EP0257832A2 - Pointe de sonde télescopique - Google Patents

Pointe de sonde télescopique Download PDF

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Publication number
EP0257832A2
EP0257832A2 EP87306811A EP87306811A EP0257832A2 EP 0257832 A2 EP0257832 A2 EP 0257832A2 EP 87306811 A EP87306811 A EP 87306811A EP 87306811 A EP87306811 A EP 87306811A EP 0257832 A2 EP0257832 A2 EP 0257832A2
Authority
EP
European Patent Office
Prior art keywords
probe
circuit
pin
circuit element
transmission line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87306811A
Other languages
German (de)
English (en)
Other versions
EP0257832A3 (fr
Inventor
Matthew J. Hadwin
John D. Garcia
Emory J. Harry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of EP0257832A2 publication Critical patent/EP0257832A2/fr
Publication of EP0257832A3 publication Critical patent/EP0257832A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06766—Input circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe

Definitions

  • the following invention relates to a spring loaded, telescoping electrical contact pin probe having a high input impedance and a wide band frequency response characteristic which can be mounted on a con­ventional "bed of nails” test fixture.
  • Telescoping pin probes are commonly in use as test probes for printed circuits or other components.
  • a telescoping pin is a telescoping rod mounted in a spring loaded sleeve and having a contact point for touching various desired locations on a printed circuit board.
  • a number of telescoping pins are placed in a test fixture in an array or matrix.
  • Such fixtures are commonly known in the industry as "bed of nails” test fixtures because of the use of a plurality of conical tipped probes held upright in the test fixture and placed relatively close together.
  • a device under test such as a printed circuit board is placed in a chuck and lowered onto the test fixture until the probes make contact with the desired points on the cir­cuit.
  • the probes are connected by cables or trans­mission lines to a test instrument which then performs a series of diagnostic tests.
  • probes of this type are DC, uncontrolled impedance probes.
  • the pencil-thin shape of such probes which allows them to be placed in test fixtures of the type described above, prevents the use of active cir­cuitry near the tip of the probe.
  • Active probes have been available only in hand-held units which are considerably bulkier than the telescoping pin probes used in a test fixture. Therefore, the previously available test fixture probes are capable only of DC or very low frequency measurement and also have a low impedance input characteristic which may place undesirable loads on the circuit under test.
  • the present invention comprises a telescoping pin probe including a telescoping pin which is held within an insulating sleeve, and a circuit element, also held within the sleeve and electrically connected to the telescoping pin.
  • the circuit element is con­nected to a transmission line which is connected to an auxiliary electrical circuit for providing the tele­scoping pin with a high input impedance and a wide band frequency response characteristic.
  • the telescoping pin probe of the invention may utilize a thin, elongate hybrid circuit mounted on a substrate and having an input at one end of the sub­strate and an output at the opposite end. Electrical contact between the telescoping pin and the hybrid cir­cuit, and between the hybrid circuit and the transmis­sion line is provided by conductive elastomers affixed to the input and output ends of the hybrid integrated circuit.
  • the entire assembly may be fitted within an outer conductive sleeve which may be placed within a conventional telescoping pin test fixture.
  • the outer sleeve may be connected to a ground plane, and the ground plane may, in turn, be connected to another telescoping pin which makes contact with a region of ground potential in the device under test.
  • a test fixture 10 includes a telescoping pin probe 12 and a ground probe 14.
  • the ground probe 14 is connected to the tele­scoping pin probe 12 by a ground plane 16 which is situated on the surface of the test fixture 10.
  • a coaxial cable 18 serves as a transmission line to con­nect the telescoping pin probe 12 to a compensation box 20 which houses active circuitry for providing the telescoping pin probe 12 with the required electrical characteristics.
  • the compensation box 20 is powered by a power input line 22 which may be connected to any suitable power supply.
  • the compensation box 20 includes a BNC connector 24 for connecting the compen­sation box 20 to the input of an electronic test instrument.
  • the telescoping pin probe 12 includes a telescoping pin 26 comprising a spring loaded sheath 28 and a sharpened contact point 30.
  • the telescoping pin 26 is held inside an insulator 32.
  • a circuit element 34 which may be an RC attenuator is also held within insulating sleeve 32 and is con­nected to the spring loaded sheath 28 of the telescop­ing pin 26 by a small wad of conductive elastomer 36.
  • the output of the circuit element 34 is connected by another small wad of conductive elastomer 38 to the signal path 40 of a transmission line 18.
  • the trans­mission line 18 also includes a coaxial ground shield 42 which is brought into electrical contact with a metal receptacle 44 held within the test fixture 10.
  • the metal receptacle 44 is connected to a ground plane 16 which is in turn connected to ground telescoping pin 14.
  • the circuit element 34 may be a hybrid circuit printed on a thin elongate piece of alumina substrate.
  • the circuit 34 may comprise a resistor R1 and capacitor C1 connected in parallel, which com­bine with the impedance provided by coaxial cable 18 and the circuit elements in active compensation box 20 to give the probe its characteristically high impedance and wide bandwidth frequency response.
  • the telescoping pin 12 has a characteristically inductive tip as shown by inductor Lp.
  • the circuit element 34 reduces the signal level encountered at the probe tip, acting as one half of a voltage divider.
  • the other half of the voltage divider comprises a variable capacitor C2 and resistor R2.
  • the two aforementioned portions of the voltage divider are linked by a high impedance cable 22 which has a nominal impedance of 120 ohms.
  • the signal conductor of the cable 22 terminates in a damping resistor R4 and in a compensating peaking resistor R3.
  • the voltage divider output is applied to the gate of high input impedance FET Q1.
  • Q2 provides a current source for Q1 and thermally compensates for the heating of the FETS Q1 and Q2.
  • the current gain of the atten­uated probe tip signal is provided by Q4.
  • Thermal compensation for Q4 is provided by Q3.
  • the output of the amplifier comprising Q1, Q2, Q3 and Q4 is connected to a back termination network comprising R12, a 50 ohm resistor, connected in parallel with R13 and C4 in one branch and C3 in another branch.
  • R13 and C4 compensate for skin effect losses which may occur in 50 ohm trans­mission line 46 at high frequencies.
  • C3 provides a high frequency bypass to sharpen the leading edges of signal pulses to compensate for the initial capacitance presented by cable 46.
  • Cable 46 is a standard 50 ohm cable which is connected to a test instrument 48.
  • the test instrument 48 need not be connected directly to the compensation box 20 but may be located remotely from it and con­nected by a cable 46.
  • the transmission line 22, whose impedence must be high in order for the attenu­ator located on circuit element 34 to function prop­erly, is long enough to provide ample clearance for the probe 12 so that it may be located in the test fixture 10.
  • the transmission line 22 does not, however, pro­vide the link by which the compensation box 20 is con­nected to the test instrument. Rather, it is the back termination network that provides the compensation box 20 with the capability of driving the conventional 50 ohm cable 46, which may be of any arbitrary length.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
EP87306811A 1986-08-01 1987-07-31 Pointe de sonde télescopique Withdrawn EP0257832A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/891,834 US4739259A (en) 1986-08-01 1986-08-01 Telescoping pin probe
US891834 1992-06-01

Publications (2)

Publication Number Publication Date
EP0257832A2 true EP0257832A2 (fr) 1988-03-02
EP0257832A3 EP0257832A3 (fr) 1989-12-27

Family

ID=25398904

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87306811A Withdrawn EP0257832A3 (fr) 1986-08-01 1987-07-31 Pointe de sonde télescopique

Country Status (3)

Country Link
US (1) US4739259A (fr)
EP (1) EP0257832A3 (fr)
JP (1) JPS6338166A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361689B1 (fr) * 1988-09-09 1995-07-19 Qa Technology Company Inc. Capteur pour tester des circuits électriques
WO2005045448A1 (fr) * 2003-10-14 2005-05-19 The Ludlow Compagny Lp Terminal de cable a chevilles de contact comprenant un composant electrique
US7371128B2 (en) 2003-10-14 2008-05-13 Precision Interconnect, Inc. Cable terminal with air-enhanced contact pins

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JPH0194277A (ja) * 1987-10-06 1989-04-12 Furuno Electric Co Ltd 回路基板検査装置
US5006793A (en) * 1989-06-08 1991-04-09 Cascade Microtech, Inc. High-frequency active probe having replaceable contact needles
US5304921A (en) * 1991-08-07 1994-04-19 Hewlett-Packard Company Enhanced grounding system for short-wire lengthed fixture
US5175493A (en) * 1991-10-11 1992-12-29 Interconnect Devices, Inc. Shielded electrical contact spring probe assembly
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5308250A (en) * 1992-10-30 1994-05-03 Hewlett-Packard Company Pressure contact for connecting a coaxial shield to a microstrip ground plane
US7368924B2 (en) * 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US6452406B1 (en) * 1996-09-13 2002-09-17 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6172514B1 (en) * 1999-03-12 2001-01-09 Lucent Technologies Inc. Test probe retainer
US6414504B2 (en) * 1999-05-20 2002-07-02 Delaware Capital Formation, Inc. Coaxial tilt pin fixture for testing high frequency circuit boards
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6798229B2 (en) * 2000-05-11 2004-09-28 Brian D. Butler Wide-bandwidth coaxial probe
US6400167B1 (en) * 2000-08-21 2002-06-04 Tektronix, Inc. Probe tip adapter for a measurement probe
US6331836B1 (en) * 2000-08-24 2001-12-18 Fast Location.Net, Llc Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6459287B1 (en) * 2001-05-18 2002-10-01 Tektronix, Inc. Attachable/detachable probing point
WO2003020467A1 (fr) 2001-08-31 2003-03-13 Cascade Microtech, Inc. Appareil de test optique
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
ATE371196T1 (de) * 2002-03-05 2007-09-15 Rika Denshi America Inc Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP2008502167A (ja) 2004-06-07 2008-01-24 カスケード マイクロテック インコーポレイテッド 熱光学チャック
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20060267605A1 (en) * 2005-05-27 2006-11-30 Yang Kei-Wean C Differential measurement probe having a ground clip system for the probing tips
US7242202B2 (en) * 2005-05-31 2007-07-10 Agilent Technologies, Inc. Signal probe and probe assembly
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
JP2007048491A (ja) * 2005-08-08 2007-02-22 D D K Ltd 電気コネクタ
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
DE102006052748A1 (de) * 2006-08-14 2008-04-30 Rohde & Schwarz Gmbh & Co. Kg Oszilloskop-Tastkopf
US7724009B2 (en) * 2007-02-09 2010-05-25 Mpi Corporation Method of making high-frequency probe, probe card using the high-frequency probe
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US8319503B2 (en) * 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US20120182034A1 (en) * 2011-01-17 2012-07-19 3M Innovative Properties Company Contact assembly
US10585118B2 (en) * 2017-05-10 2020-03-10 Tektronix, Inc. Wide range compensation of low frequency response passive probe
US10908183B2 (en) * 2017-11-06 2021-02-02 National Instruments Corporation Active probe powered through driven coax cable
CN115469203B (zh) * 2022-09-05 2023-09-19 上海泽丰半导体科技有限公司 一种探针卡行程测量系统和方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361689B1 (fr) * 1988-09-09 1995-07-19 Qa Technology Company Inc. Capteur pour tester des circuits électriques
WO2005045448A1 (fr) * 2003-10-14 2005-05-19 The Ludlow Compagny Lp Terminal de cable a chevilles de contact comprenant un composant electrique
US7364474B2 (en) 2003-10-14 2008-04-29 Precision Interconnect, Inc. Cable terminal with contact pins including electrical component
US7371128B2 (en) 2003-10-14 2008-05-13 Precision Interconnect, Inc. Cable terminal with air-enhanced contact pins

Also Published As

Publication number Publication date
EP0257832A3 (fr) 1989-12-27
US4739259A (en) 1988-04-19
JPS6338166A (ja) 1988-02-18

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