to reaching the maximum lifetime of a patent |
Effective date: 20000729 |
|
| APAH | Appeal reference modified |
Free format text: ORIGINAL CODE: EPIDOSCREFNO |