EP0493191A1 - Last für eine Mikrowellen-Streifenleitung auf einem dielektrischen Substrat - Google Patents

Last für eine Mikrowellen-Streifenleitung auf einem dielektrischen Substrat Download PDF

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Publication number
EP0493191A1
EP0493191A1 EP91403423A EP91403423A EP0493191A1 EP 0493191 A1 EP0493191 A1 EP 0493191A1 EP 91403423 A EP91403423 A EP 91403423A EP 91403423 A EP91403423 A EP 91403423A EP 0493191 A1 EP0493191 A1 EP 0493191A1
Authority
EP
European Patent Office
Prior art keywords
load
triplate
dielectric
metallized
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP91403423A
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English (en)
French (fr)
Inventor
Xavier Delestre
Thierry Dousset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of EP0493191A1 publication Critical patent/EP0493191A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/24—Terminating devices
    • H01P1/26—Dissipative terminations
    • H01P1/268—Strip line terminations

Definitions

  • the present invention relates to a load for microwave three-plate line with dielectric substrate.
  • Microwave energy distribution circuits are for example used to hold network antennas. Such distribution circuits have one input and N outputs, and are generally made in triplate technology.
  • One of the possible solutions for making these distribution circuits comprises N-1 hybrid rings inserted in meandering lines (in order to compact these circuits). The decoupled output of each hybrid ring is connected to a suitable load.
  • the antenna comprises a large number of radiating elements (elementary antennas)
  • the number N is high, and the distribution circuit therefore comprises a large number of charges.
  • this distribution circuit is often assembled mechanically, for example by bonding with other circuits of equivalent dimensions, themselves made up of several superposed layers of dielectric material, metallized or not.
  • the fillers In order to be able to reduce the external dimensions of the distribution circuit, it is necessary, in particular, for the adapted loads to be themselves of reduced dimensions, in occupied surface area and also in thickness. More precisely, in order to be able to insert the distribution circuit inside a multilayer structure, the fillers must be completely integrated into the thickness of the triplate circuit, since local excess thicknesses are incompatible with bonding.
  • Another solution would consist in carrying out each charge using a series resistance obtained by etching a thin resistive layer disposed between the dielectric material and the metallization of the substrate.
  • a third solution would be to form the series resistance by screen printing. the resistive material, which is initially in the form of ink, being polymerized after its deposition on the circuit.
  • the resistive material which is initially in the form of ink, being polymerized after its deposition on the circuit.
  • one end of the series resistor is connected to the ground planes of the three-ply structure using metallized holes.
  • the second solution can only be used for circuits of reduced dimensions or stiffened using a metal sole due to the brittleness of the resistive layer currently available, which risks presenting microruptures.
  • the third solution cannot be implemented in a triplate circuit which if the resistive deposit has reproducible characteristics and stable over time, which is very difficult to achieve.
  • the subject of the present invention is a load for a dielectric triplate line, which is of reduced dimensions, entirely integrated into the thickness of the triplate circuit and of simple and economical construction.
  • the load according to the invention comprises a resonant cavity formed in the thickness of at least one of the dielectric substrates of the triplate, excited by the end of the triplate line to which it is connected, and filled at least partially with 'an absorbent material.
  • the invention is described below with reference to a microwave distribution circuit load, but it is understood that it is not limited to such an application, and that it can be implemented in any three-plate structure .
  • the three-ply structure 1 in which the filler 2 of the invention is formed essentially comprises a lower dielectric substrate 3 and an upper dielectric substrate 4.
  • the substrate 3 is metallized on its lower face 5, and the upper substrate 4 is metallized on its face upper 6.
  • the central conductors of the triplate structure are formed for example on the upper face of the lower substrate 3.
  • the end 7 of one of these conductors has been shown in the drawing, to which the load 2 must be connected.
  • the substrates 3 and 4 are assembled mechanically by gluing.
  • metallized holes 10 are practiced there. These holes 10 pass through the entire triplate structure, and connect the lower metallized surface 5 to the upper metallized face 6. These holes 10 are for example arranged on a circle such as the circle 11 shown in FIG. 1, an opening 12 being formed in this circle around the end of the line 7 to form the entrance to the cavity 9. Additional metallized holes 13 delimit the opening 12.
  • the metallized holes 10 are for example equidistant and spaced by a distance D of less than 1/4 wavelength.
  • the line end 7 penetrates at least a little into the cavity 9 (delimited by the circle 11 of metallized holes), for example by at least the half-radius of the circle 11, and preferably at least up to the center of the circle 11.
  • the line end 7 is connected to the lower metallized face 5 by a metallized hole 14, thus forming an excitation loop (current loop) of the cavity 9.
  • the end of line 7 is not necessarily connected to a ground plane (5 or 6).
  • a hole 15 is made in the substrate 4, inside the circle 11, which is for example circular and concentric with the circle 11 and of diameter less than that of the circle 11, this hole being for example made throughout the thickness of the substrate 4.
  • This hole 15 is filled with an absorbent material 16.
  • This material 16 is chosen so as to present significant dielectric losses at the wavelength used.
  • this material 16 comprises a mixture of dielectric material and metallic particles. According to an exemplary embodiment, it is composed of epoxy resin and iron powder. It can be machined in the form of a pellet of the same thickness as the dielectric layer 4, and inserted in the hole 15, or it can be directly molded in the hole 15, then leveled to the level of the metallization 6.
  • the metallized hole 14 can be made in the substrate 4, and the hole 15 in the substrate 3, or even, the hole for the absorbent material can be made in the two substrates 3 and 4, a "bridge" of substrate 3 or 4 remaining to support the end of line 7, and, if necessary, to form the metallized hole 14.
  • the ground plane of the layer 5 (and / or of the layer 6) is reconstituted using additional metallization 17 covering the holes 10 and 13, by performing preferably a recharge, localized or not, of electrolytic copper.
  • the dimensions of the cavity 9, the number of holes 10 which delimit it, the dimensions and characteristics of the absorbent material 16, are determined as a function of the frequency of use, the power to be dissipated, and the dielectric constant of the substrates 3 and 4.

Landscapes

  • Waveguides (AREA)
EP91403423A 1990-12-27 1991-12-17 Last für eine Mikrowellen-Streifenleitung auf einem dielektrischen Substrat Withdrawn EP0493191A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9016329A FR2671232B1 (fr) 1990-12-27 1990-12-27 Charge pour ligne triplaque hyperfrequences a substrat dielectrique.
FR9016329 1990-12-27

Publications (1)

Publication Number Publication Date
EP0493191A1 true EP0493191A1 (de) 1992-07-01

Family

ID=9403712

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91403423A Withdrawn EP0493191A1 (de) 1990-12-27 1991-12-17 Last für eine Mikrowellen-Streifenleitung auf einem dielektrischen Substrat

Country Status (3)

Country Link
US (1) US5208561A (de)
EP (1) EP0493191A1 (de)
FR (1) FR2671232B1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5404145A (en) * 1993-08-24 1995-04-04 Raytheon Company Patch coupled aperature array antenna
JP3684239B2 (ja) 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
US5831491A (en) * 1996-08-23 1998-11-03 Motorola, Inc. High power broadband termination for k-band amplifier combiners
FR2790228B1 (fr) 1999-02-26 2001-05-11 Thomson Csf Dispositif de commande d'un systeme de regulation d'allure pour vehicule automobile
FR2798196B1 (fr) 1999-09-07 2001-11-30 Thomson Csf Procede et dispositif pour l'alignement d'un radar automobile
DE10213766B4 (de) * 2002-03-27 2017-01-12 Tesat-Spacecom Gmbh & Co.Kg Mikrowellenresonator
JP4015938B2 (ja) * 2002-12-16 2007-11-28 Ｔｄｋ株式会社 共振器
US7378925B2 (en) * 2003-02-24 2008-05-27 Nec Corporation Dielectric resonator, dielectric resonator frequency adjusting method, and dielectric resonator integrated circuit
DE112004002400T5 (de) * 2003-12-05 2008-03-13 K-2 Corp., Vashon Gleitbrett mit Schwingung absorbierender Schicht
US6956446B2 (en) * 2003-12-18 2005-10-18 Renaissance Electronics Corporation Nonreciprocal device having heat transmission arrangement
US7492146B2 (en) * 2005-05-16 2009-02-17 Teradyne, Inc. Impedance controlled via structure
JP2008262989A (ja) * 2007-04-10 2008-10-30 Toshiba Corp 高周波回路基板
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
US8207796B2 (en) * 2009-10-20 2012-06-26 Delphi Technologies, Inc. Stripline termination circuit having resonators
JP6115305B2 (ja) * 2013-05-20 2017-04-19 三菱電機株式会社 終端器
US11043727B2 (en) * 2019-01-15 2021-06-22 Raytheon Company Substrate integrated waveguide monopulse and antenna system
US11737207B2 (en) 2020-03-09 2023-08-22 Marvell Asia Pte, Ltd. PCB RF noise grounding for shielded high-speed interface cable
WO2021188784A1 (en) * 2020-03-18 2021-09-23 Marvell Asia Pte, Ltd. On-board integrated enclosure for electromagnetic compatibility shielding

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2399930A (en) * 1942-05-16 1946-05-07 Gen Electric Energy dissipator
GB879826A (en) * 1960-07-28 1961-10-11 Standard Telephones Cables Ltd Improvements in electrical high frequency strip transmission line arrangements
US3509495A (en) * 1966-12-01 1970-04-28 Raytheon Co Strip transmission line termination device
US3654573A (en) * 1970-06-29 1972-04-04 Bell Telephone Labor Inc Microwave transmission line termination
US3678417A (en) * 1971-07-14 1972-07-18 Collins Radio Co Planar r. f. load resistor for microstrip or stripline
DE2813586A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Abschlusswiderstand fuer microstripleitungen
US4197545A (en) * 1978-01-16 1980-04-08 Sanders Associates, Inc. Stripline slot antenna
EP0040567A1 (de) * 1980-05-20 1981-11-25 Thomson-Csf Widerstandselement in Mikrostreifenleitungstechnik

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209284A (en) * 1963-06-05 1965-09-28 Charles O Hast Termination for strip transmission lines
US3974462A (en) * 1972-03-07 1976-08-10 Raytheon Company Stripline load for airborne antenna system
SE426894B (sv) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
JPS5877304A (ja) * 1981-11-02 1983-05-10 Mitsubishi Electric Corp トリプレ−ト線路形マイクロ波回路
JPS5894202A (ja) * 1981-11-28 1983-06-04 Mitsubishi Electric Corp マイクロ波回路
JPS6271305A (ja) * 1985-09-24 1987-04-02 Murata Mfg Co Ltd 誘電体共振器
JP2521764B2 (ja) * 1987-07-02 1996-08-07 北海道曹達株式会社 低分子化キトサンの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2399930A (en) * 1942-05-16 1946-05-07 Gen Electric Energy dissipator
GB879826A (en) * 1960-07-28 1961-10-11 Standard Telephones Cables Ltd Improvements in electrical high frequency strip transmission line arrangements
US3509495A (en) * 1966-12-01 1970-04-28 Raytheon Co Strip transmission line termination device
US3654573A (en) * 1970-06-29 1972-04-04 Bell Telephone Labor Inc Microwave transmission line termination
US3678417A (en) * 1971-07-14 1972-07-18 Collins Radio Co Planar r. f. load resistor for microstrip or stripline
US4197545A (en) * 1978-01-16 1980-04-08 Sanders Associates, Inc. Stripline slot antenna
DE2813586A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Abschlusswiderstand fuer microstripleitungen
EP0040567A1 (de) * 1980-05-20 1981-11-25 Thomson-Csf Widerstandselement in Mikrostreifenleitungstechnik

Also Published As

Publication number Publication date
US5208561A (en) 1993-05-04
FR2671232A1 (fr) 1992-07-03
FR2671232B1 (fr) 1993-07-30

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