EP0330895A3 - Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten und Anordnung zur Durchführung desselben - Google Patents

Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten und Anordnung zur Durchführung desselben Download PDF

Info

Publication number
EP0330895A3
EP0330895A3 EP19890102447 EP89102447A EP0330895A3 EP 0330895 A3 EP0330895 A3 EP 0330895A3 EP 19890102447 EP19890102447 EP 19890102447 EP 89102447 A EP89102447 A EP 89102447A EP 0330895 A3 EP0330895 A3 EP 0330895A3
Authority
EP
European Patent Office
Prior art keywords
pressure
substrates
electronic components
attaching electronic
sinter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890102447
Other languages
English (en)
French (fr)
Other versions
EP0330895A2 (de
EP0330895B1 (de
Inventor
Herbert Dr.Rer.Nat. Schwarzbauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0330895A2 publication Critical patent/EP0330895A2/de
Publication of EP0330895A3 publication Critical patent/EP0330895A3/de
Application granted granted Critical
Publication of EP0330895B1 publication Critical patent/EP0330895B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Zum Befestigen von elektronischen Bauelementen (3), insbeson­ dere Leistungshalbleitern, auf Substraten (1) dient das Druck­ sinterverfahren, bei dem die zu verbindenden Flächen unter Zwischenfügung einer Metallpulverpaste (10) bei Sintertempera­ tur mit mindestens 900 N/cm² zusammengepreßt werden. Bauele­ mente (3) mit strukturierter Oberseite können druckgesintert werden, wenn sie gemeinsam mit einem Körper (14, 15) aus elastisch verformbarem Material, z.B. Silikonkautschuk, in eine durch einen bewegbaren Stempel (18) abgeschlossene, den Sinter­ druck übertragende Aufnahmekammer (11a, 11b, 18) eingelegt werden, wobei der deformierbare Körper (14, 15) beim Erreichen des Sinterdrucks den verbleibenden Innenraum der Aufnahmekammer vollständig ausfüllt.
EP19890102447 1988-03-03 1989-02-13 Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten und Anordnung zur Durchführung desselben Expired - Lifetime EP0330895B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3806979 1988-03-03
DE3806979 1988-03-03

Publications (3)

Publication Number Publication Date
EP0330895A2 EP0330895A2 (de) 1989-09-06
EP0330895A3 true EP0330895A3 (de) 1991-03-27
EP0330895B1 EP0330895B1 (de) 1994-12-14

Family

ID=6348785

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890102447 Expired - Lifetime EP0330895B1 (de) 1988-03-03 1989-02-13 Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten und Anordnung zur Durchführung desselben

Country Status (4)

Country Link
US (2) US4903885A (de)
EP (1) EP0330895B1 (de)
JP (1) JP2537153B2 (de)
DE (1) DE58908749D1 (de)

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GB8920101D0 (en) * 1989-09-06 1989-10-18 Marconi Electronic Devices Methods of joining components
EP0460286A3 (en) * 1990-06-06 1992-02-26 Siemens Aktiengesellschaft Method and arrangement for bonding a semiconductor component to a substrate or for finishing a semiconductor/substrate connection by contactless pressing
US5152449A (en) * 1990-07-05 1992-10-06 Morgan Crucible Company Plc Edge braze of metal end cap to ceramic cylinder
EP0477600A1 (de) * 1990-09-26 1992-04-01 Siemens Aktiengesellschaft Verfahren zum Befestigen eines mit wenigstens einem Halbleiterbauelement versehenen Halbleiterkörpers auf einem Substrat
DE59209470D1 (de) * 1991-06-24 1998-10-01 Siemens Ag Halbleiterbauelement und Verfahren zu seiner Herstellung
DE4233073A1 (de) * 1992-10-01 1994-04-07 Siemens Ag Verfahren zum Herstellen eines Halbleiter-Modulaufbaus
DE4315272A1 (de) * 1993-05-07 1994-11-10 Siemens Ag Leistungshalbleiterbauelement mit Pufferschicht
US5632434A (en) * 1995-06-29 1997-05-27 Regents Of The University Of California Pressure activated diaphragm bonder
DE59611448D1 (de) * 1995-09-11 2007-12-06 Infineon Technologies Ag Verfahren zur Befestigung elektronischer Bauelemente auf einem Substrat durch Drucksintern
DE10016129A1 (de) 2000-03-31 2001-10-18 Siemens Ag Verfahren zum Herstellen einer wärmeleitenden Verbindung zwischen zwei Werkstücken
DE10019443A1 (de) * 2000-04-19 2001-10-31 Texas Instruments Deutschland Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger
EP1280196A1 (de) * 2001-07-18 2003-01-29 Abb Research Ltd. Verfahren zum Befestigen von elektronischen Bauelementen auf Substraten
US7357288B2 (en) * 2003-07-17 2008-04-15 Matsushita Electric Industrial Co., Ltd. Component connecting apparatus
DE102004056702B3 (de) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
US20060027036A1 (en) * 2004-08-05 2006-02-09 Biggs Todd L Methods and apparatuses for imprinting substrates
DE102005058794A1 (de) * 2005-12-09 2007-06-14 Semikron Elektronik Gmbh & Co. Kg Vorrichtung und getaktetes Verfahren zur Drucksinterverbindung
US7525187B2 (en) * 2006-10-13 2009-04-28 Infineon Technologies Ag Apparatus and method for connecting components
US9214442B2 (en) 2007-03-19 2015-12-15 Infineon Technologies Ag Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
DE102007022337A1 (de) * 2007-05-12 2008-11-20 Semikron Elektronik Gmbh & Co. Kg Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu
US8555491B2 (en) 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
DE102007035902A1 (de) * 2007-07-31 2009-02-05 Siemens Ag Verfahren zum Herstellen eines elektronischen Bausteins und elektronischer Baustein
US8253233B2 (en) 2008-02-14 2012-08-28 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
US7682875B2 (en) 2008-05-28 2010-03-23 Infineon Technologies Ag Method for fabricating a module including a sintered joint
US8603864B2 (en) * 2008-09-11 2013-12-10 Infineon Technologies Ag Method of fabricating a semiconductor device
DE102008048869A1 (de) * 2008-09-25 2010-04-22 Infineon Technologies Ag Vorrichtung und Verfahren zum Verbinden zweier Verbindungspartner
DE102008050798A1 (de) 2008-10-08 2010-04-15 Infineon Technologies Ag Verfahren zum Positionieren und Fixieren eines Bauteils auf einem anderen Bauteil sowie eine Anordnung zum Positionieren und Vorfixieren
DE102009000192A1 (de) 2009-01-14 2010-07-15 Robert Bosch Gmbh Sinterwerkstoff, Sinterverbindung sowie Verfahren zum Herstellen eines Sinterverbindung
EP2226838A1 (de) * 2009-03-04 2010-09-08 ABB Research Ltd. Befestigungsvorrichtung für Niedrigtemperatur- und Niedrigdrucksintern
DE102010012231A1 (de) * 2010-03-19 2011-09-22 Danfoss Silicon Power Gmbh Verfahren zum NTV-Sintern eines Halbleiterbausteins
US8651359B2 (en) * 2010-08-23 2014-02-18 International Business Machines Corporation Flip chip bonder head for forming a uniform fillet
US8587116B2 (en) 2010-09-30 2013-11-19 Infineon Technologies Ag Semiconductor module comprising an insert
US8999758B2 (en) 2011-08-12 2015-04-07 Infineon Technologies Ag Fixing semiconductor die in dry and pressure supported assembly processes
JP6043058B2 (ja) 2011-11-07 2016-12-14 デクセリアルズ株式会社 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法
DE102013101124B4 (de) 2013-02-05 2020-12-03 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Sintern eines Sinterproduktes
DE102014114096A1 (de) 2014-09-29 2016-03-31 Danfoss Silicon Power Gmbh Sinterwerkzeug für den Unterstempel einer Sintervorrichtung
DE102014114093B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern
DE102014114095B4 (de) * 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Sintervorrichtung
DE102014114097B4 (de) 2014-09-29 2017-06-01 Danfoss Silicon Power Gmbh Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe
DE102014115319A1 (de) * 2014-10-21 2016-04-21 Osram Opto Semiconductors Gmbh Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
US9576928B2 (en) * 2015-02-27 2017-02-21 Kulicke And Soffa Industries, Inc. Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
FR3066937B1 (fr) 2017-05-30 2019-07-12 Continental Automotive France Dispositif de chauffe
DE102017116372B3 (de) 2017-07-20 2018-10-18 Semikron Elektronik Gmbh & Co. Kg Drucksinterverfahren und Druckübertragungseinrichtung hierfür
DE102017116373B3 (de) 2017-07-20 2018-08-02 Semikron Elektronik Gmbh & Co. Kg Sinterkomponentenanordnung mit einem ersten und einem zweiten Verbindungspartner und Drucksinterverfahren hiermit
JP7604779B2 (ja) * 2020-03-23 2024-12-24 富士電機株式会社 半導体製造装置及び半導体装置の製造方法
DE102021122633B4 (de) 2021-09-01 2025-10-16 Semikron Elektronik Gmbh & Co. Kg Substrat für eine leistungselektronische Schaltung
CN115394689B (zh) * 2022-09-05 2023-09-01 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置
AT527197B1 (de) * 2023-09-15 2024-12-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Vorrichtung zum verbinden eines bauelements mit einem substrat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE896207A (fr) * 1983-03-18 1983-07-18 Ct De Rech S De L Ind Belge De Procede et dispositif de moulage d'une piece creuse par compactage d'une poudre
EP0242626B1 (de) * 1986-04-22 1991-06-12 Siemens Aktiengesellschaft Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat

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SE408383B (sv) * 1976-04-08 1979-06-11 Asea Ab Press for formning av platar och dylikt med hjelp av en formdyna, som under formningsskedet er innesluten i en kavitet, som bildas av en ovre och en undre verktygsdel av vilka minst en er rorligt anordnad i ett ...
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE896207A (fr) * 1983-03-18 1983-07-18 Ct De Rech S De L Ind Belge De Procede et dispositif de moulage d'une piece creuse par compactage d'une poudre
EP0242626B1 (de) * 1986-04-22 1991-06-12 Siemens Aktiengesellschaft Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat

Also Published As

Publication number Publication date
EP0330895A2 (de) 1989-09-06
DE58908749D1 (de) 1995-01-26
EP0330895B1 (de) 1994-12-14
US4903885A (en) 1990-02-27
JP2537153B2 (ja) 1996-09-25
US5058796A (en) 1991-10-22
JPH01255231A (ja) 1989-10-12

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