EP0073583A1 - Stromlose Nickel-Bor-Plattierung - Google Patents

Stromlose Nickel-Bor-Plattierung Download PDF

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Publication number
EP0073583A1
EP0073583A1 EP82304210A EP82304210A EP0073583A1 EP 0073583 A1 EP0073583 A1 EP 0073583A1 EP 82304210 A EP82304210 A EP 82304210A EP 82304210 A EP82304210 A EP 82304210A EP 0073583 A1 EP0073583 A1 EP 0073583A1
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EP
European Patent Office
Prior art keywords
bath
electroless
boron
deposit
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP82304210A
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English (en)
French (fr)
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EP0073583B1 (de
Inventor
Glenn O. Mallory
Theresa Horhn
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Richardson Chemical Co
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Richardson Chemical Co
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Publication date
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Publication of EP0073583A1 publication Critical patent/EP0073583A1/de
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Publication of EP0073583B1 publication Critical patent/EP0073583B1/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Definitions

  • This invention generally relates to forming electroless nickel-boron deposits having a high boron content.
  • an electroless codeposit of nickel and boron is achieved by immersion of a substrate into an electroless bath including a source of nickel ions and a borane reducing agent. Often, it is desirable to lay down a deposit that has a relatively high boron content in order to enhance the hardness of the deposit when compared with a substantially pure nickel deposit of up to 99.9% nickel.
  • borane-reduced baths form a codeposit that has severe limitations from the point of view of the ability to control the percentage of boron that could be laid down in the codeposit, borane-reduced baths being especially unsuitable for forming codeposits having a relatively high boron content on the order of 2 weight % and above. These borane-reduced deposits are limited generally by the pH of the bath and the stability of the borane reducing agent of the bath.
  • borane-reduced bath As the pH of a borane-reduced bath is decreased, the percentage of boron codeposited with the nickel is increased; however, because boranes undergo hydrolysis at low pH values, borane reducing agents begin to lose their stability and thus are rapidly consumed as the bath pH is reduced below 4.
  • a borane-reduced electroless nickel bath that will lay down a deposit having a high boron content would have to be at a low pH, but a low pH bath consumes the borane reducing agent at an excessive rate that is unacceptable commercially.
  • borane-reduced codeposits could be increased by decreasing the pH
  • this capability is limited by the fact that the boranes are consumed at rates that are unacceptable commercially when the pH is lowered to a level that produces a high-boron codeposit.
  • a borane-reduced bath that is commercially viable from the point of view of acceptable levels of borane consumption should have a pH well in excess of 5.
  • boron content of nickel boron electroless deposits can be increased by the use of a borohydride ion as the reducing agent in the bath rather than a borane reducing agent, but borohydride-reduced baths lay down high-boron deposits only when such baths are operated at a pH of over 13 and at a temperature in excess of 90°C. These are relatively harsh conditions that are undesirable to maintain in a commercial electroless plating operation. But, if a borohydride-reduced bath is allowed to drop to a pH of below about 12, the bath undergoes spontaneous solution decomposition.
  • electroless nickel-boron plating is deposited from baths including zirconyl ions, vanadyl ions, or combinations or mixtures thereof, together with a borane reducing agent and a source of nickel.
  • a borane reducing agent and a source of nickel.
  • Other typical electroless nickel bath ingredients may be included, such as complexing agents, stabilizers, buffers, and the like.
  • the boron deposition enhancers impart added stability to the borane reducing agent in the bath while also enhancing its boron depositing capabilities at moderate pH values.
  • Zirconyl ion boron deposition enhancers can be added to the bath by any compound that will liberate zirconyl ions (Zr0 ++ ), such as zirconyl chloride octahydrate (ZrOCl 2 ⁇ 8H 2 O).
  • Vanadyl ion (VO ++ ) boron deposition enhancers can be provided by compounds such as vanadyl sulfate or vanadium oxysulfate (VOSO 4 ⁇ 2H 2 O) or other vanadyl salts, as well as by vanadates such as sodium metavanadate (NaVO 3 ⁇ 4H 2 O), which vanadates oxidize organic compounds within the bath and in turn themselves undergo reduction to provide vanadyl ions within the bath.
  • vanadyl ion (VO ++ ) boron deposition enhancers can be provided by compounds such as vanadyl sulfate or vanadium oxysulfate (VOSO 4 ⁇ 2H 2 O) or other vanadyl salts, as well as by vanadates such as sodium metavanadate (NaVO 3 ⁇ 4H 2 O), which vanadates oxidize organic compounds within the bath and in turn themselves undergo reduction to provide vanadyl
  • the compounds which yield to'zirconyl and/or vanadyl ions are included within baths at a concentration having a lower limit at which the particular enhancer increases the boron deposit percentage and an upper limit guided by economic and bath solubility considerations.
  • a typical concentration of the boron deposition enhancer within the bath is at least about 0.0005 mol per liter, preferably at least about 0.0007 mol per liter, and most preferably at least about 0.001 mol per liter.
  • these boron deposition enhancers at bath concentrations in excess of 0.5 mol per liter, preferably not greater than 0.1 mol per liter.
  • Borane reducing agents utilized in baths according to this invention include any bath-soluble borane source such as ammine boranes, amine boranes, lower alkyl substituted amine boranes, and nitrogen-inclusive heterocyclic boranes including pyridine borane and morpholine borane.
  • the alkyl amine-boranes are preferred, especially dimethylamine borane. Reducing agent concentrations within these baths are those that are sufficient to effect adequate reduction and are also cost-efficient for reducing the nickel cations within the bath.
  • Typical minimum concentrations are at least about 0.001 mol per liter of bath, more usually at least about 0.005 mol per liter, while as much as 1 mol per liter could be included, and usually no more than about 0.1 mol per liter need be included.
  • Sources of nickel for these baths are bath soluble nickel salts such as the sulfates, chlorides, sulfamates, or other anions compatible with electroless nickel systems. Concentrations utilized are those that are typical for electroless nickel plating baths, on the order of between about 0.001 mol per liter of bath and about 0.5 mol per liter.
  • complexing agents are, generally speaking, bath soluble carboxylic acids and bath soluble derivatives thereof, including hydroxy-substituted carboxylic acids, amino-substituted carboxylic acids, and bath soluble derivatives thereof including anhydrides, salts or esters that are bath soluble.
  • complexing agents include ester complexes of polyhydric compounds formed by reacting an oxyacid with a polyhydric acid or alcohol such as those described in Mallory United States Letters Patent No.4019910.
  • complexing agents include pyrophosphoric acid and its derivatives as well as organo-phosphoric complexing agents including phosphonates.
  • Specific hydroxy substituted carboxylic acid complexing agents include citric acid, glycolic acid, lactic acid and malic acid, while exemplary amino-substituted carboxylic acid complexing agents include s-alanine, aminoacetic acid, aminodiacetic acid, and the amino acids such as a-alanine, aspartic acid, glutamic acid, glycine, lucine, serrine, triosine, and valine.
  • Complexing agents falling within the category of ester complexes of oxyacids and polyhydric acids or alcohols include ester complexes prepared by reacting an oxyacid with a carboxylic acid or alcohol compound which contains at least two hydroxy groups and from about 4 to about 15 carbon atoms per molecule.
  • Typical suitable polyhydric compounds include carboxylic acids such as tartaric acid, gluconic acid or glucoheptonic acid, and alcohols such as mannitol, 2,3-butanediol and 1,2,3-propanetriol.
  • the oxyacids used in forming the ester are generally inorganic acids such as boric, tungstic, molybdic or chromic acids.
  • ester complexes are in the form of a polyester that is an ester complex formed by reacting two or more mols of the oxyacid with one mole of the polyhydric compound.
  • Phosphonate complexing agents include aminotri-(methylenephosphonic acid) and salts thereof such as a solution of the pentasodium salt of aminotri(methylenephosphonate), 1-hydroxyethylidene-1,1-diphosphonic acid and salts thereof such as the trisodium salt of 1-hydroxyethylidene-1,1-diphosphonic acid, ethylenediamine tetra(methylphosphonic acid) and salts thereof, and 1,6-diaminohexane tetra(methylphosphonic acid) and the alkaline metal and ammonium salts thereof.
  • aminotri-(methylenephosphonic acid) and salts thereof such as a solution of the pentasodium salt of aminotri(methylenephosphonate), 1-hydroxyethylidene-1,1-diphosphonic acid and salts thereof such as the trisodium salt of 1-hydroxyethylidene-1,1-diphosphonic acid, ethylenediamine tetra(methylphosphonic acid)
  • Complexing agent bath concentrations will, of course, be somewhat dependent upon whatever particular complexing agent or agents are included within the bath. Generally speaking, complexing agents within the bath are at a concentration of at least about 0.0005 mol per liter and can be as high as bath solubility limits and economic considerations dictate, usually no higher than about 1.5 mol per liter. A typical range is between about 0.005 and about 1 mol per liter of bath, preferably between about 0.1 and 0.7 mol per liter, especially when the complexing agent is a carboxylic acid.
  • These baths may optionally include stabilizers such as those of the carboxylic acid type, sources of antimony or of lead for controlling the sulfide ion content, or a sulfur containing compound such as thiourea or a combination thereof such as thiodiglycolic acid.
  • stabilizers such as those of the carboxylic acid type, sources of antimony or of lead for controlling the sulfide ion content, or a sulfur containing compound such as thiourea or a combination thereof such as thiodiglycolic acid.
  • the sulfur content must be carefully controlled, since excessive sulfur will reduce the boron content of the deposit. Any such sulfur addition should be monitored so that the maximum sulfur concentration is about 20 ppm as divalent sulfur. Otherwise, when stabilizers are added to the bath, they are at a concentration typical for the particular compound.
  • compositions that may be included in this system at their typical bath concentrations include buffers, buffering systems, codeposition enhancers, and pH adjusting compounds such as strong bases.
  • Polyalloy deposition may be accomplished by including bath-soluble compounds such as a complexing agent that is an ester complex prepared by reacting a polyhydric acid or alcohol with an oxyacid of the metal to be deposited as part of the polyalloy with nickel and boron or other metal.
  • a nickel-boron codeposit having a high boron content is laid down by deposition from a borane-reduced electroless nickel bath having a moderate pH and a moderate temperature, which bath includes a source of zirconyl and/or vanadyl ions.
  • the operational pH is less than 13, typically between 4 and 10, and, in order to take the greatest advantage of the capabilities of this method to proceed under moderate conditions while still forming a high boron deposit, preferably the bath pH is maintained between about 5 and 7 while the temperature is maintained below 90°C, typically between about 60 and about 70°C.
  • the method includes preparing an electroless deposition bath including a bath-soluble source of nickel, a bath-soluble borane reducing agent, a boron deposition enhancer that liberates vanadyl ions and/or zirconyl ions when added to the bath, preferably in combination with an electroless bath complexing agent.
  • Preparing the bath may optionally include adding one or more stabilizers, sulfide- content controllers, buffers, buffering systems, polyalloy deposition sources, codeposition enhancers, and the like.
  • Substrates to be deposited are immersed in the bath thus prepared.
  • the weight or thickness of the nickel-boron codeposit laid down by the bath will vary, of course, with the plating rate and the length of time that the substrate is immersed within the bath.
  • Plating rates according to this method are between about 0.2 and about 0.5 mil per hour, and typical tank loadings are between about 0.25 and 1.0 square foot per gallon of bath.
  • Products produced according to this invention include substrates, both metal and non-metal, that are plated with a protective coating of an electroless nickel-boron codeposit having a boron content of at least about 2 weight %, which codeposit is laid down by a bath according to this invention.
  • These products can have boron contents as high as or in excess of 5 weight %, based on the weight of the deposit.
  • the balance of the deposit will be nickel.
  • Such plated codeposits exhibit an enhanced hardness, on the order of from 800 to 1000 VHN 50 .
  • An electroless bath was prepared to include 0.3 mol _per liter of lactic acid, 0.08 mol per liter of citric acid, 0.04 mol per liter of dimethylamine borane, 0.01 mol per liter of zirconyl chloride octahydrate, 0.01 mol per liter of nickel, and enough ammonium hydroxide to maintain the pH at 6.0.
  • the bath was raised to a temperature of 65°C, and a substrate was immersed therein, upon which there was formed a deposit of 4.1 weight % boron and 95.9 weight % nickel.
  • Another electroless nickel deposition bath was prepared by adding the following to an aqueous bath: 0.3 mol per liter of lactic acid, 0.08 mol per liter of citric acid, 0.04 moL per liter of dimethylamine borane, 0.001 mol per liter of vanadyl sulfate, 0.1 mol per liter of nickel, and a concentration of ammonium hydroxide to raise the bath to a pH of 6.0 at a temperature of 70°C.
  • a deposit composition was formed containing 3.6 weight % boron and 96.4 weight % nickel.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
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EP19820304210 1981-08-24 1982-08-10 Stromlose Nickel-Bor-Plattierung Expired EP0073583B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29552381A 1981-08-24 1981-08-24
US295523 1981-08-24

Publications (2)

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EP0073583A1 true EP0073583A1 (de) 1983-03-09
EP0073583B1 EP0073583B1 (de) 1986-03-12

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EP (1) EP0073583B1 (de)
JP (1) JPS5842766A (de)
CA (1) CA1176404A (de)
DE (1) DE3269823D1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0084937A1 (de) * 1982-01-18 1983-08-03 Richardson Chemical Company Elektrisches Kontaktmaterial
EP1211334A3 (de) * 2000-11-28 2004-01-21 Ebara Corporation Flüssigkeit für die stromlose Plattierung von Ni-B, elektronisches Gerät und Verfahren zur Herstellung
US6908504B2 (en) * 2001-12-19 2005-06-21 Intel Corporation Electroless plating bath composition and method of using
CN111118480A (zh) * 2020-01-14 2020-05-08 常州大学 一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法
CN115807220A (zh) * 2021-09-15 2023-03-17 西部数据技术公司 用于外壳和壳体的镍-硼涂层

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222064A (ja) * 1988-03-02 1989-09-05 Hitachi Ltd 化学ニッケルめっき液およびそれを使用する方法
JP5344416B2 (ja) * 2006-03-09 2013-11-20 奥野製薬工業株式会社 自己触媒型無電解ニッケルめっき液用耐折り曲げ性向上剤及び自己触媒型無電解ニッケルめっき液
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1198167B (de) * 1958-11-26 1965-08-05 Du Pont Waessriges Bad zur chemischen Abscheidung von UEberzuegen aus Nickel-Bor- oder Kobalt-Bor-Legierungen
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4139660A (en) * 1963-07-16 1979-02-13 Bernhard Joos Method for increasing solid surface tension
US4151311A (en) * 1976-01-22 1979-04-24 Nathan Feldstein Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating catalysts
US4167416A (en) * 1976-10-19 1979-09-11 Alfachimici S.P.A. Composition for the electroless deposition of nickel base alloys
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
GB2066857A (en) * 1980-01-07 1981-07-15 Vmei Lenin Nis >Method for the production of an abrasive surface

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1198167B (de) * 1958-11-26 1965-08-05 Du Pont Waessriges Bad zur chemischen Abscheidung von UEberzuegen aus Nickel-Bor- oder Kobalt-Bor-Legierungen
US4139660A (en) * 1963-07-16 1979-02-13 Bernhard Joos Method for increasing solid surface tension
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4151311A (en) * 1976-01-22 1979-04-24 Nathan Feldstein Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating catalysts
US4167416A (en) * 1976-10-19 1979-09-11 Alfachimici S.P.A. Composition for the electroless deposition of nickel base alloys
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
GB2066857A (en) * 1980-01-07 1981-07-15 Vmei Lenin Nis >Method for the production of an abrasive surface

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0084937A1 (de) * 1982-01-18 1983-08-03 Richardson Chemical Company Elektrisches Kontaktmaterial
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
EP1211334A3 (de) * 2000-11-28 2004-01-21 Ebara Corporation Flüssigkeit für die stromlose Plattierung von Ni-B, elektronisches Gerät und Verfahren zur Herstellung
US6908504B2 (en) * 2001-12-19 2005-06-21 Intel Corporation Electroless plating bath composition and method of using
US7279231B2 (en) 2001-12-19 2007-10-09 Intel Corporation Electroless plating structure
CN111118480A (zh) * 2020-01-14 2020-05-08 常州大学 一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法
CN111118480B (zh) * 2020-01-14 2022-02-11 常州大学 一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法
CN115807220A (zh) * 2021-09-15 2023-03-17 西部数据技术公司 用于外壳和壳体的镍-硼涂层
CN115807220B (zh) * 2021-09-15 2025-11-21 桑迪士克科技股份有限公司 用于外壳和壳体的镍-硼涂层

Also Published As

Publication number Publication date
EP0073583B1 (de) 1986-03-12
DE3269823D1 (en) 1986-04-17
CA1176404A (en) 1984-10-23
JPS5842766A (ja) 1983-03-12
JPH0153352B2 (de) 1989-11-14

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