EP0364514B1 - Agencements pour lapidaires a deux disques - Google Patents
Agencements pour lapidaires a deux disques Download PDFInfo
- Publication number
- EP0364514B1 EP0364514B1 EP89902018A EP89902018A EP0364514B1 EP 0364514 B1 EP0364514 B1 EP 0364514B1 EP 89902018 A EP89902018 A EP 89902018A EP 89902018 A EP89902018 A EP 89902018A EP 0364514 B1 EP0364514 B1 EP 0364514B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- spindle
- disk
- tool
- column
- tool disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003754 machining Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000010453 quartz Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 241000309551 Arthraxon hispidus Species 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Definitions
- the present invention relates to a device on a two-disc lapping machine for bringing an upper tool disc into its working position according to the preamble of patent claim 1.
- Two-disc lapping machines have been known for around 40 to 50 years. Workpieces to be machined are drawn through and machined by so-called rotor disks by means of an inner and outer pin ring between the two tool disks. With double-disc lapping machines, it is possible to achieve a very high degree of parallelism between the machined surfaces of the workpieces. With the advent of new technologies, such as the production of silicon wafers for integrated circuits, the production of quartz or the finest ceramic plates, ever increasing demands were placed on lapping machines. Especially when machining extremely thin-walled materials, the working pressure control of the upper tool disc of double disc lapping machines should be given the greatest attention.
- the upper tool disc In today's known types of double-disc lapping machines, the upper tool disc is in most cases suspended from a motor-driven and axially displaceable spindle.
- the spindle is connected to a radially swiveling column stand of the lapping machine via a bearing component.
- Via a hydraulic or pneumatic cylinder drive which engages the axially displaceable spindle, the upper tool disk attached to the lower end of the spindle can be fed to, placed on and pressed onto the workpiece.
- the cylinder drive must first compensate for the weight of the upper tool disc, which weighs up to several 1,000 Newtons, bring the tool disc to the workpiece, slowly set it down as already described, and begin the load by reducing the weight compensation.
- the machine equipped with the device according to the invention is structurally much simpler in construction.
- the invention solves this problem according to the features listed in the characterizing part of claim 1.
- the lapping machine comprises a column stand 3 which is mounted and guided in a stand guide 2.
- the stand guide 2 is rigidly connected to the frame of the machine in a manner not shown.
- a bar 11 is arranged essentially at right angles thereto and is pivotably mounted approximately in the middle.
- the beam 11 consists of two essentially parallel to mutually extending longitudinal beams 11 a, which are connected at their rear end 28 by cross members 11 b and at their front end 13 by a headstock 14.
- an axis 12 extends at right angles to the longitudinal beams 11a through a bore in the latter and in the column stand.
- the beam 11 is pivotally supported by the axis 12.
- the headstock 14 arranged at the front end between the longitudinal beams 11a supports the tool spindle 15.
- the upper tool disk 21 is articulated via a joint head 20.
- an electric motor as the first drive means 17 is preferably arranged on the front part of the beam behind the headstock 14 and connected to the latter.
- the electric motor 17 is equipped with a reduction gear 18 and, via a transmission means 19, for example a belt drive, serves to drive the tool spindle 15.
- the tool spindle 15 which preferably has a longitudinal bore, there is a sensor 16 for measuring the workpiece thickness, through the mentioned bore , assembled. It is an essential feature of the present invention that the tool spindle 15 is mounted in the headstock 14 without the possibility of axial displacement.
- the column stand 3 has in its upper region a counter-holder 27 pointing rearward and running essentially parallel to the beam 11.
- the counter-holder 27 comprises two carriers 27a which run parallel to one another and are essentially tangentially connected to the column stand 3 and have a spacing from one another.
- At the rear end 28 of the beam 11 there is a first adjustment means between the longitudinal beams 11a via a first bearing axis 31 29 pivotally connected to the beam 11.
- the first adjusting means 29 has the task of compensating for the weight of the upper tool disk 21 by up to several 1,000 Newtons and to keep the bar 11 in a substantially horizontal position.
- a travel limiting device 37, 38, 41 arranged at the rear end 28 of the beam 11 has the task of limiting the pivoting movement of the beam 11.
- the construction is designed so that the mentioned pivoting movement of the beam 11 at the front end 13 is at most 20 mm.
- the path limiting device consists of a groove 41 which is incorporated into a cross member 11b of the beam 11 at the rear beam end 28.
- the pivoting movement of the beam 11 can also be adjusted with an adjustable stop 38 arranged in the counter holder 27.
- the column stand 3 has at its lower end a concentrically arranged one with an internal thread Hole 5 on.
- a lifting spindle 4 which can be driven by means of, for example, an electric motor 6 as a second drive means via a gear 7, engages in the thread of the bore 5 for lifting and lowering the column stand 3.
- the motor 6 with the gear 7 and the lifting spindle 4 are connected to the frame of the lapping machine.
- Another essential feature of the device according to the invention is that there is a functional separation between bringing the tool disk 21 into its working position and controlling the working pressure of the tool disk 21 on the surface of the workpieces 23.
- the feeding takes place by the lowering movement of the column stand 3 by means of the lifting spindle 4 and the control of the working pressure takes place by applying a deflecting force to the beam 11 via the second cylinder drive 30.
- the first and the second measuring means 8, 39 and the sensor 16 for measuring the workpiece thickness are connected to a control device, not shown, of the lapping machine.
- the control device processes the signals received from the measuring means 8, 39 and from the sensor 16 to control the lifting spindle 4 and the cylinder drives 29, 30.
- the lower end of the column stand 3 is flanged to a swivel cylinder 10.
- the swivel cylinder 10 serves to swivel the column stand 3 with the upper tool disk 21.
- the swivel position is shown in FIG. 2.
- the latter can be locked by means of a clamping cylinder 9 arranged in the stand guide 2.
- the upper working disk 21 always has a position parallel to the lower working disk 22 despite the pivoting movement of the beam 11, the upper tool disk is connected to the lower end of the tool spindle via a joint head 20.
- the lateral offset of the upper tool disk 21 relative to the lower tool disk 22 that occurs as a result is negligible.
- a lapping process with the device according to the invention on a two-disc lapping machine is described below.
- the column stand 3 is in a raised position and the upper tool disk 21 is in the pivoted-out position.
- the workpieces 23 to be machined are placed in the receiving openings of the rotor disk 24 on the surface of the lower tool disk 22.
- the upper tool disk 21, which is in the swiveled-out position, is swiveled in with the swivel cylinder 10.
- the pivoting position is limited, for example, by a stop (not shown) in such a way that the two tool disks 21, 22 lie one above the other centrally.
- the thickness of the unworked workpieces plus a tolerance of preferably 0.2 mm is entered into the control device (not shown) as the feed dimension for the upper tool disk.
- the upper tool disk 21 is rapidly lowered in the direction of the surface of the workpieces 23 via the lifting spindle 4.
- the control device monitors the signal from the first measuring means 8 and ensures that the lowering movement of the column stand 3 is stopped in time, just before the upper tool disk 21 touches the surface of the workpieces 23.
- the first cylinder drive 29 keeps the bar 11 permanently in a horizontal position. With the second cylinder drive 30, a small, upward force is applied. As a result, the upper tool disk 21 lowers slowly and without any appreciable working pressure onto the surface of the workpieces 23.
- the lapping process can begin.
- a time program which is stored, for example, in the control device of the lapping machine, which is not shown, a lapping process begins, the control device continuously monitoring the workpiece thickness on the basis of the signal supplied by the sensor 16 and the working pressure of the tool disk 21 via the second cylinder drive 30 on the basis of the set one controls the program dependent on the workpiece to be machined.
- the vertical position of the column stand 3 is secured with the clamping cylinder 9.
- the working pressure of the upper tool disc is reduced and the beam 11 is brought into the horizontal position by the first cylinder drive 29.
- the rotational movements of the tool disks 21, 22, the pin rings 25 and / or 26 are switched off.
- the column stand 3 is raised by actuating the lifting spindle 4.
- the swivel cylinder 10 With the swivel cylinder 10, the upper tool disk 21 is brought back into the swiveled-out position.
- the lapping machine can be unloaded and equipped with new workpieces 23 to be machined.
- the two cylinder drives 29, 30 enable the upper tool disk 21 to be precisely controlled in terms of working pressure, since the otherwise customary shifting cylinder with the known disadvantageous holding torque (slip-stik) and with the pressure reversal occurring during the working process are eliminated.
- the column stand 3 is loaded relatively little by the balance beam principle. The uplifting of the column stand known from other designs of double-disc lapping machines is thereby avoided.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Claims (8)
4. Dispositif selon la revendication 3, caractérisé en ce que le mouvement d'oscillation de la barre (11) se limite à 20 mm à son extrémité antérieure (13).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1277/88 | 1988-04-07 | ||
| CH1277/88A CH684321A5 (de) | 1988-04-07 | 1988-04-07 | Einrichtung an einer Zweischeibenläppmaschine. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0364514A1 EP0364514A1 (fr) | 1990-04-25 |
| EP0364514B1 true EP0364514B1 (fr) | 1991-12-18 |
Family
ID=4206657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89902018A Expired - Lifetime EP0364514B1 (fr) | 1988-04-07 | 1989-02-17 | Agencements pour lapidaires a deux disques |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5317837A (fr) |
| EP (1) | EP0364514B1 (fr) |
| CH (1) | CH684321A5 (fr) |
| WO (1) | WO1989009679A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105904324A (zh) * | 2015-05-28 | 2016-08-31 | 海宁奇晟轴承有限公司 | 一种自动双盘研磨机 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2677291B1 (fr) * | 1991-06-06 | 1995-12-15 | Commissariat Energie Atomique | Machine de polissage a controle de pression. |
| GB9402140D0 (en) * | 1994-02-04 | 1994-03-30 | Actis Uk Limited Grainger Alla | Lapping machine |
| JPH08257902A (ja) * | 1995-03-28 | 1996-10-08 | Ebara Corp | ポリッシング装置 |
| US5632669A (en) * | 1995-05-26 | 1997-05-27 | Censtor Corporation | Interactive method for lapping transducers |
| US5653624A (en) * | 1995-09-13 | 1997-08-05 | Ebara Corporation | Polishing apparatus with swinging structures |
| USRE38340E1 (en) * | 1996-11-04 | 2003-12-02 | Seagate Technology Llc | Multi-point bending of bars during fabrication of magnetic recording heads |
| US5951371A (en) * | 1996-11-04 | 1999-09-14 | Seagate Technology, Inc. | Multi-point bending of bars during fabrication of magnetic recording heads |
| US6475064B2 (en) | 1996-12-13 | 2002-11-05 | Seagate Technology Llc | Multipoint bending apparatus for lapping heads of a data storage device |
| US6287170B1 (en) | 1996-12-13 | 2001-09-11 | Seagate Technology Llc | Multipoint bending apparatus for lapping heads of a data storage device |
| TW377467B (en) * | 1997-04-22 | 1999-12-21 | Sony Corp | Polishing system, polishing method, polishing pad, and method of forming polishing pad |
| JPH11207608A (ja) * | 1998-01-22 | 1999-08-03 | Speedfam Co Ltd | 平面研磨装置における上定盤昇降機構 |
| US6217425B1 (en) * | 1998-06-12 | 2001-04-17 | Tdk Corporation | Apparatus and method for lapping magnetic heads |
| US6083082A (en) * | 1999-08-30 | 2000-07-04 | Lam Research Corporation | Spindle assembly for force controlled polishing |
| ITTV20020049A1 (it) * | 2002-04-22 | 2003-10-22 | Luca Toncelli | Struttura di sostegno del mandrino in una macchina utensile e procedimento per la sua realizzazione |
| CN102380800A (zh) * | 2010-09-06 | 2012-03-21 | 无锡瑞茂光电科技有限公司 | 连体式主轴编码器 |
| CN113211212A (zh) * | 2021-05-08 | 2021-08-06 | 万冬冬 | 一种用于基层墙面校平便于粉刷石膏砂浆涂刷的辅助装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1377119A (en) * | 1920-03-15 | 1921-05-03 | Pike Mfg Company | Machine for shaping sharpening-stones |
| US1843300A (en) * | 1929-03-25 | 1932-02-02 | Norton Co | Lapping machine |
| US2238859A (en) * | 1939-09-15 | 1941-04-15 | Norton Co | Lapping machine |
| US2603041A (en) * | 1945-09-27 | 1952-07-15 | Alfred J Bowen | Surface grinder |
| US2840957A (en) * | 1957-06-07 | 1958-07-01 | Walter J Warden | Lapping device |
| CH412612A (de) * | 1964-07-29 | 1966-04-30 | Kunz Beck Emil | Schleifmaschine |
| US3461617A (en) * | 1965-08-18 | 1969-08-19 | Miles Machinery Co | Methods and apparatus for lapping workpieces |
| JPS603948B2 (ja) * | 1975-09-16 | 1985-01-31 | 日本電信電話株式会社 | 研摩装置 |
| US4315383A (en) * | 1980-05-13 | 1982-02-16 | Spitfire Tool & Machine, Co. Inc. | Inner gear drive for abrading machines |
| US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
| NL8301700A (nl) * | 1982-05-18 | 1983-12-16 | Mueller Georg Nuernberg | Slijpwerkwijze en inrichting voor het uitvoeren van de werkwijze alsmede bewerking van werkstukken uit bros-brokkelige materialen. |
| JPS6034266A (ja) * | 1983-08-08 | 1985-02-21 | Toshiba Corp | 研磨方法 |
| DE3520713A1 (de) * | 1985-06-10 | 1986-12-11 | Fa. Peter Wolters, 2370 Rendsburg | Steuervorrichtung fuer den bearbeitungsdruck an laepp-, hon- und poliermaschinen |
| US4837982A (en) * | 1987-12-02 | 1989-06-13 | Kwik-Way Manufacturing Corporation | Control circuit for a honing machine |
-
1988
- 1988-04-07 CH CH1277/88A patent/CH684321A5/de not_active IP Right Cessation
-
1989
- 1989-02-17 EP EP89902018A patent/EP0364514B1/fr not_active Expired - Lifetime
- 1989-02-17 US US07/849,001 patent/US5317837A/en not_active Expired - Fee Related
- 1989-02-17 WO PCT/CH1989/000030 patent/WO1989009679A1/fr not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105904324A (zh) * | 2015-05-28 | 2016-08-31 | 海宁奇晟轴承有限公司 | 一种自动双盘研磨机 |
| CN105904324B (zh) * | 2015-05-28 | 2017-11-03 | 海宁奇晟轴承有限公司 | 一种自动双盘研磨机 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1989009679A1 (fr) | 1989-10-19 |
| EP0364514A1 (fr) | 1990-04-25 |
| US5317837A (en) | 1994-06-07 |
| CH684321A5 (de) | 1994-08-31 |
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