EP0409257A3 - Low-melting point glass sealed semiconductor device and method of manufacturing the same - Google Patents

Low-melting point glass sealed semiconductor device and method of manufacturing the same Download PDF

Info

Publication number
EP0409257A3
EP0409257A3 EP19900113946 EP90113946A EP0409257A3 EP 0409257 A3 EP0409257 A3 EP 0409257A3 EP 19900113946 EP19900113946 EP 19900113946 EP 90113946 A EP90113946 A EP 90113946A EP 0409257 A3 EP0409257 A3 EP 0409257A3
Authority
EP
European Patent Office
Prior art keywords
manufacturing
semiconductor device
low
melting point
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900113946
Other languages
English (en)
Other versions
EP0409257A2 (fr
Inventor
Masamitsu Intellectual Property Division Yahata
Noriyoshi Intellectual Property Division Tozawa
Toshiki Intellectual Property Division Tsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2187753A external-priority patent/JPH0793387B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP0409257A2 publication Critical patent/EP0409257A2/fr
Publication of EP0409257A3 publication Critical patent/EP0409257A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
EP19900113946 1989-07-21 1990-07-20 Low-melting point glass sealed semiconductor device and method of manufacturing the same Withdrawn EP0409257A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18929489 1989-07-21
JP189294/89 1989-07-21
JP187753/90 1990-07-16
JP2187753A JPH0793387B2 (ja) 1989-07-21 1990-07-16 気密封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
EP0409257A2 EP0409257A2 (fr) 1991-01-23
EP0409257A3 true EP0409257A3 (en) 1991-04-03

Family

ID=26504537

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900113946 Withdrawn EP0409257A3 (en) 1989-07-21 1990-07-20 Low-melting point glass sealed semiconductor device and method of manufacturing the same

Country Status (1)

Country Link
EP (1) EP0409257A3 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0907965A1 (fr) * 1996-06-28 1999-04-14 Siemens Aktiengesellschaft Boitier de composant pour monter en surface un composant a semiconducteur

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2084399A (en) * 1980-10-01 1982-04-07 Hitachi Ltd Mounting a semiconductor device
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
WO1988003704A1 (fr) * 1986-11-13 1988-05-19 M & T Chemicals, Inc. Fixation d'un de de semiconducteur a un cadre de montage a conducteurs au moyen d'une resine adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
GB2084399A (en) * 1980-10-01 1982-04-07 Hitachi Ltd Mounting a semiconductor device
WO1988003704A1 (fr) * 1986-11-13 1988-05-19 M & T Chemicals, Inc. Fixation d'un de de semiconducteur a un cadre de montage a conducteurs au moyen d'une resine adhesive

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, vol. 65, no. 3, March 1982, pages 149-153, Columbus, US; M. WITTMER et al.: "Mechanical properties of liquid-phase-bonded copper-ceramic substrates" *

Also Published As

Publication number Publication date
EP0409257A2 (fr) 1991-01-23

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