EP0181706B1 - Hybride Organoindium und Organogalliumverbindungen und Verfahren für metallorganische chemische Abscheidung aus der Dampfphase - Google Patents

Hybride Organoindium und Organogalliumverbindungen und Verfahren für metallorganische chemische Abscheidung aus der Dampfphase Download PDF

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EP0181706B1
EP0181706B1 EP85307400A EP85307400A EP0181706B1 EP 0181706 B1 EP0181706 B1 EP 0181706B1 EP 85307400 A EP85307400 A EP 85307400A EP 85307400 A EP85307400 A EP 85307400A EP 0181706 B1 EP0181706 B1 EP 0181706B1
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compounds
compound
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organic chemical
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EP0181706A1 (de
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Benjamin C. Hui
Jorg Lorberth
Andreas A. Melas
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ATK Launch Systems LLC
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C—CHEMISTRY; METALLURGY
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/305—Sulfides, selenides, or tellurides
    • C23C16/306—AII BVI compounds, where A is Zn, Cd or Hg and B is S, Se or Te

Definitions

  • This invention relates to organometallic compounds comprising gallium and/or indium and mixed alkyl substituents.
  • This invention also relates to metal organic chemical vapour deposition (MOCVD) processes such as are employed for example in the optoelectronics industry.
  • MOCVD metal organic chemical vapour deposition
  • MOCVD is a method for depositing thin metal or metal compound films on a silicon or other substrate.
  • the deposited films can be sources of doping impurities which are driven into the substrate, or the films themselves can have electrical or optical properties different from those of the substrate. These films are used to make laser diodes, solar cells, photocathodes, field effect transistors and other discrete devices, in fiber optic communications, microwave communications, digital audio disc systems, and other advanced optoelectronic technologies.
  • the properties of the film depend on the deposition conditions and the chemical identity of the deposited film.
  • a special advantage of MOCVD is that organometallic compounds can be found which have much higher vapour pressure at moderate temperatures than the corresponding metals, and which decompose to release the corresponding metals or form compounds thereof at the 550 to 700 degrees Celsius deposition temperatures which should not be exceeded during fabrication.
  • Typical apparatus currently in use for MOCVD comprises a bubbler which contains a supply or the organometallic compound chosen for a particular process, a reactor or deposition chamber which contains the substrate on which a film is to be deposited, a source of a carrier gas which is inert to the organometallic compound in the bubbler and either inert or reactive to the compound in the deposition chamber, and optionally sources of other reactants or dopants supplied to the reaction chamber.
  • the bubbler and contents are maintained at a constant and relatively low temperature which typically is above the melting point of the organometallic compound but far below its decomposition temperature.
  • the deposition chamber is typically maintained at a much higher temperature, such as about 550 to 700 degrees Celsius, at which the organometallic compound readily decomposes to release its constituent metal.
  • the carrier gas is introduced into the bubbler under the surface of the organometallic compound. Rising bubbles of the carrier gas provide a large, constant contact surface and thus uniformly vapourize the organometallic compound.
  • the carrier gas and vapour collected in the headspace of the bubbler are continuously directed to the deposition chamber.
  • organometallic compounds for MOVCD desirably are liquids at or slightly above room temperature (about -20°C to 40°C). Such compounds also should have a vapour pressure of at least 133.3 Pa (1.0 torr) at the bubbler temperature, boil and decompose at temperatures substantially exceeding the bubbler temperature, and decompose readily at the temperature encountered in the deposition chamber.
  • organometallic compounds of aluminium, boron, cadmium, mercury, thallium and zinc, with two different organic substituent groups, are disclosed in the Dictionary of Organometallic compounds, vol. 1, Chapman and Hall, London. Also disclosed therein are organohydride compounds of benyllium, magnesium and gallium, and alkyl/cyclopentadienyl gallium compounds.
  • organo boron compounds are disclosed in US-A-2969382, organozinc compounds in US-A-3578494 and organocadmium compounds in JACS vol. 97 No. 7, PP 1672 to 1679.
  • organometallic compounds often do not form homologous series. Many organometallic compounds characteristically exist in only one form, for example, as monomers, dimers, trimers, tetramers, or higher polymers. Structurally similar compounds often have different characteristic forms, and thus much different or inconsistent vapour pressure, melting points, and decomposition temperatures.
  • Trimethylindium is believed to characteristically form a tetramer and triethylindium is believed to characteristically form a monomer at room temperature. This difference is believed to underline their inconsistent properties.
  • the preceding table illustrates that trimethylindium is a solid at temperatures employed in bubblers, and has a vapour pressure of sublimation which is undesirably low. Trimethylindium has been vapourized by providing two bubblers in series to better control the amount of entrained vapour. The apparatus necessary for this two bubbler procedure is more expensive and complex, and yet provides less control of the partial pressure of trimethylindium, than apparatus used to vapourize a liquid from a single bubbler.
  • Triethylindium has an even lower vapour pressure at 30 degrees Celsius than trimethylindium, and is also less thermally and chemically stable than trimethylindium. Triethylindium starts to decompose to Indium at 35 degrees Celsius, and at an even lower temperature in the presence of hydrogen-the typical carrier gas. The vapourization of triethylindium thus must take place at a temperature approaching its decomposition temperature, and even then the deposition rate is undesirably low. The lack of homology in these Indium compounds and the small number of known Indium compounds have prevented those of ordinary skill in the art from selecting an optimal compound for Indium MOCVD.
  • a first aspect of the invention is a genus of compounds useful for metal organic chemical vapour deposition, defined by the molecular formula: wherein each said R substituent is a C 1 to C 4 alkyl group and at least two of the R substituents are different.
  • M is gallium or indium.
  • Such compounds are known herein as mixed or hybrid organometallic compounds, and are believed to be novel.
  • a second aspect of the invention is a metal organic chemical vapour deposition process wherein there is used a compound having the formula MR 3 defined above.
  • the apparatus employed for metal organic chemical vapour deposition generally comprises a deposition chamber maintained at a temperature between the melting point and the decomposition temperature of the compound being deposited, at which the said compound has a vapour pressure which is useful for a particular deposition process.
  • the apparatus further comprises a deposition chamber maintained at a temperature at least as high as the decomposition temperature of the compound.
  • Practice of this process allows one to tailor the molecular structure of an organometallic compound of a desired metal to fit the required specifications of vapour pressure, melting point, boiling point and decomposition temperature which are necessary for successful or optimal practice of MOCVD.
  • Still another aspect of the invention is a process for synthesising hybrid organometallic compounds, comprising the steps of:
  • the hybrid compounds thus produced can also be used in MOCVD processes accordingly to the invention.
  • R substituents contemplated for use in the novel compounds are alkyl groups having from one to four carbon atoms, and specifically include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and t-butyl groups.
  • the generic invention includes gallium or indium combined with any two or more R substituents as previously defined.
  • the genus is limited, however, by the requirement that at least two different R substituents must be associated with each metal atom.
  • Exemplary species contemplated herein include the following:
  • Hybrid organometallic compounds can be produced by mixing organometallic compounds containing the respective substituents of the hybrid; by reacting a halogen substituted organometallic compound with an alkylating or arylating agent to add an unlike substituent; by reacting the metal for which an organometallic hybrid compound is desired with mixtures of organic halides; by substituting a more active metal for a less active metal in an organometallic hybrid compound of the less active metal; or by other means.
  • first and second organometallic compounds are first selected.
  • Each reactant has the formula: in which each R' of the first compound can be identical, and each R' of the second compound can be identical, but at least one R' substituent of the first compound is different than at least one R' substituent of the second compound.
  • the first and second compounds are mixed together and allowed to equilibrate at a temperature below the lower of the boiling points of the reactants and products, preferably from 0-30 0 Celsius.
  • a nonreactive solvent such as benzene, hexane, ether, tetrahydrofuran, etc. is optional. The result of this exchange reaction will typically .
  • the desired product can be isolated by distillation, crystallization, or other well known processes.
  • the product mixture can be used for MOCVD without isolating a pure hybrid product.
  • the following equations illustrate reactions of this type in which stoichiometric proportions of the reactants provide a major proportion of the indicated product:
  • a halogenated organometallic compound having one of the desired alkyl substituents is reacted with an alkylating agent.
  • the alkyl group of the alkylating agent then replaces the halogen substituent of the organometallic compound.
  • Typical alkylating agents for use herein include such materials as methyllithium, ethylmagnesium bromide, or lithium aluminium hydride. Examples of these synthetic reactions are set forth in the two following equations:
  • organometallic synthesis such as those discussed on pages 345-348 and 365-366 of Roberts and Caserio, Basic Principles of Organic Chemistry, W. A. Benjamin Inc. (New York: 1964) can also be adopted to synthesize the hybrid organometallic compounds defined herein.
  • the present compounds have utility as reactants in MOCVD.
  • Preferred reactants for this utility have a melting point of less than about 30 degrees Celsius, have a vapour pressure of at least 1.0 torrs at a temperature within the bubbler temperature range of from about minus 20 degrees Celsius to about 40 degrees Celsius, are stable at the indicated bubbler temperatures but readily decompose at a deposition chamber temperature of from about 550 to about 700 degrees Celsius, and are inert at bubbler temperatures with respect to at least one carrier gas such as hydrogen, nitrogen or helium.
  • the present compounds also have utility for the preparation of other such compounds within the scope of the present invention.
  • a hybrid organometallic compound which does not have a desirable decomposition tempeature may be reacted with another organometallic compound to produce a new hybrid.
  • the present compounds also have utility in organic synthesis and as catalysts, for example in Ziegler-Natta processes.
  • the ultimate utility of these compounds, employed in MOCVD, is to provide a coating of the constituent metal, or (in combination with other reactants introduced in the deposition chamber) to provide coatings of metal oxides, nitrides, III-V compounds, and so forth.
  • the metal hybrid organometallic compounds can also be used as dopants.
  • a second aspect of the present invention is a process for selecting particular hybrid organometallic compounds of gallium and/or indium which are useful in metal organic chemical vapour deposition processes.
  • the present process characterised as an MOCVD process, comprises the steps of selecting first and second compounds, each having the formula MR3 as further defined below, making a hybrid compound having at least one substituent in common with the first compound and at least one substituent in common with the second compound, and employing the hybrid compound for metal organic chemical vapour deposition in apparatus further specified below. Since in the usual chemical vapour deposition process a particular element has been selected for deposition, usually the M constituents of the first and second compound will be the same. However, the process is not limited by this consideration nor has the second compound an optimal melting point, vapour pressure, or decomposition tempeature for use in MOCVD. First and second compounds meeting this definition are trimethylindium and triethylindium, whose melting points, volatility, and decomposition temperatures are set forth above in Table I above.
  • first and second gallium or indium compounds useful in practicing the present invention can be found in the list of known homosubstituted and hybrid organometallic compounds in the "Background Art" section set forth previously.
  • the next step is to make a composite compound having at least one R' substituent possessed by the first compound and at least one R' substituent possessed by the second compound.
  • one manner of synthesizing the composite compound is by mixing the first and second compounds in the manner previously described, the present process is not limited to that method of synthesis. The other synthetic methods previously described, or method not specifically disclosed herein, can also be used within the scope of the present process invention.
  • the composite compound should differ from each of the first and second compounds as to at least one property selected from decomposition temperature, vapour pressure at a particular temperature suitable for a bubbler, and melting point.
  • the composite compound will be useful for MOCVD under different process conditions than the first and second compounds.
  • the composite compound defined herein may have a corresponding property between those of the first and second compounds or may have a surprisingly different value of the corresponding property.
  • Examples of the composite compounds within the scope of the second step of the process include the generic class and species set forth previously for the compound invention, as well as the previously mentioned hybrid organometallic compounds known to the art.
  • the composite compound is employed for MOCVD in apparatus comprising a bubbler or equivalent apparatus maintained at a temperature between the melting point and decomposition temperature of the composite compound.
  • the desired composite compound will have a vapour pressure at this temperature of at least 133.3 Pa (1.0 torr), and thus will be useful for deposition.
  • the MOCVD apparatus used in this step further comprises a deposition chamber maintained at a temperature at least as high as the decomposition temperature of the composite compound, triggering the breakdown of the composite organometallic compound to release its constituent metal.
  • the present hybrid organometallic compounds have an advantage over any nonazeotropic mixture for use in MOCVD, as any nonazeotropic mixture will be fractionated by the carrier gas in a manner analogous to gas liquid chromatography.
  • the resulting product had a melting point of about 5 to 7 degrees Celsius and a boiling point of 23-25°C at 200 Pa (1.5 torr), which is unexpectedly different than the respective melting points and boiling points of trimethylindium and triethylindium.
  • Proton nuclear magnetic resonance and infrared spectra were taken, and are presented as Figure 1 and 2 forming a part of this specification.
  • NMR spectra of trimethylindium and triethylindium are presented as Figures 5 and 6.
  • the infrared spectrum is not believed to distinguish the product compound, but the NMR spectrum of dimethylethylindium is characterised by peaks at delta+1.27 (triplet representing ethyl); +0.37 (quartet representing ethyl); and -0.36 (singlet representing methyl). Integration of the areas under the peaks provides the ratio of methyl to ethyl groups, which is 2:1.
  • Figure 5 is the NMR spectrum of trimethylindium, characterised by a singlet methyl peak at a delta value of -0.20.
  • the melting point of trimethylindium is 88 degrees Celsius.
  • Figure 6 is the NMR spectrum of triethylindium, characterised by peaks at delta values of +1.24 (triplet ethyl) and +0.40 (quartet ethyl).
  • the melting point of triethylindium is -32 degrees Celsius.
  • Methyldiethylindium prepared as described previously is placed in a bubbler and suitably interconnected with a source of hydrogen gas and a deposition chamber.
  • the chamber is also supplied with phosphine gas.
  • the bubbler is maintained at 20 degrees Celsius using a suitable heat source, the deposition chamber is maintained at 650 degrees Celsius, and an Indium Phosphide substrate is supported within the deposition chamber.
  • the entraining hydrogen is delivered at 100 cubic centimeters per minute (at standard temperature and pressure).
  • the partial pressure of hydrogen in the deposition chamber is atmospheric pressure, and the partial pressure of methyldiethylindium is about 13.33 Pa (10 torr), the partial pressure of phosphine being atmospheric pressure.
  • a coating of indium phosphide approximately 2 ⁇ m thick, uniform in composition and thickness, is found to be deposited on the substrate.

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Claims (13)

1. Ein Verfahren zum Synthetisieren hybrider Organometallverbindungen, umfassend die Schritte:
(A) der Wahl verschiedener erster und zweiter Verbindungen, von denen jede die Formel
Figure imgb0016
besitzt, worin jeder besagte Substituent R' ein Cl-C4-Alkyl ist und worin M in jedem Falle in Gallium oder Indium besteht, und
(B) des Zusammenmischens der besagten ersten und zweiten Verbindungen, um ein Produkt der Formel
Figure imgb0017
zu bilden, worin jeder Substituent R eine C,-C4-Alkyl-Gruppe ist, wobei mindestens zwei der besagten Substituenten R unterschiedlich sind und M wie vorstehend definiert ist.
2. Ein Verfahren nach Anspruch 1, bei dem jeder Substituent R Methyl oder Äthyl ist.
3. Ein Verfahren nach Anspruch 1 oder Anspruch 2, bei dem mindestens einer der besagten Substituenten R Methyl ist.
4. Ein Verfahren nach Anspruch 3, bei dem zwei der besagten Substituenten R Methyl sind.
5. Ein Verfahren nach einem der vorstehenden Ansprüche, bei dem mindestens ein besagter Substituent R Äthyl ist.
6. Ein Verfahren nach Anspruch 5, bei dem zwei der besagten Substituenten R Äthyl sind.
7. Ein Verfahren nach einem der vorstehenden Ansprüche, bei dem M Indium ist.
8. Ein Verfahren nach Anspruch 7, bei dem das Produkt im wesentlichen aus Dimethyläthylindium oder Diäthylmethylindium besteht.
9. Ein Verfahren nach Anspruch 4, bei dem das Produkt im wesentlichen aus Dimethyläthylgallium besteht.
10. Ein Verfahren nach einem der vorstehenden Ansprüche, das den weiteren Schritt der Absonderung des besagten Produkts umfaßt.
11. Ein Verfahren nach einem der vorstehenden Ansprüche, bei dem die besagten ersten und zweiten Verbindungen in stöchiometrischen Proportionen gemischt werden.
12. Ein metallorganisches chemisches Bedampfungsverfahren, bei dem von einer hybriden Organometallverbindung Gebrauch gemacht wird, die nach einem auf einem der vorstehenden Ansprüche beruhenden Verfahren hergestellt wurde.
EP85307400A 1984-10-25 1985-10-15 Hybride Organoindium und Organogalliumverbindungen und Verfahren für metallorganische chemische Abscheidung aus der Dampfphase Expired EP0181706B1 (de)

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US06/664,645 US4720560A (en) 1984-10-25 1984-10-25 Hybrid organometallic compounds, particularly for metal organic chemical vapor deposition

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KR860003266A (ko) 1986-05-21
ATE48002T1 (de) 1989-12-15
CA1251804A (en) 1989-03-28
DK488785A (da) 1986-04-26
JPS61104079A (ja) 1986-05-22
US4720560A (en) 1988-01-19
DK488785D0 (da) 1985-10-24
DE3574257D1 (en) 1989-12-21
EP0181706A1 (de) 1986-05-21
IL76716A0 (en) 1986-02-28
BR8505338A (pt) 1986-08-05
KR900001008B1 (ko) 1990-02-24
JPH0357188B2 (de) 1991-08-30

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