EP0333208A2 - Transistor en couche mince ayant une protection contre la lumière en carbone amorphe et procédé pour fabriquer cette protection - Google Patents

Transistor en couche mince ayant une protection contre la lumière en carbone amorphe et procédé pour fabriquer cette protection Download PDF

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Publication number
EP0333208A2
EP0333208A2 EP89104798A EP89104798A EP0333208A2 EP 0333208 A2 EP0333208 A2 EP 0333208A2 EP 89104798 A EP89104798 A EP 89104798A EP 89104798 A EP89104798 A EP 89104798A EP 0333208 A2 EP0333208 A2 EP 0333208A2
Authority
EP
European Patent Office
Prior art keywords
light protection
thin film
film transistor
light
amorphous carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89104798A
Other languages
German (de)
English (en)
Other versions
EP0333208A3 (en
EP0333208B1 (fr
Inventor
Gilbert Dipl.-Phys. Mörsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Deutschland GmbH
Original Assignee
Nokia Deutschland GmbH
Nokia Graetz GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Deutschland GmbH, Nokia Graetz GmbH filed Critical Nokia Deutschland GmbH
Publication of EP0333208A2 publication Critical patent/EP0333208A2/fr
Publication of EP0333208A3 publication Critical patent/EP0333208A3/de
Application granted granted Critical
Publication of EP0333208B1 publication Critical patent/EP0333208B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6723—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix

Definitions

  • the invention relates to thin-film transistors, such as those used for driving liquid crystal cells in flat screens, and to a method for applying light protection to these thin-film transistors.
  • the known thin film transistor has the disadvantage that light protection can only be achieved with the aid of two layers, an insulation layer and a metal layer.
  • the object of the invention is to find light protection which is implemented in a single layer.
  • Another object of the invention is to provide a simple method for producing such a light protection.
  • the thin film transistor according to the invention has the advantage that its light protection is both electrically insulated and opaque. It consists of amorphous carbon, which is applied in a CVD process with the help of methane (CH4).
  • Fig. 1 denotes a glass substrate on which there is a thin-film transistor, which consists of a tantalum electrode 11, a gate insulator 12, a source electrode 13, a drain electrode 14, a light-sensitive semiconductor 15, a transparent insulation layer 16 and a metal light shield 17 there.
  • a thin film transistor is part of a large number of thin film transistors which are arranged in an mxn matrix. These thin film transistors are used for active addressing of liquid crystal cells, which in turn are part of a flat screen. The light transmittance of the liquid crystal cells is controlled using the thin film transistors. Charge carriers pass from the source electrode 13 via the light-sensitive semiconductor material 15 to the drain electrode 14 and thus to the liquid crystal.
  • the source-drain path is then made high-resistance, and the liquid crystal acts as a capacitor.
  • the charge stored in this capacitor is a measure of the optical information (brightness) that the individual pixel is supposed to deliver.
  • FIG. 1 the semiconductor layer 15 is only partially covered by the two electrodes 13 and 14. Therefore, light can penetrate into the semiconductor material 15. If light penetrates the semiconductor material 15, there will be Electron-hole pairs are generated, which lead to a discharge of the capacitor. Such an effect is not desirable. the semiconductor material 15 must be protected against the incidence of light.
  • Known designs of thin-film transistors use a metallic light protection, which, however, must be separated from the semiconductor by an insulation layer because of its electrical conductivity.
  • the insulation layer is designated 16 here, the metallic light shield 17. Two processes are therefore required in the production of such a transistor, namely firstly the application of a transparent insulation layer 16 and secondly the application of a metallic light shield 17.
  • FIG. 2 shows a thin film transistor which corresponds to that in FIG. 1 with one exception.
  • the same reference numerals designate the same elements.
  • a film 20 made of amorphous carbon is used here.
  • Amorphous carbon is non-conductive and has an absorption of 99.96%. The use of amorphous carbon eliminates the need to apply an additional insulation layer on the transistor.
  • the amorphous carbon film is applied using a CVD process.
  • Methane (CH4) can be used as the source of the carbon.
  • the film is structured either using the lift-off method or with etching in an oxygen plasma.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Chemical Vapour Deposition (AREA)
EP89104798A 1988-03-18 1989-03-17 Transistor en couche mince ayant une protection contre la lumière en carbone amorphe et procédé pour fabriquer cette protection Expired - Lifetime EP0333208B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3809092 1988-03-18
DE3809092A DE3809092A1 (de) 1988-03-18 1988-03-18 Duennschichttransistor mit lichtschutz aus amorphem kohlenstoff und verfahren zur herstellung des lichtschutzes

Publications (3)

Publication Number Publication Date
EP0333208A2 true EP0333208A2 (fr) 1989-09-20
EP0333208A3 EP0333208A3 (en) 1990-12-19
EP0333208B1 EP0333208B1 (fr) 1994-06-01

Family

ID=6350074

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89104798A Expired - Lifetime EP0333208B1 (fr) 1988-03-18 1989-03-17 Transistor en couche mince ayant une protection contre la lumière en carbone amorphe et procédé pour fabriquer cette protection

Country Status (3)

Country Link
EP (1) EP0333208B1 (fr)
JP (1) JPH0263170A (fr)
DE (2) DE3809092A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511096A1 (fr) * 1991-04-23 1992-10-28 France Telecom Procédé de passivation locale d'un substrat par une couche de carbone amorphe hydrogène et procédé de fabrication de transistors en couches minces sur ce substrat passive
US6400434B1 (en) 1997-02-06 2002-06-04 Semiconductor Energy Laboratory Co., Ltd. Reflection type display device having display part covered with insulating layer in which carbon-based material or pigment is dispersed

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204274A (ja) * 1983-05-06 1984-11-19 Seiko Instr & Electronics Ltd 薄膜トランジスタ
JPH0666471B2 (ja) * 1985-04-20 1994-08-24 沖電気工業株式会社 薄膜トランジスタ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511096A1 (fr) * 1991-04-23 1992-10-28 France Telecom Procédé de passivation locale d'un substrat par une couche de carbone amorphe hydrogène et procédé de fabrication de transistors en couches minces sur ce substrat passive
FR2675947A1 (fr) * 1991-04-23 1992-10-30 France Telecom Procede de passivation locale d'un substrat par une couche de carbone amorphe hydrogene et procede de fabrication de transistors en couches minces sur ce substrat passive.
US5250451A (en) * 1991-04-23 1993-10-05 France Telecom Etablissement Autonome De Droit Public Process for the production of thin film transistors
US6400434B1 (en) 1997-02-06 2002-06-04 Semiconductor Energy Laboratory Co., Ltd. Reflection type display device having display part covered with insulating layer in which carbon-based material or pigment is dispersed
US7176993B2 (en) 1997-02-06 2007-02-13 Semiconductor Energy Laboratory Co., Ltd. Reflection type display device using a light shading film with a light shading material evenly dispersed throughout

Also Published As

Publication number Publication date
DE58907731D1 (de) 1994-07-07
EP0333208A3 (en) 1990-12-19
EP0333208B1 (fr) 1994-06-01
JPH0263170A (ja) 1990-03-02
DE3809092A1 (de) 1989-09-28

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