EP0650657A1 - Behandlung von substraten. - Google Patents

Behandlung von substraten.

Info

Publication number
EP0650657A1
EP0650657A1 EP93914877A EP93914877A EP0650657A1 EP 0650657 A1 EP0650657 A1 EP 0650657A1 EP 93914877 A EP93914877 A EP 93914877A EP 93914877 A EP93914877 A EP 93914877A EP 0650657 A1 EP0650657 A1 EP 0650657A1
Authority
EP
European Patent Office
Prior art keywords
substrate
resist
water
emulsified
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP93914877A
Other languages
English (en)
French (fr)
Inventor
Wrenford John Thatcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coates Brothers and Co Ltd
Original Assignee
Coates Brothers and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coates Brothers and Co Ltd filed Critical Coates Brothers and Co Ltd
Publication of EP0650657A1 publication Critical patent/EP0650657A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Definitions

  • This invention is concerned with improvements in and relating to the treatment of substrates.
  • the invention is particularly concerned with the use of curable coating compositions especially, but not exclusively, for use in the manufacture of printed circuit boards and the like.
  • Curable compositions are widely used in the electronics industry, in the manufacture of printed circuit boards and the like, as so-called "resists", that is compositions which are applied in patterned form to a substrate to facilitate and define the area of operation of, subsequent processes such as plating, etching, the application of solder etc.
  • the composition may be applied to the substrate in patterned form by a suitable printing process, especially a screen printing process, and then cured on the substrate.
  • Photocurable compositions generally comprise a photocurable material, that is a material capable of curing or polymerising upon exposure to the electromagnetic radiation, typically an ethylenically unsaturated or polyethylenically unsaturated material. Where, as is most common, curing is designed to be effected by exposure to ultraviolet light, the composition will also generally comprise a photosensitizer or photoinitiator, for initiating curing or polymerisation of the photosensitive material.
  • the substrates upon which printed circuits were formed were relatively rigid, e.g. took the form of phenolic laminate boards.
  • flexible substrates such as those made of polyimide resins.
  • the latter when cured, should, to some extent, be flexible. It has been proposed to improve the flexibility of cured resins by including a flexibilising material in the resist formulation.
  • a flexibilising component may be readily and effectively included in a coating composition, such as a resist composition, in the form of an emulsion or dispersion of the material in water, which water also serves as a carrier for the curable component of the composition.
  • a coating composition such as a resist composition
  • water which water also serves as a carrier for the curable component of the composition.
  • the patterned resist image is formed from a liquid coating composition
  • a liquid coating composition comprising:
  • a flexibilising agent comprising an elastomeric polymer (or precursor therefor) , dispersed or emulsified in the water.
  • the patterned resist image is formed from a liquid photocurable composition by the steps of: (a) forming a layer of the composition upon the substrate,
  • dispersing we intend to refer to discrete solid particles of a water-insoluble material suspended in the water with, or without, the aid of a dispersing agent. Typically such particles may have a particle size of from 0.1 to 20 ⁇ m, more preferably 0.15 to 5 ⁇ m.
  • emulsified as used herein we intend to refer to emulsions of water-imiscible liquid materials in the water, which liquid may comprise a resinous material (e.g. curable material or flexibilising agent) itself or a solution thereof in a water-immiscible solvent.
  • the curable component of the compositions used in accordance with the invention may be any film-forming curable material but is preferably a photocurable material.
  • the liquid carrier comprises or consists of water.
  • the first method can be simply carried out by mixing a suspension, e.g. a colloidal suspension, of the flexibilising agent into the aqueous phase of the composition (commonly in the form of a dispersion or emulsion of the film-forming curable resin) or by dissolving the flexibilising agent in a suitable water-immiscible solvent and emulsifying this solution with water and adding the emulsion to the composition.
  • a thermoplastic flexibilising agent may be melted, emulsified in molten form and the resultant emulsion then mixed into the composition once it has cooled and solidifed.
  • the second method in situ formation of the flexibilising agent, generally allows for a greater range of possibilities for producing the emulsified or dispersed flexibilising agent.
  • a moisture-curing material can be used which will cure, once the material has been emulsified, under the influence of the aqueous phase of the composition.
  • a two-pack flexibilising agent typically comprising an oligomeric precursor together with a separate curing catalyst
  • a one-pack-heat curing flexibilising agent can also be emulsified and heated to give cured flexibilising agent particles in this way.
  • a solid suspension of a flexibilising agent by mixing two or more reactive oligomers together and emulsifying the mixture before reaction renders the composition solid.
  • a flexibilising agent which is capable of reacting with polymeric curable material in the composition may also be emulsified and mixed into the composition to give a flexibilised material during the course of processing of the composition.
  • pre-formed solid flexibilising agents include aqueous dispersions of elastomeric materials such as an aqueous dispersion of polychloroprene sold under the trade name Neoprene 115 (DuPont) .
  • solutions of pre-formed elastomeric materials such as Neoprene AC or Neoprene D
  • suitable water-immiscible solvents such as toluene, xylene, or carbitol
  • SR 98 sold by General Electric Company
  • An example of a solid flexibilising agent which may be first melted and then dispersed when hot is a polybutylene rubber sold under the trademark polybutene-H1900 (Amoco Chemical Company) .
  • moisture-curing flexibilisers which have proved suitable include moisture-curing silicone rubber such as that sold under the trade designation T84 (Wacker Chemicals) and a moisture-curing silicone sold under the trade name Dow Corning 1200.
  • Two-pack flexibilisers which can be used may be either ambient temperature or high temperature curing systems.
  • the former include the product sold under the trade Neoprene AF, a copolymer of chloroprene with methacrylic acid which is mixed with a metal oxide to induce cross-linking; the products sold under the trade names RTV 615 and RTV 41 (GEC) which are both silicone rubber compositions and the product RTV 6166 (GEC) which is silicone dielectric gel.
  • thermally curing two-pack systems examples include solvent free silicone resins whose cure is accelerated using metal salts such as sold under the trade name Triplus 177 and 178 (GEC) , a silicone-based adhesive cured using benzyl peroxide such as sold under the trade name PSA 529 (GEC) , or the polychloroprene product Neoprene AD which may be cured using magnesium oxide.
  • One-pack thermally curing flexibilising agents include the silicone material sold under the trade designations-SR 224 (GEC) which is a silicone insulating varnish and those sold under the trade designations ECC 440 and ECC 450 (GEC) which are elastomeric silicone materials.
  • thermally curing flexibilising agents may be cured before inclusion in the final coating composition or, where the subsequent processing conditions of the composition are appropriate, curing of the flexibilising agent may take place during processing of the composition. It is also possible to separately emulsify a thermally curing flexibiliser precursor and catalyst therefor so that cross-linking does not occur until the composition is dried and the two materials are mixed.
  • a suspension of a solid flexibilising agent can also be produced by mixing two or more reactive oligomeric precursors prior to emulsification and then converting the " liquid or semi-solid mixture to a flexibilising solid material by a chain extension or cross-linking reaction.
  • Materials which have a low reactivity with, or solubility in, water are preferably used in order to ensure the desired degree of reaction within the organic phase, but it is possible to use water-reactive materials providing that they have a relatively low miscibility with water and that their reactivity with the other organic components is higher than that with water. This can be attained by judicious use of catalysts.
  • polyurethane elastomer emulsions can be obtained by dispersing castor oil or polyester mixed with di- and polyisocyanates; epoxidised rubber materials can be cross-linked with reactive polyamides or acid functional resin.
  • Flexibilising agents which can be emulsified and which may then react with the curable resin of the coating to become chemically bonded into the final film include a photoreactive polyisoprene sold under the trade Waycoat (Olin-Hunt Speciality Products Inc.); a monoepoxidised polybutene (sold under the designation E23 (Amoco Chemicals) or an epoxidised bis-phenol-A and rubber modified linseed oil/fatty acid material sold under the trade name XZ 86709 (Dow Chemicals Ltd) .
  • the flexibilising agent suitably forms from 5 to 40% by weight, preferably from 10 to 25% by weight of the total solids in the composition.
  • one general class of photocurable system comprises a curable reactive material (generally oligomeric or polymeric in nature) together with an initiator component which on exposure to the appropriate radiation, reacts with the curable component thereby to cross-link it or cure it.
  • a curable reactive material generally oligomeric or polymeric in nature
  • an initiator component which on exposure to the appropriate radiation, reacts with the curable component thereby to cross-link it or cure it.
  • a particular embodiment of this sort of photocurable system comprises polyvinyl alcohol as curable component together with a diazo initiator.
  • photocurable system which is also particularly suitable for use for compositions taking the form of suspensions or dispersions of solid powdered photocurable material, comprises an ethylenically unsaturated curable material (again generally oligomeric or polymeric in nature) together with a photoinitiator which, on exposure to the appropriate radiation, gives rise to free radicals which initiate polymerisation of the double bonds in the curable component.
  • photocurable materials which may be used in this second general class of photocurable systems include include multifunctional acrylate oligomers such as pentaerythritol triacrylate, trimethylolpropane triacrylate and ethylene glycol polyacrylate.
  • photosensitive materials are those which may be obtained by reacting multifunctional isocyanate compounds with ethylenically unsaturated compounds containing a group containing an active hydrogen atom such as a hydroxyl group or carboxylic acid group.
  • ethylenically unsaturated compounds containing a group containing an active hydrogen atom such as a hydroxyl group or carboxylic acid group.
  • suitable isocyanates include hexamethylene di-isocyanate, tolylene di-isocyanate or isophorone di-isocyanate, or di ers or trimers formed therefrom.
  • Suitable unsaturated compounds containing active hydrogen include, for example, hydroxyl-ethyl acrylate, hydroxyethyl methacrylate, acrylic acid and methacrylic acid.
  • a further class of UV sensitive curable materials are those formed by the reaction of poly-epoxy compounds (so-called “epoxy resins”) with ethylenically unsaturated acids such as acrylic acid or methacrylic acid; which reaction products may simply be termed “epoxy acrylates”.
  • the epoxy compound may be a simple glycidyl ether such as ethylene glycol diglycidyl ether or phenyl glycidyl ether; or a bis-phenol A/epichlorohydrin adduct such as those sold under the trade name "EPI OTE".
  • epoxy resins which may be employed are epoxy novolak resins (including epoxy phenyl novolak and epoxy cresol novolak resins) such as those sold under the trade name "QUATREX".
  • epoxy novolak resins including epoxy phenyl novolak and epoxy cresol novolak resins
  • the "epoxy acrylates” derived from such resins are particularly suitable for use as components in photoresists for preparing solder masks.
  • the epoxy acrylate resin may be reacted with one or more dicarboxylic acid anhydrides (serving to introduce free carboxyl groups into the final epoxy acrylate) .
  • dicarboxylic acid anhydrides for this purpose include succinic, itaconic, maleic and phthalic anhydrides.
  • photoinitiators are known for use in photocurable systems and examples of these include anthraquinones such 2-ethyl-anthraquinone, 2-methyl- anthraquinone and 1-chloro-anthraquinone; thioxanthones such as 2,4-dimethyl-thioxanthones, 2,4-diethyl- thioxanthones and 2-chloro-thioxanthones; ketals such as benzyl-dimethyl ketal and acetophenone-dimethyl-ketyl, benzophenones, and benzoin and ethers thereof.
  • photoinitiators can be alone or in admixture and may also be used together with photopolymerization accelerators such as benzoic acid type accelerators or tertiary amine accelerators.
  • the photocurable material may also contain other components such as inorganic fillers, pigments, rheological additives (flow aids and degassing agents) and thermal curing agents and surfactants.
  • Surfactants or thickening agents may serve to assist in suspending the particulate material in the composition.
  • Suitable surfactants include nonionic surfactants such as those sold under the trade names Synperonic PE/F 108, Pluronic 6800 and Disponsil 23.
  • Suitable thickeners include acrylic polymers such as Acrysol RM 8 (Rohm & Haas) and FX1010 (Servo Delden B.V.) .
  • Photocurable compositions in accordance with the invention may be employed simply as photocurable coating materials or, as indicated above, find particular application as photoresist materials for use in the electronics industry, for example in the formation or production of printed circuit boards or the like.
  • the photocurable compositions of the invention are particularly suitable for use in a method of forming a patterned image upon a substrate which method comprises the steps of:
  • the patterned layers or resists obtained by the above route may be used, as indicated above, as lithographic resists, plating resists, etch resists or solder masks.
  • the liquid photocurable composition may be applied to the substrate by any suitable coating method such as, for example, by screen printing, curtain coating or, electrostatic spraying.
  • the thickness of the resist layer will, of course, depend upon the intended end use but, in general, thicknesses of the order of 5 - 60 ⁇ m are generally suitable.
  • a carboxylated epoxy cresol novolak acrylate was prepared by reacting an epoxy cresol novolak resin (Quatrex 3710, Dow Chemical Co.) (1 equivalent) with one equivalent of acrylic acid in ethyl ethoxy propionate solvent. The resultant acrylated resin was then adducted with a 50:50 mixture of maleic anhydride and tetrahydrophthalic anhydride sufficient to give an acid value of 70 mg/g KOH at the end of reaction. This material was then included in the following ink formulation: % carboxylated epoxy novolak acrylate 57
  • IRGACURE 907 (Ciba-Geigy) 4
  • Neoprene 115 15 This mixture was then screen printed onto an IPC solder resist test panel on polyimide flexible laminate. The film produced was dried at 90°C for 30 minutes to give a smooth, tack-free film. The resist film was then imaged, through suitable artwork, and that image developed using 0.6% w/w sodium carbonate solution. The film was then given a final bake of one hour at 150°C to yield a coating which displayed excellent adhesion to both copper tracks and polyimide substrate and resistance to creasing (i.e. it did not crack when bent over a 1 mm diameter mandrel) . It also showed good solder and solvent resistance properties.
  • Example 1 The basic ink emulsion produced in Example 1 (before addition of the Neoprene 115) was taken and T-84 (a moisture curing silicone rubber material (Wacker Chemicals) poured into it under high speed stirring in the ratio of 4 parts ink emulsion to 1 part of T-84.
  • T-84 a moisture curing silicone rubber material (Wacker Chemicals) poured into it under high speed stirring in the ratio of 4 parts ink emulsion to 1 part of T-84.
  • the material dispersed well to give a yellow green emulsion, which was draw down bar coated onto an etched copper printed circuit board on polyimide flexible laminate.
  • the film was dried at 90°C for 30 minutes, exposed through suitable artwork and developed in 0.6% w/w sodium carbonate solution.
  • the imaged film was then given a post bake of one-and-a-half hours at 140°C.
  • the resulting film showed excellent solder, crease and solvent resistance and showed excellent resistance to ten day thermal shock testing (coating is subject
  • This mixture was then emulsified using a Silverson high speed stirrer in the following formulation.
  • a thermal curing agent dispersion for use with the ink emulsion was manufactured by mixing the following materials.
  • the mixture was emulsified in the following formulation:
  • a two-pack thermally curing silicone rubber compound (RTV 615 and catalyst, GEC) was emulsified in its mixed state in the following formulation.
  • Example III The procedure of Example III was followed but the silicone rubber and cure catalyst were emulsified separately in the following formulation.
  • a solid carboxylated epoxy cresol novolak was prepared by reacting one equivalent of acrylic acid with one equivalent of epoxy cresol novolak (Quatrex 3410, Dow Chemicals) dissolved in toluene. Once acrylated the resin was carboxylated using maleic and tetrahydrophthalic anhydrides (in a 1:1 ratio) and the solvent was vacuum stripped to yield a solid resin with a melting point of between 95°-100°C and an acid value of 65 mg/gKOH.
  • This resin was crushed and powdered and mixed in the following formulation.
  • the cure catalyst was made up as follows:
  • Dicyandiamide 20 This mixture was mixed into a homogenous solid, using a heated twin screw extruder, which was then ground to around 25 micron particle size using a blade grinder. The resultant green powder was then added to a solution of surfactant, thickener and humectant in distilled water following the formulation:
  • the slurry was then ball milled for 12 hours to produce a suspension with solid particle size in the area of 5 microns.
  • a solid cross-linking agent was then prepared by grinding a solid epoxy novolak material (Quatrex 2410, Dow Chemicals) down to a particle size of around 20 microns, suspending this in the formulation shown below and ball milling the slurry to give a stable suspension with particle size substantially below 10 microns.
  • % Epoxy novolak resin 49
  • a flexible material was manufactured by melting a reactive polyamide (Versamid 100, Cray Valley) (2 parts) and mixing with XZ86709, A bis-phenol a epoxy linseed oil modified rubber (3 parts) , the mixture was further heated to make it liquid enough to emulsify. The material was then poured, with high speed stirring into the following formulation to give a stable off-white coloured emulsion.
  • a reactive polyamide Versamid 100, Cray Valley
  • XZ86709 A bis-phenol a epoxy linseed oil modified rubber
  • the original resist formulation was mixed with the cross-linking suspension in the ratio of 1 part cross-linker to 4 parts resist emulsion and to this was added the flexibiliser suspension in the ratio 1 part flexibiliser to 3 parts mixed resist suspension.
  • This mixture was screen printed onto an IPC solder resist test circuit on flexible polyimied laminate, dried at 90°C for 30 minutes, photoimaged through suitable art work, developed in 1% w/w% sodium carbonate solution and post-baked for one and a half hours at 150°C.
  • the resulting solder resist coating showed good resolution of the art work pattern and excellent solder, flex and solvent resistance as well as good adhesion to the substrate.
  • a carboxylated epoxycresol novolak acrylate in ethyl ethoxy propionate was dispersed by high speed stirring on a Silverson stirrer in the following formulation.
  • a flexibilising emulsion for this ink was formulated using Waycoat, a UV sensitive polyisoprene rubber (Olin-Hunt) .
  • the resist emulsion was mixed with the flexibiliser emulsion in the ratio 7:3 by hand and the resulting light blue emulsion was screen printed onto precleaned two ounce copper clad FR4 laminate.
  • the film was dried at 90°C for 15 minutes to produce a homogeneous tack-free film; which was photoimaged through artwork prepared for imaging a negative primary imaging resist.
  • the circuit pattern was developed using 1% w/w sodium carbonate solution and the copper areas not protected by the resist were etched away using acid ferric chloride etchant. Once the circuit had been etched the resist was stripped to give a circuit which was precise reproduction of the art work pattern. During the etch process this formulation showed excellent resistance to the etch solution and good flexibility, none of the resist being chipped away or lost by the pressure of the etchant sprays even on very fine details.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP93914877A 1992-07-14 1993-07-05 Behandlung von substraten. Withdrawn EP0650657A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9214937 1992-07-14
GB9214937A GB2269385A (en) 1992-07-14 1992-07-14 Coating compositions
PCT/GB1993/001400 WO1994001985A1 (en) 1992-07-14 1993-07-05 Treatment of substrates

Publications (1)

Publication Number Publication Date
EP0650657A1 true EP0650657A1 (de) 1995-05-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP93914877A Withdrawn EP0650657A1 (de) 1992-07-14 1993-07-05 Behandlung von substraten.

Country Status (4)

Country Link
EP (1) EP0650657A1 (de)
JP (1) JPH07509322A (de)
GB (1) GB2269385A (de)
WO (1) WO1994001985A1 (de)

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US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
US8272126B2 (en) 2008-04-30 2012-09-25 Panasonic Corporation Method of producing circuit board
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
WO2010064602A1 (ja) * 2008-12-02 2010-06-10 パナソニック電工株式会社 回路基板の製造方法、及び前記製造方法により得られた回路基板
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
WO2011052207A1 (ja) * 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板、及び前記回路基板の製造方法
CN102598883A (zh) 2009-10-30 2012-07-18 松下电器产业株式会社 电路板以及在电路板上安装有元件的半导体装置
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
JP6061449B2 (ja) * 2011-03-31 2017-01-18 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2014143221A (ja) * 2011-05-18 2014-08-07 Panasonic Corp 回路基板の製造方法、並びに、その製造方法で得られる回路基板

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GB9214937D0 (en) 1992-08-26
GB2269385A (en) 1994-02-09
JPH07509322A (ja) 1995-10-12

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